Abstract: A method for updating power control at a base transceiver station in a communication system is provided. A base transceiver station transmits a signal frame. A mobile station receives the signal frame. The mobile station determines whether the signal frame was accurately received and sets a metric bit in a quality metric. The metric bit indicates whether the signal frame was received correctly by the mobile station. The mobile station transmits the quality metric, which is received by the base transceiver station. It is then determined whether to update power control, the determination based at least in part upon the quality metric.

Abstract: The present invention provides a method of handing-off a remote unit (113) from a first base station (101) to a second base station (102). The remote unit (113) communicates with the first base station (101) and establishes communication with a second base station (102). It is then determined, preferably by the remote unit (113), that the remote unit (113) should hand-off to the second base station (102). An overhead information start time is then determined. The remote unit (102) may determine when the overhead information will be broadcast by the second bast station (102), thereby establishing an overhead information start time. The overhead information start time is the time when overhead information will be transmitted from the second base station (102). The first base station (101) and the second base station (102) may be synchronized to transmit the overhead information at approximately the same time.

Abstract: A communication system employs a method and apparatus for exchanging communicated signals between a communication unit (e.g., 17) and a central site (205). A remote base site (65) or the central site (205) determines whether a signal must be exchanged between the communication unit (17) and the central site (205). When a signal is to be exchanged, the remote base site (65) allocates a first radio frequency communication resource (75) for use in exchanging the signal between the communication unit (17) and the remote base site (65) and a second radio frequency communication resource (74) for use in exchanging the signal between the remote base site (65) and the central site (205).

Abstract: In one embodiment a system is provided for multirate communications allowing for different data rates for each data unit on a channel, including both data units from different mobile units and from the same mobile unit. A sending unit preferably begins by determining the rate at which to start communications, and monitors, for example by use of an RSSI detector, for an indication that the rate should be changed. A rate adjustor implements the change, and can make changes as frequently as every data unit. The encoder applies the appropriate rate and inserts a rate indicator indicative of the data or encoding rate, and sends the data unit. On receiving data units, the receiving unit first determines the rate for each data unit or group of units, then appropriately decodes the data unit(s). As a result, the actual data throughput can be adjusted to permit optimized throughput.

Abstract: The present invention provides for a gain control circuit (10) and method for providing gain control of a variable amplification circuit (16) using a pilot signal. A pilot signal is added to the received signal. The pilot signal has at least a minimum signal level which when added to the signal received insures the sampled input signal has a level above the point where offset or low power errors are experienced. Preferably the pilot signal will be a sinusoidal signal having a frequency within the operational bandwidth of the amplifier (16), but outside the frequency range of the input signal.

Abstract: A method and system for time aligning a frame (60) in a communication network (10) involves the steps of; i) determining if a frame needs to be advanced at a BTS (14), and ii) sending a shortened synchronization pattern from the BSC (12). The BTS (14) then determines if a short or long synchronization pattern has been sent by determining (256) if the received data stream matches a long synchronization pattern and setting a first flag when they do match. If the received data stream does not match the long synchronization pattern and the first flag is set (264), the data stream is compared (266) to the short synchronization pattern. When they match a second flag is set (268).

Abstract: A microelectronic assembly (10), such as a smart card, is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26) that is spaced apart from the via (28). An electrical element (14), such as a wound antenna, is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A protuberance (20) is connected to the metallic lead (18), preferably by forming a loop from a wire bond. A polymeric body (56) is formed about the component (16) and wire leads (36).

Abstract: A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12).

Abstract: A process for fabricating a multilayer printed circuit board, in which interlayer adhesion of the layers is greatly enhanced by curing under superatmospheric pressure. The method generally includes depositing a first resin layer (12) onto a substrate (10), which is then patterned so as to cross-link a preselected portion of the resin layer (12). A second resin layer (18) is then deposited over the first resin layer (12), and then patterned to cross-link a portion thereof. Openings in the first and second resins are developed by removing those portions of the resins that were not cross-linked during patterning. Openings (26) in the second resin layer (18) provide access to the first resin layer (12) by subsequent chemical processes. The portions of the first (12) and second (18) resin layers cross-linked during patterning remain on the substrate (10) to form permanent dielectric layers.

Abstract: A microelectronic package (10) is formed by placing a lead frame (22) onto an adhesive polyimide tape (38). The lead frame (22) includes a plurality of metallic leads (16) and an opening. An integrated circuit die (12) is positioned onto the molding support (38) within the opening such that a non-active face (32) of the integrated circuit die (12) rests against the molding support (38). Wire leads (18) connect an active face (28) of the integrated circuit die (12) to the metallic leads (16). A plurality of metallic bumps (20) are attached to the metallic leads (16), and a polymeric precursor is dispensed. The precursor embeds the active face (28) of the integrated circuit die (12), the inner surface (19) of the metallic leads (16), the wire leads (18), and the metallic bumps (20). The microelectronic package (10) is then heated to cure the polymeric precursor to form a polymeric body (14).

Abstract: A multi-board electronic assembly (10) includes a first substrate (12) and a second substrate (14) electrically connected by a spacer (16). The spacer (16) includes a first end (26) that is received in a first receptacle (18) on the first substrate (12) and a second end (28) that is received in a second receptacle (22) in the second substrate (14). The spacer (16) is formed generally of a nonconductive body (15) and includes ridges (60) and longitudinal channels (30) defined between the ridges (60). The ridges (60) are formed generally of a nonconductive material, and the spacer (16) includes a metallic strip (32) disposed within the channel (30). The metallic strip (32) forms a conductive path to connect the first circuit trace (20) to the second circuit trace (24) to form an electrically connected microelectronic assembly (10).

Abstract: A microelectronic assembly (10) includes an integrated circuit component (14) spaced apart from a substrate (12) by a gap filled with a polymeric encapsulant (18). The polymeric encapsulant (18) contains a thermally decomposable azide group. In the event that it is necessary to remove the component (14), such as if the component (14) is found to be defective, the microelectronic assembly (10) is heated to a temperature above the decomposition temperature of the azide group. Decomposition of the azide group disintegrates the encapsulant (18) and preferably detaches the component from the substrate (12), thereby permitting replacement of the component (14).

Abstract: A wireless communication system (200, 300, 400, 500) mitigates the effects of excess timing delay caused by varying lengths of communication paths. In one general implementation, a transition communication path (206, 323, 329) is used to transfer a time-advanced version of a timing reference signal so that the cumulative time delay at a transition cell (209, 325, 331) is reduced. In another general implementation, the timing reference signal is time-advanced in all communication paths (403-411), and selected communication paths (403-407) include a time delay means (423-427, 503-507) such that the cumulative time delay at an area (421) near a target coverage area (130) is reduced. By reducing the cumulative time delay at the area (421) near the target coverage area (130), a handoff of a communication of a mobile station (128) into the target coverage area (130) can be performed.

Abstract: A liquid crystal display device (10) includes a front polarizer (12), a liquid crystal cell (14), a retardation film (16), a back polarizer (18), and a reflective holographic optical element (20). Diffuse ambient light illuminates the front polarizer (12), which polarizes the ambient light and transmits the polarized light to the liquid crystal cell (14). The liquid crystal cell (14) receives the polarized light and transmits polarized light derived from the incident polarized light to the retardation film (16). The retardation film (16) receives the polarized light and transmits polarized light, including light within a selected spectral band. The back polarizer (18) receives the polarized light from the retardation film (16) and selectively transmits polarized light derived from the incident polarized light.

Abstract: A distributed transmission line structure (10) includes a ground plane (26) affixed to a substrate (12). The substrate (12) is formed of a generally nonconductive material. A first metallic strip (14) is affixed to the substrate (12) and is electrically connected to the ground plane (26) through a first through-hole (34). A second metallic strip (16) is affixed to the substrate (12) and is spaced apart from the first metallic strip (14) by a gap (28) and is electrically connected to the ground plane (26) through a second through-hole (38). A dielectric layer (20) overlies the substrate (12), the first metallic strip (14), and the second metallic strip (16). A third metallic strip (18) is affixed to the dielectric layer (20) and is disposed to overlie the gap (28). The third metallic strip (18) has a width less than the gap (28). The impedance of the distributed transmission line structure (10) is substantially constant over a predetermined range of thickness of the dielectric layer (20).

Abstract: A microelectronic assembly (10) includes a printed circuit board (12) that includes a substrate (14) having a die attach region (22) and a plurality of first bond pads (24) disposed and spaced apart at the die attach region (22). A channel (26) effective in improving fluid flow extends across the die attach region (22) apart from the first bond pads (24). An integrated circuit die (16) is mounted onto the printed circuit board (12) and includes a major face (28) facing the substrate (14) and spaced apart therefrom by a gap (30) and second bond pads (25) disposed on the major face (28) in a pattern such that each of the second bond pads (25) registers with a first bond pad (24). Solder bump interconnections (18) connect the first bond pads (24) to the second bond pads (25). Encapsulant (20) is disposed within the gap (30) and flows over the substrate (14) and the channel (26) to encapsulate the solder bump interconnections (18).

Abstract: A masking method employing a photodefinable resin as a permanent dielectric mask, in which the resin contains a catalytic filler that when activated enables direct electroless plating of the resin. The resin serves to simplify selective electroplating of isolated surface features such as metal pads, while also improving the topology of the external surface of the circuit board, particularly when small metal pads require a controlled volume of a reflowable metal. The resin is preferably photodefined to eliminate recessed areas around the metal pads, thereby promoting definition of the metal features, and yielding a nearly planar surface. Additional features that can be provided with the method include external conductive ground planes and electromagnetic shield layers within a multilayer circuit board. The masking method can be advantageously used with both reflowable metals and metal alloys, such as tin/lead, and nonreflowable metals and metal alloys, such as gold, palladium and platinum.

Abstract: A tool (10) is effective to carry balls (30) and to detect any balls missing from the tool (10). The tool (10) includes a housing (12) that includes a face plate (16) that has a plurality of bores (18) extending between an inner face (22) and an outer face (24) opposite the inner face (22). The bores (18) each have a concave seat that is sized and shaped to receive a ball (30). The housing (12) defines a chamber (14) that prevents light from entering except through the bores (18). The housing (12) further includes a photodetector (20) within the chamber (14) to receive light that passes through the bores (18), which indicates the absence of a ball from the face plate (16).

Abstract: A vacuum pickup tool (10) is effective to carry balls (18) arranged in a desired pattern. The vacuum pickup tool (10) includes a manifold (12) that includes a carrier plate (22) that has a plurality of manifold bores (28) arranged in a pattern. The manifold (12) defines a vacuum chamber (20) that reduces gas pressure in the manifold (12) to allow the manifold bores (28) to retain a ball (18). The manifold (12) further includes a retaining plate (14) that overlies the carrier plate (22) and includes a plurality of retaining plate bores (30) arranged in a pattern such that each retaining plate bore (30) registers with a corresponding manifold bore (28). The retaining plate (14) is effective to secure a stencil (16) formed of a gas-impermeable sheet against the carrier plate (22) to prevent gas flow between a manifold bore (28) and a corresponding retaining plate bore (30).

Abstract: A liquid crystal display device (10) for forming a display includes a liquid crystal panel (12), a switchable holographic optical element (14), and a reflective holographic optical element (16). Ambient light illuminates a front polarizer (18), which polarizes the ambient light and transmits the polarized light to the liquid crystal cell (20). The liquid crystal cell (20) receives the polarized light and transmits polarized light derived from the incident polarized light to a back polarizer (22). The back polarizer (22) polarizes the light and transmits the light to the switchable holographic optical element (14). While in a first mode, the switchable holographic optical element (14) redirects the light back toward the liquid crystal panel (12) within a first viewing cone (34) to form the display. In a second mode, the switchable holographic optical element (14) is transparent and transmits the light to the reflective holographic optical element (16).