Patents Represented by Attorney Jay Pralle

Find this attorney in the Justia Lawyer Directory

  • Adhesive encapsulating composition and electronic devices made therewith
    Patent number: 8232350
    Abstract: Adhesive encapsulating compositions for use in electronic devices such as organic electroluminescent devices, touch screens, photovoltaic devices, and thin film transistors are disclosed herein. The adhesive encapsulating compositions include pressure sensitive adhesives comprising one or more polyisobutylene resins, in combination with optional multifunctional (meth)acrylate monomers and/or optional tackifiers.
    Type: Grant
    Filed: April 28, 2009
    Date of Patent: July 31, 2012
    Assignee: 3M Innovative Properties Company
    Inventors: Jun Fujita, Nami Kobori, Vivek Bharti, Fred B. McCormick, Serena L. Mollenhauer