Abstract: An integrated circuit including logic MOS transistors, EPROM cells, and high-voltage MOS transistors. Each EPROM cell includes a floating gate formed from a first polysilicon level above a tunnel oxide and a control gate formed from a second polysilicon level. Each logic MOS transistor includes a gate formed from a portion of the second polysilicon level above a very thin oxide. Each high-voltage transistor includes a gate corresponding to a portion of the first polysilicon level above a layer of said tunnel oxide, the gate being covered with a portion of the second polysilicon layer, except at locations where a contact is desired to be made with the gate. The uncovered portion of the first polysilicon layer in the high-voltage MOS transistors is coated with a silicon nitride layer.

Abstract: A method of operating a cache memory is described in a system in which a processor is capable of executing a plurality of processes, each process including a sequence of instructions. In the method a cache memory is divided into cache partitions, each cache partition having a plurality of addressable storage locations for holding items in the cache memory. A partition indicator is allocated to each process identifying which, if any, of said cache partitions is to be used for holding items for use in the execution of that process. When the processor requests an item from main memory during execution of said current process and that item is not held in the cache memory, the item is fetched from main memory and loaded into one of the plurality of addressable storage locations in the identified cache partition.