Abstract: An embodiment of the present invention provides an electronically tunable dielectric material, comprising at least one electronically tunable dielectric phase and at least one compound of low loss complex perovskites. The at least one electronically tunable dielectric phase may be selected from the group consisting of barium strontium titanate, barium titanate, strontium titanate, barium calcium titanate, barium calcium zirconium titanate, lead titanate, lead zirconium titanate, lead lanthanum zirconium titanate, lead niobate, lead tantalate, potassium strontium niobate, sodium barium niobate/potassium phosphate, potassium niobate, lithium niobate, lithium tantalate, lanthanum tantalate, barium calcium zirconium titanate, sodium nitrate, and combinations thereof. Further, the barium strontium titanate may of the formula BaxSr1-xTiO3, where x is from about 0 to about 1, or more specifically, but not limited in this respect, may also be of the formula BaxSr1-xTiO3, where x may be from about 0.15 to about 0.

Abstract: An embodiment of the present invention provides an apparatus, comprising an RF matching network connected to at least one RF input port and at least one RF output port and including one or more voltage or current controlled variable reactive elements, a voltage detector connected to the at least one RF output port via a variable voltage divider to determine the voltage at the at least one RF output port and provide voltage information to a controller that controls a bias driving circuit which provides bias voltage or bias current to the RF matching network, and wherein the RF matching network is adapted to maximize RF power transferred from the at least one RF input port to the at least one RF output port by varying the voltage or current to the voltage or current controlled variable reactive elements to maximize the RF voltage at the at least one RF output port.

Abstract: An embodiment of the present invention provides a method of mitigating third order inter-modulation distortion in electronic circuits, comprising estimating an IP3 of the circuits using an empirical equation which includes at least one or more of the factors IP3˜IP3o?20 log Q+10 log F+10 log C?17.3 log k dBm and optimizing one or more of the factors such that the third order inter-modulation distortion is mitigated.

Abstract: An embodiment of the present invention provides a phase shifter, comprising a substrate, resistive ink adjacent one surface of said substrate and separating a voltage tunable dielectric material from said surface of said substrate and a plurality of conductors adjacent said voltage tunable dielectric material separated so as to form a gap filled with resistive ink in said gap.

Abstract: An embodiment of the present invention provides an apparatus, comprising an integrated circuit, wherein a first portion of the integrated circuit is placed on a top tier substrate and a second portion of the integrated circuit is placed on a bottom tier substrate stacked adjacent the top tier substrate and wherein the first portion and the second portion of the integrated circuit are interconnected; and printed spiral arms stacked vertically on both the top and bottom surface of the top tier substrate thereby creating high Q inductors.

Abstract: Accordingly, the present invention provides a toolkit for building programmable rules of operation for a prepaid mobile communications unit and for loading the rules into the prepaid mobile unit's internal memory. A rules development language is provided with a predetermined syntax. A rule set is composed of sentences comprising strings of sequential operands terminated by a delimiter operand. Each operand comprises a low-level operator and its corresponding argument. The function of each low-level operator is predefined, with the number of corresponding arguments varying according to the operator type. Once constructed, the rules are compressed and loaded into the internal memory of a prepaid mobile unit and used to determine call restrictions, click rates, surcharges, or otherwise process calls.

Abstract: A micro-electro-mechanical device and method of manufacture therefore with a suspended structure formed from mono-crystalline silicon, bonded to a substrate wafer with an organic adhesive layer serving as support and spacer and the rest of the organic adhesive layer serving as a sacrificial layer, which is removed by a dry etch means. Said substrate wafer may contain integrated circuits for sensing and controlling the device.