Abstract: A memory traffic access controller (18) responsive to a plurality of requests to access a memory. The controller includes circuitry (18d) for associating, for each of the plurality of requests, an initial priority value corresponding to the request. The controller further includes circuitry (18b, 18d, 18e, 18f) for changing the initial priority value for selected ones of the plurality of requests to a different priority value. Lastly, the controller includes circuitry for outputting (18d) a signal to cause access of the memory in response to a request in the plurality of requests having a highest priority value.

Abstract: A method and system for applying a surface treatment to an object. The system comprises: a source chamber (106) for holding a source of surface treatment material (102); a deposition chamber (112) enclosing the object to be treated (104); a recovery chamber (108); a supply of carrier gas (110); conduit (116) connecting the source chamber (106) to the deposition chamber (112) and the deposition chamber (112) to the recovery chamber (108) and for controlling the flow of the carrier gas between the source chamber (106), the deposition chamber (112) and the recovery chamber; and a heater (124) for heating the source chamber (106), the source of surface treatment material (102), the deposition chamber (112), an upper portion (120) of the recovery chamber (108), the carrier gas, and the conduit (116). When heated, the source material (102) evaporates into the carrier gas and is carried to the deposition chamber (112) where is attaches to the surface of the object being treated (104).

Abstract: A method of making a semiconductor device and the device wherein a chip is provided having plural bond pads thereon. A plurality of adjacent wires is provided, each wire having one end thereof coupled to and extending from one of the bond pads. The other end of each wire is coupled to one of a plurality of lead fingers. A mass of hardenable, flowable adhesive having a viscosity in its flowable state sufficient to enable the adhesive to rest on a the wire until hardened, preferably an epoxy, is disposed on adjacent wires and the adhesive is then hardened. Optionally, some of the adhesive is permitted to be disposed on a surface of the chip and beneath a wire and then hardened.