Patents Represented by Attorney, Agent or Law Firm Joseph C. Andras
  • Patent number: 7763168
    Abstract: A method of controlling a centrifuge of the type having a rotating perforated basket on whose inner peripheral wall a liquids/solids slurry is caused to collect in use, with separated liquid being collected via the basket perforations. The method comprising taking depth measurement of the material in the rotating basket continuous or at repeated intervals, over a basket cycle from commencement of slurry feed to discharge of solids, using at least one laser unit adapted to direct a beam of coherent light energy towards said inner peripheral wall of the basket of solids. The depth measurements can be made using at least one laser unit (30) adapted to direct a beam of coherent light energy towards said inner peripheral wall of the basket.
    Type: Grant
    Filed: May 25, 2004
    Date of Patent: July 27, 2010
    Assignee: Thomas Broadbent & Sons Ltd
    Inventor: Geoffrey Clive Grimwood
  • Patent number: 6829237
    Abstract: A compact multi-stage switching network (100), and a router (510) incorporating such multi-stage switching network, adapted for simultaneously routing a plurality of data packets from a first plurality of input ports (110) to selected ones of a second plurality of output ports (190) comprising: a first stack (140) of IC switching layers (113) that are stacked in physical contact with one another, each IC switching layer containing at least one switching element circuit (142); a second stack (160) of IC switching layers (113) that are stacked in physical contact with one another, each IC switching layer (113) containing at least one switching element circuit (162); and interconnecting circuitry (150) that connects the first stack (140) of IC layers to the second stack (160) of IC layers to form the compact multi-stage switching network. The stacks (140, 160) are preferably mated to one another in a transverse fashion in order to achieve a natural full-mesh connection.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: December 7, 2004
    Assignee: Irvine Sensors Corporation
    Inventors: John C. Carson, Volkan H. Ozguz
  • Patent number: 6797537
    Abstract: A pre-formed integrated circuit chip is encapsulated into an electronic package, by forming an interconnect assembly separately from the pre-formed integrated circuit chip. If the interconnect assembly tests good it is bonded to the prepared integrated circuit chip. The interconnect assembly is flip bonded to the chip. The interconnect assembly and chip are passivated or potted into an integral structure to provide the electronic package. At least one test pad is defined in an interconnect layer, which test pad can be accessed and electrically connected on opposing sides of the test pad. The chip is underfilled with an insulating material to remove all voids between the chip and the interconnect assembly. The integrated circuit chip is then thinned. The test pad is accessed to test the chip. A plurality of interconnect assemblies and chips are bonded together to form a corresponding plurality of electronic packages.
    Type: Grant
    Filed: October 30, 2001
    Date of Patent: September 28, 2004
    Assignee: Irvine Sensors Corporation
    Inventors: Angel Antonio Pepe, James Satsuo Yamaguchi
  • Patent number: 6797208
    Abstract: A golf club and a primarily non-metallic golf shaft that has an overall light weight are provided. The shaft has a weighting plug located to provide a swingweight similar to a typical steel shafted golf club. A method of making the golf club and golf shaft is simple and efficient, and centers the plug in the golf shaft. The method also provides the advantage of substantially infinitely variable plug density selection within a range of densities. A set of clubs thus made increases playability by providing a range of club weights in the set.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: September 28, 2004
    Assignee: Graphite Design International
    Inventor: Robert C. Schikner
  • Patent number: 6784547
    Abstract: A pre-formed integrated circuit chip is encapsulated into an electronic package, by forming an interconnect assembly separately from the pre-formed integrated circuit chip. If the interconnect assembly tests good it is bonded to the prepared integrated circuit chip. The interconnect assembly is flip bonded to the chip. The interconnect assembly and chip are passivated or potted into an integral structure to provide the electronic package. At least one test pad is defined in an interconnect layer, which test pad can be accessed and electrically connected on opposing sides of the test pad. The chip is underfilled with an insulating material to remove all voids between the chip and the interconnect assembly. The integrated circuit chip is then thinned. The test pad is accessed to test the chip. A plurality of interconnect assemblies and chips are bonded together to form a corresponding plurality of electronic packages.
    Type: Grant
    Filed: November 21, 2002
    Date of Patent: August 31, 2004
    Assignee: Irvine Sensors Corporation
    Inventors: Angel Antonio Pepe, James Satsuo Yamaguchi
  • Patent number: 6744899
    Abstract: There is disclosed an acoustic driver having a phasing and compression plug and its direct coupling to an acoustic waveguide having an entry throat with a non-unity aspect ratio, such as a rectangular diffraction slot. The phasing and compression plug has an input end with an input surface having a plurality of input apertures configured in a parallel array of spaced-apart chordal slits. The opposite, output end of the plug has a like plurality of output apertures contained in an output region having unequal length and width dimensions such that the area of the output region is less than that of the input surface. A plurality of passages through the plug body connect each respective input aperture to the corresponding output aperture wherein the relative lengths of the passages are preselected to provide an acoustic wavefront which is concave at its major (vertical) axis and planar or convex across its minor (horizontal) axis.
    Type: Grant
    Filed: September 21, 2000
    Date of Patent: June 1, 2004
    Inventor: Robert M. Grunberg
  • Patent number: 6739445
    Abstract: A conveyor system for transitioning articles between an external intermittent conveyor and an external continuous conveyor system includes an upper conveyor and lower conveyor. Each conveyor includes an infeed arm movable toward and away from the intermittent conveyor. Each infeed arm defines an infeed end that is movable along a common arc and rotatable about a common pivot point. With the infeed ends traveling along a common arc, each infeed end is easily moved to the same optimal receiving position for receiving articles from the intermittent conveyor. Each conveyor may switch between a continuous mode, wherein articles are continuously discharged onto the continuous conveyor, and an intermittent mode, wherein articles are intermittently received from the intermittent conveyor.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: May 25, 2004
    Assignee: Casa Herrera, Inc.
    Inventor: Richard E. Armstrong
  • Patent number: 6738312
    Abstract: The invention relates to an arrangement for measuring the speed of sound, the arrangement comprising: an electrical pulse generating means (402) for generating an output electrical pulse signal (404), a transmitting transducer (403) for converting said output electrical pulse signal (404) into an output acoustic pulse signal (405), a reflector (407) for reflecting said output acoustic pulse signal (405), thereby producing a reflected acoustic pulse signal (409), a receiving transducer (408) being arranged such as to receive said output acoustic pulse signal (405) transmitted directly from said transmitting transducer and said reflected acoustic pulse signal (409) reflected by said reflector, wherein said receiving transducer converts the received output acoustic pulse signal (405) into a reconstructed output electrical pulse signal (410) and the reflected acoustic pulse signal (409) into a reconstructed reflected electrical pulse signal (411), a speed determination means for determining the speed of sound (41
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: May 18, 2004
    Assignee: Addest Technovation Pte Ltd.
    Inventors: Kah Chye Tan, Zenton Goh, Kwok Chiang Ho
  • Patent number: 6734370
    Abstract: A multilayer module includes a first active layer with a first edge and second active layer with a second edge. Each active layer includes a flexible, polymer substrate, at least one electronic element, and a plurality of electrically-conductive traces which provide electrical connection from the respective edge to the electronic element of the active layer. The second active layer is adhered to the first active layer so that the first edge and second edge are aligned with each other thereby forming a side of the multilayer module. The multilayer module further includes a plurality of electrically-conductive lines along the side of the multilayer module, the lines providing electrical connection to the traces.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: May 11, 2004
    Assignee: Irvine Sensors Corporation
    Inventors: James Satsuo Yamaguchi, Angel Antonio Pepe, Volkan H. Ozguz, Andrew Nelson Camien
  • Patent number: 6731121
    Abstract: A transducer interface circuit (10) for use with a capacitive sensor (20). The interface circuit (10), provided on application specific IC, includes numerous trims and adjustments that permit it to operate with a differential, balanced-pair sensors (20A) or a singled-ended sensor (2013). In particular, the circuit (10) provides a capacitive adjustment section (100) and a capacitive trans-impedance amplifier section (200) that are configured with capacitor adjustment controls (110) and gain adjustment controls (210) that, along with other controls, are provided as control registers. The capacitive trans-impedance amplifier section (300) periodically reverses the voltages across the sensor (20), and the capacitive adjustment section (200), after blanking a feedback capacitance (CF) that is used to integrate excess charge caused by a difference in capacitance. A low pass filter section 300 provides bandwidth adjustment without requiring any external components.
    Type: Grant
    Filed: August 19, 2002
    Date of Patent: May 4, 2004
    Assignee: Microsensors Corp.
    Inventors: Ying Hsu, Christ Saunders, Kirk Su
  • Patent number: 6724337
    Abstract: A method is provided for analog/digital converting of at least one analog low-frequency signal with an analog/digital converter which can detect only an analog signal with a frequency above a predetermined border frequency value, wherein at least one analog low-frequency signal and at least one analog high-frequency signal are provided. An analog intermediate signal is generated from said analog low-frequency signal(s) and said analog high-frequency signal(s) and is input to the analog/digital converter. The analog intermediate signal is converted into a digital intermediate signal, and a digital low-frequency signal corresponding to said analog low-frequency signal is determined from the digital intermediate signal.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: April 20, 2004
    Assignee: Addest Technovation Pte Ltd
    Inventor: Kah Chye Tan
  • Patent number: 6719277
    Abstract: Plastic panels are thermoformed to include a variety of three-dimensional features resembling masonry patterns, various types of walls, and fencing sections. The thermoformed panels are incorporated into fencing and wall assemblies. A fencing assembly includes plastic panels thermoformed to resemble a plurality of stakes. Panels are disposed between a pair of posts with side portions configured to overlap. Each stake includes a top return projecting rearwardly. Horizontal reinforcements couple the panels to the posts. A double-sided wall assembly employs plastic panels thermoformed to resemble bricks and other wall patterns. Each sub-assembly includes a pair of panels coupled to a frame in a back-to-back arrangement. The sub-assemblies are disposed side-by-side in between a pair of posts.
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: April 13, 2004
    Inventor: Viken Ohanesian
  • Patent number: 6715352
    Abstract: For a decoupled to gyro to have high sensitivity to angular rate, it is necessary to have the design flexibility to achieve all the critical frequencies in the design. The geometry of the gyro is first estimated and is followed by a performance analysis to maximize the gyro sensitivity. If the performance requirements cannot be met, the next iteration is started by a new estimate of the geometry. For a given design iteration, the desired modal response is implemented with a predetermined or given gyro flexure system. The flexure system disclosed here has enough independent design parameters to allow the desired modal response required for high gyro performance to be selected by independent design choice of the available geometric and configurational design parameters of the gyroscope.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: April 6, 2004
    Assignee: Microsensors, Inc.
    Inventor: Michael J. Tracy
  • Patent number: 6717061
    Abstract: Each multilayer module of a plurality of multilayer modules has a plurality of layers wherein each layer has a substrate therein. The plurality of multilayer modules includes a first multilayer module including a first layer and a second multilayer module including a second layer each having a top side and bottom side. The first layer and second layer each includes a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The plurality of multilayer modules further includes a heat-separating layer disposed between the top side of the first layer and the bottom side of the second layer. The first multilayer module is adhered to the second multilayer module and the first multilayer module can be detached from the second multilayer module by applying heat to the heat-separating layer.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: April 6, 2004
    Assignee: Irvine Sensors Corporation
    Inventors: James Satsuo Yamaguchi, Angel Antonio Pepe, Volkan H. Ozguz, Andrew Nelson Camien
  • Patent number: 6714942
    Abstract: A method of deriving a sub-class from a remote objects contained on a remote computer and from local objects contained on a local computer to produce a hierarchy of objects distributed across the local and remote computers. Further disclosed is a method of processing a request message from a calling computer program in a distributed object computing system containing a hierarchy of objects distributed across computers.
    Type: Grant
    Filed: July 28, 2000
    Date of Patent: March 30, 2004
    Assignee: E-Volve Incorporated
    Inventor: Brian A. Westcott
  • Patent number: 6706971
    Abstract: A stackable microcircuit layer formed from a plastic encapsulated microcircuit (PEM) and method of making the same is disclosed. The method involves the steps of starting with a commercially available PEM (e.g. a plastic Thin Small Outline Package or TSOP) that contains a microcircuit or die within an encapsulant and modifying the PEM to expose conductive members that are electrically connected to the microcircuit's bond pads. In the case of a TSOP, the preferred modifying step is accomplished by top grinding the TSOP in order to remove the lead frame that was secured above the die and encapsulated along with it in the TSOP. Next, reroute metallization is applied in order to connect the conductive members that were exposed by the top grinding, to an edge of the modified PEM. Finally, if appropriate, the modified PEM is thinned through backside grinding and diced to a desired area, in order to provide a stackable microcircuit layer that may form a part of a dense electronic package.
    Type: Grant
    Filed: May 10, 2002
    Date of Patent: March 16, 2004
    Assignee: Irvine Sensors Corporation
    Inventors: Douglas M. Albert, Keith D. Gann
  • Patent number: 6689618
    Abstract: A single reagent system and a method to detect and measure oxidizing adulterants in bodily fluid being screened for drugs of abuse are disclosed. The system comprising a strip containing 0.05 to 0.2 micromole/25 sq. mm. of a benzidine derivative and is used to detect sodium hypochlorite (bleach), chlorine, hydrogen peroxide, sodium bromide, sodium iodide, sodium nitrite, and pyridinium chlorochromate adulterants in urine, sweat, saliva, blood or other bodily fluids during screening for drugs of abuse.
    Type: Grant
    Filed: April 3, 2000
    Date of Patent: February 10, 2004
    Inventor: Shuenn Tzong Chen
  • Patent number: 6650704
    Abstract: A method of processing low resolution input frames containing undersampled views of an optically imaged scene to produce a higher quality, higher resolution output frame. This method operates by obtaining a sequence of low resolution input frames containing different undersampled views of an optically imaged scene.
    Type: Grant
    Filed: October 25, 1999
    Date of Patent: November 18, 2003
    Assignee: Irvine Sensors Corporation
    Inventors: Randolph S. Carlson, Jack L. Arnold, Valentine G. Feldmus
  • Patent number: 6636319
    Abstract: A spectrometer (110) having an interferometer, a detector (120) that produces a detector signal (20), and a dual-digitizer system including two analog-to-digital converters that simultaneously digitize low-gain and high-gain versions of the detector signal, and suitable data structures and associated firmware for merging the two resulting sets of digitized data into a single, high dynamic range set of data.
    Type: Grant
    Filed: May 4, 2001
    Date of Patent: October 21, 2003
    Inventors: Gerald Auth, Roger Haddad, Warren Vidrine
  • Patent number: D489461
    Type: Grant
    Filed: July 23, 2002
    Date of Patent: May 4, 2004
    Inventor: Viken Ohanesian