Abstract: An adhesive composition comprising(A) An epoxide resin component,(B) A hardener component, and incorporated in either or both/or (A) and (B) a thermoplastic polymer, mixtures thereof and application of said mixtures to substrate surfaces to adhere said surfaces together are described.

Abstract: A process for preparing thioether amide diol comprising reacting a bicyclic amide acetal with hydrogen sulfide at a temperature in the range of from 20.degree. to 200.degree. C. wherein a mole ratio of bicyclic amide acetal to hydrogen sulfide is in the range of from about 1:1 to about 2:1 is described.

Abstract: Disclosed is a storage stable blend of a long chain polyol and a short chain diol wherein the diol is present in an amount whereby the diol and polyol form an incompatible blend. The blend is rendered storage stable by the addition of a compatibilizing amount of a urethane.

Abstract: An adhesive composition which results from the mixture of two components, the first component comprising a polyepoxide and the second component comprising a finely dispersed solid salt of a polyamine and a polyphenol in a liquid adduct of a poly(alkylene oxide) polyamine and a polyphenol and the use of this non sagging, high performance adhesive in structural applications is described.

Abstract: A process for preparing novel composite structures by priming the surfaces of two or more substrates (such as SMC panels, etc.) with an effective amount of an epoxy resin prior to adhering said surfaces together with an adhesive (such as a polyurethane adhesive) wherein said structures have improved high temperature (about 400.degree. F.) tolerance is described.

Abstract: A process for preparing a polyurethane comprising reacting a thioether amide diol prepared by reacting a bicyclic amide acetal with hydrogen sulfide at a temperature in the range of from 20.degree. to 200.degree. C. wherein a mole ration of bicyclic amide acetal to hydrogen sulfide is in the range of from about 1:1 to about 2:1 is described.

Abstract: An adhesive composition which is curable by electromagnetic induction heating when it is applied to various substrates, said adhesive comprising a mixture of(I) An epoxy resin component and(II) A hardener component and(III) From 2 to 60% by weight of (I) and (II) of an electromagnetic energy absorbing material is described.

Abstract: A process for removing epoxy resin adhesive and coating agent residues from surfaces of apparatus containers and other surfaces which come in contact with such adhesives and coating agents during their preparation and use comprising contact said residues with a flushing agent which comprises at least one ester of a carboxylic acid having the formula R(COOR').sub.n wherein R represents a hydrocarbon group having from 1 to 10 carbon atoms, R' represents an aliphatic hydrocarbon group having from 1 to 4 carbon atoms and n represents a whole number of from 1 to 2 is described.

Abstract: Thermoset resinous molding compositions are provided by essentially instantaneously combining and reacting three basic resin forming components. The latter include an oligomeric ester or polyester containing polymerizable unsaturation and free hydroxyl group(s); a polyisocyanate; and an aromatic polyamine. The indicated thermosetting resin systems are especially adapted for use in a reaction injection molding (RIM) operation.

Abstract: A process for producing oligomeric compounds containing hydroxy alkyl amide groups by the reaction at a temperature in excess of about 100 degrees C. of a bicyclic amide acetal with a member selected from the group consisting of urea, biuret, thiourea, thiobiuret, alkyl substituted ureas, aryl substituted ureas, alkyl substituted thioureas, aryl substituted thioureas, alkylene ether ureas, arylene ether ureas, alkylene ether thioureas and arylene ether thioureas is disclosed.

Abstract: An improved process for increasing the rate of the copolymerization of mixtures of polyphenolic compounds having more than two phenolic hydroxyl groups per molecule and bis-oxazolines comprising carrying out the copolymerization in the presence of a catalytic amount of a halohydrocarbon at a temperature in the range of from about 130.degree. C. to 150.degree. C. is described.

Abstract: Compositions have melting points below 100.degree. C. which are useful in the formation of resins by reaction with polyphenolic compounds consisting of a mixture of more than two compounds having the formula ##STR1## wherein A represents a cyclic or acyclic aliphatic or substituted cyclic or acyclic aliphatic moiety having from 1 to 20 carbon atoms or an aromatic mono- or multi-nuclear or aliphatic substituted aryl residue having from 6 to 20 carbon atoms,R independently represents H, CH.sub.3, CH.sub.2 CH.sub.3 or C.sub.6 H.sub.5,R.sup.1 independently represents H or CH.sub.3,R.sup.2 independently represents H or CH.sub.3, andx represents an integer from 0 to 2are described.

Abstract: A polymerizable thermosetting composition which is a flowable liquid at moderate temperatures which comprises a mixture of:(A) from about 75% to about 95% by weight of a mixture of:(1) from about 80% to about 20% by weight of a bisoxazoline and(2) from about 20% to about 80% by weight of a polyphenolic compound and(B) from about 5% to about 25% by weight of at least one member selected from the group consisting of a monooxazoline and a monooxazine,a method for forming thermoset products therefrom and the novel thermoset products resulting from said method are described.

Abstract: Disclosed is a storage stable blend of a long chain polyol and a short chain diol wherein the diol is present in an amount whereby the diol and polyol form an incompatible blend. The blend is rendered storage stable by the addition of a compatibilizing amount of a urethane.

Abstract: A process and apparatus using two gas liquid separations when carbonylating propylene to isobutyryl fluoride in hydrogen fluoride result in a savings in recycle pumping energy compared to a one gas-liquid separation process.

Abstract: The process for the reaction of bicyclic amide acetals with reactive protic compounds of the general Formula ##STR1## wherein Y represents a member selected from the group consisting of ##STR2## R.sup.1 represents a member selected from the group consisting of hydrogen, an alkyl group having from 1 to 10 carbon atoms, an aryl group having from 6 to 12 carbon atoms, and R.sup.2 represents a member selected from the group consisting of an alkyl group having from 1 to 10 carbon atoms, an aryl group having from 6 to 12 carbon atoms, an alkylene ether group having from 1 to 50 carbon atoms, an arylene ether group having from 6 to 50 carbon atoms such as ethyl carbamate to form novel products which are useful as curing agents, blowing agents and monomers is disclosed.

Abstract: Compositions useful as a material for fuel lines comprising an intimate blend of:(I) from 45 to 55% by weight of a polyamide and(II) from 55 to 45% by weight of a mixture of(a) From 70 to 90% by weight of high density polyethylene grafted with an alpha, beta-olefinically unsaturated dicarboxylic acid anhydride,(b) From 5 to 15% by weight of linear low density polyethylene grafted with an alpha, beta-olefinically unsaturated dicarboxylic acid anhydride, and(c) From 5 to 15% by weight of ethylene/propylene/diene rubber grafted with an alpha, beta-olefinically unsaturated dicarboxylic acid anhydrideare described.

Abstract: The formation of structural composites having low smoke release and low heat release properties by forming a sandwich comprising a non-woven fiber mat between woven glass fiber mats and impregnating said sandwich with a mixture of a bisoxazoline and a polyphenolic compound to form a prepreg which can be formed and molded at elevated temperatures is described.

Abstract: Compositions having melting points below 100.degree. C. which are useful in the formation of resins by reaction with polyphenolic compounds consisting of a mixture of more than two compounds having the formula ##STR1## wherein A represents a cyclic or acyclic aliphatic or substituted cyclic or acyclic aliphatic moiety having from 1 to 20 carbon atoms or an aromatic mono- or multi-nuclear or aliphatic substituted aryl residue having from 6 to 20 carbon atoms,R independently represents H, CH.sub.3, CH.sub.2 CH.sub.3 or C.sub.6 H.sub.5,R.sup.1 independently represents H or CH.sub.3,R.sup.2 independently represents H or CH.sub.3, andx represents an integer from 0 to 2as described.

Abstract: A process for preparing thioether amide diol comprising reacting a bicyclic amide acetal with hydrogen sulfide at a temperature in the range of from 20.degree. to 200.degree. C. wherein a mole ratio of bicyclic amide acetal to hydrogen sulfide is in the range of from about 1:1 to about 2:1 is described.