Abstract: The present invention provides an optical microbench having intersecting structures etched into a substrate. In particular, microbenches in accordance with the present invention include structures having a planar surfaces formed along selected crystallographic planes of a single crystal substrate. Two of the structures provided are an etch-stop pit and an anisotropically etched feature disposed adjacent the etch-stop pit. At the point of intersection between the etch-stop pit and the anisotropically etched feature the orientation of the crystallographic planes is maintained. The present invention also provides a method for micromachining a substrate to form an optical microbench. The method comprises the steps of forming an etch-stop pit and forming an anisotropically etched feature adjacent the etch-stop pit. The method may also comprise coating the surfaces of the etch-stop pit with an etch-stop layer.

Abstract: Negative type photosensitive resin compositions are provided. Such negative photosensitive resin compositions contain a novolac resin and a phenol-biphenylene resin as well as an epoxy compound. These resin compositions have excellent heat-impact resistance for the hardened resin material.

Abstract: A negative-type photosensitive resin compositions containing an epoxy compound are provided. These compositions use poly(p-vinylphenol) as the base resin and have good development performance when using an aqueous developer, such as tetramethylammonium hydroxide solution.

Abstract: The present invention provides a method for forming a vertical taper in a waveguide. In the present invention, a shadow mask is disposed above a waveguide requiring a vertical taper. Then, the waveguide is exposed to a directional etching process (e.g. deep reactive ion etching) while the mask is moved. Ask the mask moves, different regions of the waveguide will be etched different depths, resulting in a vertical taper in the waveguide.

Abstract: Provided are methods of forming optical components. The methods involves (a) forming over a substrate a layer of a photoimageable composition that includes a hybrid organic-inorganic polymer and a photoactive component, wherein the layer has a first index of refraction and a first dissolution rate; and (b) exposing by multi-photon absorption using actinic radiation a predefined volume of the layer. The volume is caused to have: (i) a second index of refraction which is different than the first index of refraction and/or (ii) a second dissolution rate which is different than the first dissolution rate. The methods have particular applicability in the formation of optical waveguides and other optical components.

Abstract: Provided are methods of metallizing non-conductive substrates. The methods involve: (a) providing a non-conductive substrate having an exposed non-conductive surface; (b) forming a transition metal layer over the non-conductive surface; and (c) exposing the transition metal layer to a liquid solution of a compound chosen from one or more phosphonic acids and their salts, and monoesters of phosphoric acids and their salts, having 6 or more carbon atoms. The non-conductive substrate can be, for example, an optical fiber. Also provided are metallized non-conductive substrates and metallized optical fibers prepared by the inventive methods, as well as optoelectronic packages that include such metallized optical fibers. Particular applicability can be found in the optoelectronics industry in metallization of optical fibers and in the formation of hermetic optoelectronic device packages.

Abstract: The present invention relates generally to micromachining. More particularly, the present invention relates to a method for combining directional ion etching and anisotropic wet etching and devices and structures fabricated thereby. The present invention is particularly applicable to silicon micromachining and provides architectures that combine crystallographic surfaces and vertical dry etched surfaces together in the same structure.

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: In accordance with the present invention a fiber optic array is provided. The array includes a substrate having a fiber support surface. The array further includes an optical fiber having a fiber portion that includes an un-jacketed, un-buffered optical core segment. The un-jacketed, un-buffered optical core segment is placed in contact with the fiber support surface to orient the optical core segment at a selected position relative to the support surface. In addition, the array includes a solder glass chemically bonded to the optical core segment and the fiber support surface so that the optical core segment is secured at a predetermined location relative to the support surface of the substrate. A method for fabricating such a fiber optic array is also provided.

Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

Abstract: An optical switch and method for assembling are described. Optical arrays are mounted on a flex plate with an interface between them. The direction of certain forces on the flex plate allows coupling/decoupling of the optical arrays. The flex plate includes an area which exhibits a different flex profile than the remainder of the flex plate and that is located beneath the optical arrays interface. Flexing of the flex plate optically couples the optical arrays. A tool with grooves is used to align the optical arrays relative to each other. The tool uses grooves and spheres to mate with the optical arrays in such a way as to provide an appropriate interface between the optical arrays.

Abstract: An optical microbench configured to facilitate wafer-level testing of optoelectronic devices is provided. The optical microbench includes an optoelectronic device mounted to a wafer in which the optical microbench is provided. The optical microbench also includes a beam deflector provided in the wafer and disposed along the optical path of the optoelectronic device. The beam deflector is configured to deflect a portion of the optical path to lie along a direction oriented out of the plane of the wafer. The optical microbench further includes an optical feed-through disposed along the optical path between the optoelectronic device and the beam deflector. The optical feed-through is configured to conduct an optical signal between the beam deflector and the optoelectronic device. A method for testing optoelectronic devices at the wafer level is also provided.

Abstract: Provided are compositions which include a polymer, having units of the formula (RSiO1.5), wherein R is a substituted or unsubstituted organic group, and a plurality of functional end groups. A first component is provided for altering the solubility of the composition in a dried state upon activation. A second component contains a plurality of functional groups chosen from epoxides, oxetanes, vinyl ethers and combinations thereof. The second component is present in an effective amount to improve flexibility of the composition in a dried state before and after activation. Also provided are flexible optical waveguides, methods of forming flexible optical waveguides and electronic devices that include a flexible optical waveguide.

Abstract: Provided are compositions suitable for use in forming a flexible optical waveguide. The compositions include a polymer that has units of the formula (R1SiO1.5) and (R22SiO), wherein R1 and R2 are the same or different, and are substituted and/or unsubstituted organic groups, and wherein the (R22SiO) units are present in an amount of 14 wt % or more based on the polymer; and a plurality of functional end and/or internal groups. Also included is a component for altering the solubility of the composition upon activation. The solubility of the composition in a dried state is alterable upon activation of the component such that the composition is developable in an aqueous developer solution. Also provided are flexible optical waveguides, methods of forming flexible optical waveguides and electronic devices that include a flexible optical waveguide.

Abstract: Provided are compositions suitable for use in forming a flexible optical waveguide. The compositions include a polymer, having units of the formula (RSiO1.5), wherein R is a substituted or unsubstituted organic group, and a plurality of functional end groups. A first component is provided for altering the solubility of the composition in a dried state upon activation. A second component contains a plurality of functional groups chosen from hydroxy, amino, thiol, sulphonate ester, carboxylate ester, silyl ester, anhydride, aziridine, methylolmethyl, silyl ether, and combinations thereof. The second component is present in an effective amount to improve flexibility of the composition in a dried state before and after activation. Also provided are flexible optical waveguides, methods of forming flexible optical waveguides and electronic devices that include a flexible optical waveguide.

Abstract: A variable width waveguide useful for mode matching between dissimilar optical waveguides and optical fibers and a method for making the same is described. In one embodiment, a tapered waveguide is etched in a substrate, a cladding material is laid over the upper surface of the substrate and within the waveguide, and the waveguide is then filled with a core material. The core material may be deposited in a single step, or in successive deposition steps.

Abstract: A first waveguide holding member has a first transverse surface region and a first optical waveguide having an end terminating at the first transverse surface region. A second waveguide holding member has a second transverse surface region which confronts the first transverse surface region of the first waveguide holding member and a second optical waveguide having an end terminating at the second transverse surface region. A guide member is operatively coupled to the first and second waveguide holding members and guides the first waveguide holding member in a transverse direction relative to the second waveguide holding member so as to selectively optically couple and decouple the ends of the first and second optical waveguides.

Abstract: Surface micromachined structures having a relatively thick dielectric layer and a relatively thin conductive layer bonded together.

Abstract: Provided are methods of forming optical waveguides. The methods involve: (a) forming over a substrate a layer of a photodefinable composition; (b) exposing a portion of the layer to actinic radiation; (c) developing the exposed layer to form a waveguide core structure; and (d) heating the waveguide core structure to a temperature and for a time effective to reflow the structure such that it becomes at least partially rounded in cross-section. Also provided are optical waveguides formed from the described methods and electronic devices including one or more of the optical waveguides.

Abstract: A fiber optic array (90) is provided having fibers (24) positioned at a selected angle relative to the output face of the array. The array includes first (20) and second (30) substrates each of which has a plurality of fiber passageways extending therethrough. The substrates are positioned relative to one another such that each passageway (22) of the first substrate is registered to a respective passageway (32) of the second substrate. An optical fiber is disposed in each pair of registered passageways. The passageways are dimensioned to permit the optical fiber disposed therein to be positioned at a range of angles relative to the output face of the array. The first and second substrates are moved relative to one another to select an angle from the range of angles at which the fibers are oriented relative to the output face of the array. A method for fabricating such a fiber optic array is also provided.