Abstract: A programmable device and method with generic logic blocks. Each generic logic block is configurable to perform product term logic functions and memory functions, such as RAM, dual-port RAM, ROM, CAM, FIFO and switch.
Type:
Grant
Filed:
April 26, 2002
Date of Patent:
July 20, 2004
Assignee:
Lattice Semiconductor Corporation
Inventors:
Jason Cheng, Cyrus Tsui, Satwant Singh, Albert Chen, Ju Shen, Clement Lee
Abstract: A direct downconversion receiver combines a received RF signal and a local oscillator (LO) signal to form a combined signal. The local oscillator signal is also phase-shifted by approximately 90 degrees to form a quadrature signal. A mixer forms the product of the combined signal and the quadrature signal to produce a baseband output signal.
Abstract: The snapped-down position of an optical element is defined by its contact with a plurality of kinematic supports on an associated platform, or on electrodes placed on that platform. Compliant flexures may be provided in association with one or more kinematic supports, such that fine adjustments of the optical element can be made by deflecting the optical element to cause compression of one or more flexures.
Type:
Grant
Filed:
September 5, 2001
Date of Patent:
May 18, 2004
Assignee:
Siwave, Inc.
Inventors:
Roman C. Gutierrez, Tony K. Tang, Cathleen Jones, Robert J. Calvet
Abstract: A memory controller configured according to a delay pair for communicating with a memory device automatically selects optimal delay pairs by testing whether successful communication exists at various values for the delay pairs. The resulting set of delay pairs allowing successful communication are divided into a boundary set and non-boundary set. An optimal delay pair from the non-boundary set is chosen according to its relationship to delay pairs in the boundary set.
Type:
Grant
Filed:
January 25, 2001
Date of Patent:
April 9, 2002
Assignee:
Ishoni Networks, Inc.
Inventors:
Ka-pui Ko, Isaac H. Wong, Keith V. Ngo, Jau-Wen Ren, Jiinyuan Lee
Abstract: A design tool for integrated circuits includes a placement tool which concurrently places logic gates and interconnect. In one embodiment, the logic gates are placed into bins and virtual buffers are inserted between logic gates mapped to different bins. Placement and interconnect wire lengths and densities are successively improved leading to removal of some buffers and actualization of the virtual buffers.
Type:
Grant
Filed:
June 12, 1998
Date of Patent:
April 2, 2002
Assignee:
Monterey Design Systems, Inc.
Inventors:
Lawrence Pileggi, Sharad Malik, Emre Tuncer, Abhijeet Chakraborty, Satyamurthy Pullela, Altan Odabasioglu, Douglas B. Boyle