Abstract: High-density, miniaturized arrays including high surface areas. Arrays described include substrate with a coating of linking agents, as well as arrays with reactants affixed to the substrates. Methods of manufacturing high-density arrays of reactants. The methods include the use of oriented, heat shrink films and elastomeric materials. Methods of functionalizing a substrate with linking agents for subsequent affixation of reactants are also disclosed herein.
Type:
Grant
Filed:
April 7, 1999
Date of Patent:
April 23, 2002
Assignee:
3M Innovative Properties Company
Inventors:
Kurt J. Halverson, Sanjay L. Patil, Jerald K. Rasmussen