Abstract: A electrolytically deposited copper foil has a roughening treatment of copper on the shiny side and on the matte side a fine nodular metal deposit preferably copper or a copper alloy which improves adhesion to a substrate, but is insufficient to increase the measured surface roughness Rz.

Abstract: Oligomers of particular usefulness in coatings are vinyl ether terminated polyester oligomers which include 4,8-bis(hydroxymethyl) tricyclo?5.2.1.0.sup.2,6 !decane (BHTD).

Abstract: This invention relates to a black glass fiber which is resistant to oxidation at a temperature of about 1350.degree. C. and has the empirical formula SiC.sub.x O.sub.y where x ranges from about 0.5 to about 2.0 and y ranges from about 0.5 to about 2.0. This invention also relates to a process for preparing a black glass fiber comprising reacting a silicon hydride group with a silicon olefinic group in the presence of a hydrosilylation catalyst to give a cyclosiloxane polymer. The polymer is then spun into fiber, hardened and then pyrolyzed to give a black glass fiber.

Abstract: A permanent solder mask is applied to the surface of a printed circuit board using a copper foil carrier. The solder mask preferably is one or two layers of a thermosetting resin e.g. epoxy resin. Selected circuit features are exposed by etching away portions of the copper foil and removing the underlying thermosetting resin. Then, the remaining copper foil is removed, leaving the solder mask on the surface of the printed circuit board.