Abstract: A method is described herein for controlling the oxygen level within an oven while sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.

Abstract: Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances Dfirst (32a) and Dsecond (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of Dfirst (32a) and Dsecond (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).

Abstract: A method for hermetically sealing a device without performing a heat treatment step and the resulting hermetically sealed device are described herein. The method includes the steps of: (1) positioning the un-encapsulated device in a desired location with respect to a deposition device; and (2) using the deposition device to deposit a sealing material over at least a portion of the un-encapsulated device to form a hermetically sealed device without having to perform a post-deposition heat treating step. For instance, the sealing material can be a Sn2+-containing inorganic oxide material or a low liquidus temperature inorganic material.

Abstract: A pane is separated from a moving ribbon of brittle material by restraining the ribbon upstream of a score line prior to separating the pane. The ribbon is restrained by selectively contacting a first side and a second side of the ribbon in one of an opposite, overlapping or offset relation. The ribbon can be restrained prior to, substantially simultaneous with or subsequent to forming the score line. The restrained status of the ribbon is maintained during and immediately after separation of the pane from the ribbon, thereby reducing the introduction of a disturbance or bending moment into the upstream ribbon.

Abstract: An apparatus for use in direct resistance heating of a molten glass-carrying vessel, such as a finer or connecting pipe, is provided. The apparatus comprises a flange comprises a plurality of electrically-conductive rings that include an inner ring joined to the vessel's exterior wall during use of the flange and an outer ring that receives electric current during use of the flange. The innermost ring comprises a high-temperature resistant metal preferably comprising at least 80% platinum, and the outermost ring preferably comprising at least 99.0% nickel. This combination of materials both increases the reliability of the flange and reduces its cost. Either one or both of the width or thickness of one or both of the inner or outer rings varies as a function of angular position relative to the vessel. The width and/or thickness of the inner and the outer rings with relation to each other produces a uniform current distribution in the flange and the vessel.

Abstract: A method for separating sheet of brittle material having a thickness equal to or less than about 1 mm is disclosed. Once an initial flaw or crack is produced, a full body crack can be propagated across a dimension of the brittle material with a laser beam that is substantially absorbed proximate the surface of the sheet to produce sub-sheets. In some embodiments, only a single pass of the laser beam over a surface of the sheet is necessary to separate the sheet. In other embodiments a plurality of passes may be used. Sub-sheets can be further processed into electronic devices by depositing thin film materials on the sub-piece.

Abstract: Stirring apparatuses for stirring molten glass are disclosed. The method includes stirring a molten glass with a stirrer comprising a layer containing at least about 50% iridium. An apparatus comprising an iridium-containing layer is also presented. In one embodiment, an apparatus for stirring molten glass includes a cylinder comprising a bore. A stirrer may be disposed in the bore. The stirrer may include a platinum or platinum alloy shaft coaxial with the cylinder. A plurality of impellers may project radially from the shaft into close proximity of a wall of the cylinder. Each impeller may include an arcuate distal end portion farthest from the shaft. The distal end portion of each impeller consists of iridium or an iridium alloy and the remainder of the impeller consists of platinum or a platinum alloy. The stirring apparatuses reduce metal loss from the refractory metal of the stirring apparatus.

Abstract: Methods of producing a glass sheet comprise the step of fusion drawing a glass ribbon along a draw direction into a viscous zone downstream from a root of a forming wedge. The method further includes the steps of drawing the glass ribbon into a setting zone downstream from the viscous zone and an elastic zone downstream from the setting zone. The method also includes the step of creating a vacuum to force the entire lateral portion of the glass ribbon to engage an anvil portion of a breaking device in the elastic zone. The method still further includes the steps of forming a score line along the lateral portion of the glass ribbon and breaking away a glass sheet from the glass ribbon along the score line while the entire lateral portion is forced against the anvil portion by the vacuum.

Abstract: Methods for assembling an optoelectronic device are provided. The optoelectronic device includes a first transparent substrate, a second substrate, and environmentally sensitive components. The methods comprise the step of applying a fill material to a surface of at least one of the substrates, and lowering a viscosity of the fill material. The methods further comprise the step of pressing the first transparent substrate and the second substrate together such that the fill material substantially fills an area between the first transparent substrate and the second substrate and substantially encapsulates exposed portions of the environmentally sensitive components. The methods still further comprise the step of sealing the first transparent substrate and the second substrate together to hermetically seal the fill material within the area.

Abstract: A laser assisted frit sealing method is described herein that is used to manufacture a glass package having a first glass plate (with a relatively high CTE of about 80-90×10?7° C.?1), a second glass plate, and a frit (with a CTE that is at least about 35×10?7° C.?1), where the frit forms a seal (e.g., hermetic seal) which connects the first glass plate to the second glass plate.

Abstract: A method of cutting glass that prevents uncontrolled crack propagation when high background stress is present, either in the form of thermal residual stress, external mechanical stress or a combination thereof. The method includes masking an edge of the glass by blocking the beam using highly reflective or absorptive material located near the glass surface, or deposited on the surface in a form of a thin film (or highly reflective paint) to prevent uncontrolled crack initiation and propagation starting from the glass edge. The initiation of the laser scoring is located at a predetermined distance from the glass edge. Yet another aspect of the invention embodies stopping propagation of the vent at the exiting end of the score line.

Abstract: A beam shaper is implemented to seal an OLED. The beam shaper comprises a first and second lens and a beam shaper. Changing the relative position of the first, second lens and beam shaper relative to each other enables the beam shaper to generate laser beams with different shapes and intensity profiles.

Abstract: A sealing apparatus for use in conveying molten glass from a first vessel to a second vessel, wherein at least a portion of the first vessel is nested within the second vessel without contact between the first and second vessels, and a flexible member comprising a gas-tight seal separates an atmosphere enclosed by the sealing apparatus and an ambient atmosphere. The sealing apparatus is useful for flexibly sealing a non-contact joint between conduits for supplying molten glass to a forming body.

Abstract: Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances Dfirst (32a) and Dsecond (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of Dfirst (32a) and Dsecond (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).

Abstract: An antimony-free glass suitable for use in a frit for producing a hermetically sealed glass package is described. The hermetically sealed glass package, such as an OLED display device, is manufactured by providing a first glass substrate plate and a second glass substrate plate and depositing the antimony-free frit onto the first substrate plate. OLEDs may be deposited on the second glass substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first glass substrate plate to the second glass substrate plate and also protects the OLEDs. The antimony-free glass has excellent aqueous durability, good flow, low glass transition temperature and low coefficient of thermal expansion.

Abstract: In the formation of sheet material from molten glass, molten glass is formed in a melting furnace and transported through a precious metal delivery system to the forming apparatus. Disclosed herein is a method to mitigate carbon contamination of individual components of the precious metal delivery system prior to and/or during their use. The method involves coating portions of the precious metal with an oxygen generating material prior to assembly of the component, and may comprise one or more heat treating steps of the component in an oxygen-containing atmosphere.

Abstract: An apparatus for making a glass sheet includes a forming wedge with a pair of inclined forming surface portions converging along a downstream direction to form a root. The apparatus further includes an edge director intersecting with at least one of the pair of downwardly inclined forming surface portions, and a thermal shield configured to reduce heat loss from the edge director. Methods are also provided for reducing heat loss from the edge director with a thermal shield.

Abstract: A method of scoring and/or separating a brittle material is described comprising heating a surface of the brittle material along a predetermined path with a laser, then quenching the heated surface with a stream of cooling liquid, such as water, formed by a nozzle. The portion of the cooling stream impinging on the surface of the brittle material is a substantially columnar flow.

Abstract: A method is described herein for controlling the oxygen level within an oven while sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition or rare earth metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and/or cerium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device.