Abstract: Packages being produced on a form, fill and seal machine as provided with transverse zippers inserted thereinto through a fin seal gap. Pairs of fin sealing bars are separated by a gap to produce the fin seal gap. The fin seal gap is opened, perhaps by vacuum means, and a zipper probe inserts a zipper having a web into the tube of plastic sheet material being formed into bags. The web of the zipper is sealed to the plastic sheet material, and the zipper probe withdrawn from the tube. Cross seal jaws seal both transverse ends of the package, a knife separates each package from that previously made, and a fin gap sealer seals the fin seal gap to complete the manufacture.

Abstract: Aqueous mixed permonosulphuric acid/sulphuric acid solutions, such as semiconductor surface photoresist stripping solutions may be stabilised for storage by the addition of one or more of the metals gallium, germanium, indium, tin in the 4-valent form, antimony, thallium, bismuth and lead suitably in the oxide or hydrous oxide form. Mixtures of metals, for example of bismuth, tin in the 4-valent form, gallium and germanium may be particularly effective.

Abstract: Disclosed is a method of nickel-tungsten-silicon carbide composite plating which comprises the steps of: preparing a plating bath having the following composition;______________________________________ nickel sulfate 0.12-0.16 mol/L sodium tungstate 0.17-0.23 mol/L ammonium citrate 0.30-0.50 mol/L pH 6.0-8.0 bath temperature 60-80 ______________________________________dispersing fine powder of silicon carbide having a grit size of 0.8-1.5 .mu.m in the plating bath with a concentration of 20-60 g/L; and causing electrolysis in the plating bath while mechanically agitating the plating bath, with a cathode current density of 10-30 A/dm.sup.2 by use of a stainless steel plate as an anode.