Abstract: A circuit that includes a core device that is embedded within fixed interfacing logic circuitry that, in turn, is embedded in an FPGA fabric. The FPGA fabric may be configured into a test mode of operation to test either the embedded device or fixed logic devices formed within the fixed interfacing logic. While the FPGA is configured in a test mode, test circuitry and communication paths are made present within the fixed interfacing logic circuitry to facilitate the testing. Additionally, the test circuitry comprises isolation circuitry that is formed between various modules and circuits that are to be tested to isolate the device under test and to produce test signals thereto and there from during testing operations.

Abstract: A system for driving a differential signal on a signal line and converting the differential signal from a rail-to-rail differential signal to a small signal differential signal is described. An exemplary embodiment of the circuit includes a first programmable differential driver circuit receiving a differential input; a programmable delay circuit receiving the differential input and coupled to a second programmable differential driver circuit; and a summation circuit coupled to the first and second differential driver circuits.

Abstract: A high-speed optical transceiver for an integrated circuit (IC) includes a serializer-deserializer (SERDES) and a vertical cavity surface emitting laser (VCSEL) combined with a detector array. By covalently bonding the SERDES die to the IC, the two components can be processed simultaneously to produce a tightly aligned, high-speed data interface. The SERDES can be coupled to the VCSEL/detector array using a flex interconnect, or the VCSEL/detector array can also be covalently bonded to the IC or SERDES to maximize data bandwidth. The SERDES and VCSEL/detector array can also be produced in a single die using a process technology appropriate for both to maximize manufacturing efficiency.

Abstract: A test arrangement is designed to test whether one in a chain of vias or contacts has abnormally high resistance. The arrangement contains a plurality of via or contact chains and a plurality of decoders. The chains are switchably connected to a resistance measurement device. Each decoder has a unique address such that it will generate a control signal when a predetermined address is address thereon. The control signal is used to close a switch, which connect one of the chains to the resistance measurement device. By sequentially applying different addresses to the decoders, the resistance of the chains can be individually measured.

Abstract: An inductive amplifier having a feed forward boost is provided, thereby improving the gain of the inductive amplifier at frequencies greater than 1 GigaHertz. The inductive amplifier includes a feed-forward boost circuit coupled to intermediate nodes of an inductive amplifier circuit, whereby the feed-forward boost circuit generates boost currents that are added to the currents of the inductive amplifier circuit. In one embodiment, the feed-forward boost circuit includes a boost current supply, a first boost transistor coupled between the current supply and a first intermediate node of the inductive amplifier circuit, and a second boost transistor coupled between the current supply and a second intermediate node of the inductive amplifier circuit. In one embodiment, the first and second boost transistors and the inductive amplifier circuit are controlled by the same differential input signals.

Abstract: An application specific processor for an application program is provided. First a software description, for example, a HDL description, of a processor is created. A user program is written using the processor's instruction set and compiled and/or assembled into object code. The software description of the processor and the object code are combined and synthesized into a logic gate circuit description, which may be implemented in a Field Programmable Gate Array (FPGA), a Complex Programmable Logic Device (CPLD) or any other Integrated Circuit (IC) having programmable logic modules. Typically, the logic gate circuit description is optimized, hence reducing the number of logic gates and the resources needed.

Abstract: An integrated circuit (IC) with programmable circuitry having programmable functions and programmable interconnections. The IC further includes: a first module having an output with a first fixed data width or first variable data width; a second module having an input with a second fixed data width or a second variable data width; and a data width converter receiving data from the output of the first module and sending the data to the input of the second module, the data width converter configured to convert data from the first fixed data width or first variable data width to the second fixed data width or the second variable data width.

Abstract: A transmit variable-width interface can be programmed to convert an electronic digital data path that is either 1N, 2N, 4N, or 8N bits wide into a data path that is 2N bits wide, either by serializing bits (4N- or 8N-bit cases), re-clocking bits (2N-bit case), or grouping bits (1N-bit case). A receive variable-width interface can be programmed to convert a data path 2N bits wide into a data path that is 1N, 2N, 4N, or 8N bits wide. The widths of the two variable-width data paths are controlled independently. The variable-width interfaces are coupled between a multi-gigabit transceiver and core logic of a programmable logic device. The incoming and outgoing data paths of the variable-width interfaces have separate clocks signals that are synchronized such that small amounts of skew in these clock signals do not disrupt the operation of the variable-width interfaces.

Abstract: A method of partially reconfiguring an IC having programmable modules that includes the steps of reading a frame of configuration information from the configuration memory array; modifying at least part of the configuration information, thereby creating a modified frame of configuration information; and overwriting the existing frame of configuration information in the configuration memory array with the modified frame, thereby partially reconfiguring the IC.

Abstract: A method and system for configuring the transmit and receive elements or structures in connector such that crosstalk can be reduced. The connector connects serdes modules in first PCB to serdes modules in one or more second PCBs via a backplane. The connector includes: first and second transmit connection positions in a first direction; first and second receive connection positions; and a ground shield positioned in the first direction between the first and second transmit connection positions and the first and second receive connection positions, wherein the first and second transmit connection positions do not have an interposing ground shield in another direction.

Abstract: Disclosed are methods for utilizing programmable logic devices that contain at least one localized defect. Such devices are tested to determine their suitability for implementing selected designs that may not require the resources impacted by the defect. If the FPGA is found to be unsuitable for one design, additional designs may be tested. The test methods in some embodiments employ test circuits derived from a user's design to verify PLD resources required for the design. The test circuits allow PLD vendors to verify the suitability of a PLD for a given user's design without requiring the PLD vendor to understand the user's design.

Abstract: Described are high-speed differential flip-flops. A flip-flop in accordance with one embodiment incorporates some combinational logic, eliminating the need for separate combinational logic when the flip-flop is employed in certain circuit configurations. A flip-flop in accordance with another embodiment includes differential input and output stages, each of which includes a transistor connected across its differential output terminals. The transistors are clocked to short the differential output terminals between expressions of logic levels, thereby limiting the maximum amount of voltage swing required to express subsequent logic levels.

Abstract: A wafer of integrated circuits under test (ICUT) is tested by supplying power to the ICUTs using power and ground traces that extend between rows of the ICUTs in scribe streets. Test information is supplied to each ICUT by transmitting the test information optically onto the entire wafer. A diode on each ICUT receives the optical test information. The ICUT uses the test information to perform a self-test. Each ICUT has a diode for transmitting optical test information. All ICUTs on the wafer transmit results of the self-tests at the same time. A test device receives the optical test information and identifies the information from each of the many ICUTs, one from another. An entire wafer of ICUTs is therefore tested simultaneously without using a probe card either to power an ICUT or to supply test information to or receive test information from an ICUT.

Abstract: Described are high-speed parallel-to-serial converters. The converters include data combiners with differential current-steering circuits that respond to parallel data bits by producing complementary current signals representing a differential, serialized version of the parallel data bits. One embodiment includes inductive and resistive loads to equalize the gain over the frequency of interest to reduce data-deterministic jitter.

Abstract: A test arrangement is designed to test whether one in a chain of vias or contacts has abnormally high resistance. The arrangement contains a plurality of via or contact chains and a plurality of decoders. The chains are switchably connected to a resistance measurement device. Each decoder has a unique address such that it will generate a control signal when a predetermined address is address thereon. The control signal is used to close a switch, which connect one of the chains to the resistance measurement device. By sequentially applying different addresses to the decoders, the resistance of the chains can be individually measured.

Abstract: A voltage of an input analog signal (105 or 405) can be converted to a signal whose frequency is dependent upon the analog input signal (135 or 435). A frequency divider (115 or 415) can be configured to convert the frequency dependent signal to a frequency divided signal (140 or 440). A first frequency detector (420a) or time detector (120a) can be configured to determine the frequency of the frequency divided signal, thereby creating a first output signal (145a or 445a). A second frequency detector (420b) or time detector (120b) can be configured to determine the frequency of the frequency dependent or non-frequency divided signal, thereby creating a second output signal (145b or 445b). The first and second output signals can be post-processed to generate a digital output signal (130 or 430) that is representative of the input analog signal.

Abstract: Interconnecting logic provides connectivity of an embedded fixed logic circuit, or circuits, with programmable logic fabric of a programmable gate array such that the fixed logic circuit functions as an extension of the programmable logic fabric. The interconnecting logic includes interconnecting tiles and may further include interfacing logic. The interconnecting tiles provide selective connectivity between inputs and/or outputs of the fixed logic circuit and interconnect of the programmable logic fabric. The interfacing logic, when included, provides logic circuitry that conditions data transfers between the fixed logic circuit and the programmable logic fabric. In one operation, the programmable logic fabric is configured prior to the startup/boot sequence of the fixed logic circuit. In another operation, the fixed logic circuit is started up and is employed to configure the programmable logic fabric.

Abstract: A buffer employs an input stage with an active, LC load. The active load includes integrated inductors that combine with the parasitic gate capacitances of a pair of transistors in a negative-transconductance (−Gm) booster configuration. The resulting active load emphasizes a desired frequency, improving the quality, or “Q,” of the input stage, and consequently of the entire buffer.

Abstract: An active inductance circuit for ESD parasitic cancellation is described. A feedback circuit on a transconductance amplifier is utilized to transform and reflect the impedance of an active inductor to minimize effects of parasitics produced by ESD circuitry. The active inductance circuit may be programmably implemented, allowing tunable component values.

Abstract: The present invention provides a method for breakpoint stepping a multi-bus device. The multi-bus device includes a breakpoint unit capable of detecting bus events on multiple busses. The breakpoint unit is originally programmed to break on the detection of a specified bus event on a bus selected from multiple busses. After the specified bus event has been detected and the device has entered one of several possible frozen states, the breakpoint unit may be programmed to detect a new bus event on a bus selected from multiple busses. The method is repeated as needed to achieve breakpoint stepping, including single stepping.