Abstract: An exemplary fixture includes a holder, a moving transfer unit, a clamping arm, and a driving unit. The moving transfer unit is located on the holder, and includes a pushing block. The pushing block has a urging element on an upper surface thereof. The clamping arm includes a pivot axis and a slanted surface. The urging element of the pushing block interacts with the slanted surface to rotate the clamping arm along the pivot axis. The driving unit is connected to the pushing block for moving the pushing block of the moving transfer unit.

Abstract: A protective device (10) for protecting thermal interface material (30) spread on a central surface (512) of a bottom of a base (51) of a heat sink (50). The device includes a case (12) and a tab (18) extending from an edge of the case. The heat sink (50) has air channels (552) extending vertically therethrough and around the base. The case comprises an annular frame (120) and a cap (15) protruding downwardly from inside edges of the frame. The cap covers the thermal interface material. The frame is attached to the heat sink around the thermal interface material. The frame blocks portions of the air channels adjacent to the base, thereby to prevent dust or foreign particles from contaminating the thermal interface material through the air channels.

Abstract: A heat dissipation device for removing heat from LED chips includes a heat sink and a plurality of substrates. The heat sink comprises a base plate. A plurality of fins extends upwardly from the base plate. The substrates each have a unidirectional heat transfer and are attached to a bottom face of the heat sink. Each of the substrates defines a first wall on which The LED chips are mounted and a second wall coupled to the heat sink. The substrates only transfer heat from the first wall to the second wall and restrict the heat transfer in a reverse direction. When the LED chips generate heat, the heat is transferred to the fins of the heat sink via the unidirectional substrates to lower temperature of the LED chips.

Abstract: An image capturing device includes a taking lens, an image sensor, an image processing unit, an input device, a processor, and a driving unit for moving the taking lens. The image processing unit is configured for receiving the electrical signals from the image sensor and obtaining image information of each image. The input device is configured for selecting focus areas in a photographing area and setting a focus power of each of the focus areas. The processor is configured for performing an auto-focus process using a base evaluation value of an image of the photographing area, wherein the base evaluation value is calculated by taking the total of multiplying an evaluation value of each of the focus areas and non-focus areas of the photographing area by the focus power corresponding to said each of the focus areas and a focus power corresponding to each of the non-focus areas.

Abstract: A housing assembly (100), used, e.g., in a mobile electronic device (300), includes a housing body (10) and a display unit (20). The housing body defines a display opening (110). The display unit contains electronic ink. The display unit is received in the display opening and is configured for providing information and/or graphics. The housing body moldingly receives the display lens therein, via an injection molding process.

Abstract: A given field emission element includes a carbon nanotube field emission wire and at least one supporting protective layer coating an outer surface of the carbon nanotube field emission wire. The carbon nanotube field emission wire is selected from a group consisting of a carbon nanotube yarn, a wire-shaped CNT-polymer composite, and a wire-shaped CNT-glass composite. A method for manufacturing the described field emission element includes the steps of: (a) providing one carbon nanotube field emission wire; (b) forming one supporting protective layer on an outer surface of the carbon nanotube field emission wire; and (c) cutting the carbon nanotube field emission wire to a predetermined length and treating the carbon nanotube emission wire to form the field emission element.

Abstract: A method for detecting defects in camera modules is provided. The method includes the following: an image is acquired from the camera module; a comparison formula and a standard value of defect luminance are set; the image is divided into many test regions; the corresponding reference regions are then plotted out; a test region is selected, and a reference region is confirmed correspondingly; averages of gray scale values of the selected test region and the confirmed reference region are calculated; a defect luminance of the selected test region is calculated; the calculated defect luminance is compared with the standard value for confirming whether the camera module is of satisfactory quality. A related system is also disclosed.

Abstract: An exemplary clamping apparatus includes a supporting body, a plurality of clamping units installed on the supporting body, a PWM controller, and a detection unit. Each clamping unit includes a magnet, a clamping pin, an electrical coil, and a coil core mechanically engaged with the clamping pin. The magnet is configured for holding the clamping pin at a target position. The PWM controller is configured for supplying a pulse signal to the respective electrical coil of each clamping unit and for thereby creating a magnetic force causing a corresponding coil core and a corresponding clamping pin to, synchronously, move. The detection unit is configured for detecting a back electromotive force representative of the arrival to the target position of a clamping pin and signaling the PWM controller to stop supplying the pulse signal. A clamping process utilizing the clamping apparatus is also provided.

Abstract: An infrared remote control module (10) includes an infrared detecting module (11) configured for receiving optical signals and converting the optical signals into digital signals, a signal processing module (12) communicating with the infrared detecting module; and a controlling feedback module (13) communicating with the signal processing module. The infrared detecting module includes a lens barrel (110), an infrared band-pass filter (112) arranged in the lens barrel, a lens assembly (113) arranged in the lens barrel, an image pickup module (114) arranged in the lens barrel, and a collimator device (116) selectably moveable into or out from the lens barrel. By being moveable in such a fashion, the collimator device is configured for selectively collimating the optical signals, and, thus, the remote control module can be used for shooting or motion-based actions.

Abstract: An exemplary electrophoretic coating method and an electroplated shell (800) manufactured thereby is provided. The electrophoretic coating method includes the following steps. A first step (Step S1) is to mold a base shell (500). The base shell includes a base body (50), a shell body (60), and a connecting body (70). The shell body and the connecting body are molded with the base body. The connecting body connects with the shell body. A second step (Step S2) is to pretreat the shell body and the connecting body. Thus, conducting films are formed on the shell body and connecting body. A third step (Step S3) is to electrophoretically coat the preliminarily treated base shell, so as to form electroplated layers on the shell body. A fourth step (Step S4) is to remove the connecting body so as to form/yield the electroplated shell.

Abstract: A durable housing with a soft surface device (100) includes a substrate (10), an electrophoresis coating (20) formed on a surface of the substrate, an intermediate coating (30) formed on the electrophoresis coating, and a top coating (40) formed on the intermediate coating and configured for protecting the intermediate coating. The electrophoresis coating is made of a first resin paint. The intermediate coating is made of a second resin paint containing an isocyanate polymer and/or reaction products of the isocyanate polymer with hydroxyl groups. The top coating is made of a third resin paint an isocyanate polymer cross-linked to the second resin paint of the intermediate coating.

Abstract: A clip is capable of engaging with a heat sink for securing a fan to the heat sink. The clip includes a mounting plate, a supporting plate, a spring fastener and a spring positioning plate. The supporting plate extends from the mounting plate. The spring fastener extends from the supporting plate and spaced from the mounting plate for pressing the fan toward the heat sink. The spring positioning plate extends from the mounting plate. The mounting plate is horizontally inserted into the heat sink and the spring positioning plate is V-shaped and resiliently engaged in a V-shaped receiving space of the heat sink, thereby securing the clip to the heat sink.

Abstract: An LED lamp includes a first heat sink, a second heat sink and a plurality of LED modules. The second heat sink is located at a lateral side of the first heat sink and pivotally connects with the first heat sink. The LED modules are evenly attached on bottoms of the first and second heat sinks. The second heat sink can be rotated relative to the first heat sink to be fixed at a required position, whereby an illumination angle of the LED lamp can be adjusted. Heat generated by the LED modules is dissipated by the first and second heat sinks.

Abstract: An ink-jet device (20) is provided. The ink-jet device includes an ink reservoir (22), a print head (24), and a carry-in pipe (26) connected between the ink reservoir and the print head. The ink-jet device further includes an air outlet pipe (28) and a balance pipe (30). The air outlet pipe is connected with the print head and intercommunicates with the atmosphere. The balance pipe is connected between the carry-in pipe and the air outlet pipe. A method for eliminating air bubbles in print head is also provided.

Abstract: A foldable electronic device (100) includes a cover (10) having a side barrel (132) and a main body (20) rotatably connected to the cover. The main body includes a body shell (21) accommodating a plurality of electronic components therein, a central barrel (244) formed at one end of the body shell, and an antenna seat (23) attached to an opposite end of the body shell. The side barrel of the cover is located adjacent to the central barrel of the main body.

Abstract: An exemplary method for measuring a distance from a subject to a camera includes the following operations: focusing on the subject using the imaging system; illuminating an area on the subject using auxiliary light; capturing an image of the subject, the image having an illumination portion corresponding to the illuminated area; measuring the area of the illumination portion of the image; and calculating the subject distance based on the measured area.

Abstract: A heat dissipation device (10) includes a first heat sink (20), a second heat sink (30) and a heat pipe (40) transferring heat from the first heat sink to the second heat sink. A bracket (50) includes a first end (51) attached to the first heat sink and a second end (52) attached to the second heat sink.

Abstract: A heat spreader for cooling an electronic component includes a lower plate defining a chamber, an upper plate fixed on the lower plate to seal the chamber, a first wick layer and a second wick layer sandwiched between the lower plate and the upper plate, and a working liquid contained in the chamber. The first wick layer and the second wick layer respectively define a plurality of apertures, which include right-angled triangle, acute-angled triangle, and rhomboid apertures communicating with each other for containing the working liquid therein.

Abstract: An electron beam heating system includes a cathode, an anode, a CNT string and a chamber. The CNT string includes an end portion and an emission portion, and the end portion is contacted with and electrically connected to the cathode. The cathode, the anode and CNT string are arranged in the chamber. The CNT string is composed of a plurality of CNT bundles packed closely, each of the CNT bundles comprises a plurality of CNTs, the CNTs are substantially parallel to each other and are joined by van der Waals attractive force. Electron beams emitted from the emission portion bombard and heat a predetermined point on the anode. The heating efficiency of the electron beam heating system is high.

Abstract: A method for manufacturing a field emission electron source, the method comprising the steps of: preparing a substrate, a carbon nanotubes slurry, and a conductive slurry; applying a conductive slurry layer onto the substrate; applying a layer of carbon nanotubes slurry onto the conductive slurry layer; and solidifying the substrate under a temperature of 300 to 600 degrees centigrade so as to form the field emission electron source.