Abstract: A method and apparatus are provided for constructing a temperature controlled crystal oscillator chip. The method includes the steps of disposing a connection pad on a surface of the chip, providing a first circuit within the chip for control of a first chip function through a first interconnection with the connection pad and providing a second circuit within the chip for control of a second chip function, unrelated to the first chip function, through a second interconnection with the connection pad.
Type:
Grant
Filed:
November 30, 2000
Date of Patent:
June 17, 2003
Assignee:
CTS Corporation
Inventors:
Richard N. Sutliff, Iyad Alhayek, Ammar Yasser Rathore, Jaroslaw Adamski