Abstract: The invention relates to a synthetic fiber fabric having translucent printing (dyeing) patterns thereon. The invention also relates to a process for producing a synthetic fiber fabric having translucent printing (dyeing) patterns thereon, which includes a printing step prior to an etching step, wherein the printing step includes printing a paste for dyeing and/or printing containing a transparent printing developer onto a surface of the fabric.

Abstract: The present invention mainly provides a fusion antigen specific for a target cell comprising a ligand moiety which is capable of reacting, recognizing or binding to the receptors on the target cell, a Pseudomonas exotoxin A translocation domain II, an antigenic moiety, and a carboxyl terminal moiety which permits combination of the fusion antigen to the endoplasmic reticulum (ER) membrane of the target cell. A method of immunizing an animal using the fusion antigen is also provided.

Abstract: A method for improving drastically both the selectivity and yield of hydrogen peroxide in the direct oxidation of hydrogen to hydrogen peroxide over a solid catalyst comprising palladium, which comprises: i) depositing on the solid catalyst at least two halogen containing compounds, one compound essentially comprising bromine and second compound essentially comprising fluorine with the bromine to palladium and fluorine to palladium atom ratios in the range from 0.02 to 20 and from 0.01 to 50, respectively; ii) decomposing the halo compounds deposited on the solid catalyst by calcination at a temperature above 200° C. under inert, reducing or oxidizing gas atmosphere or under vacuum; and iii) contacting the solid catalyst obtained from step (ii) with a gas mixture consisting of hydrogen and oxygen or air or O2 enriched air in an aqueous reaction medium, comprising a mineral acid at the following reaction conditions: concentration of mineral acid in the reaction medium above 0.

Abstract: A method and apparatus controls intake air humidification spraying with at least two spraying nozzles (1a, 1b, 1c, 1d) for spraying a liquid into the intake air. When an amount of the liquid to be supplied through the spraying nozzles increases, liquid flow passages are opened for more nozzles (1a, 1b, 1c, 1d) and/or the liquid flow is directed into a flow passage leading to one of the spraying nozzles that permits a larger liquid flow per unit of time than another of the spraying nozzles, and when an amount of the liquid to be supplied through the nozzles decreases, liquid flow channels are closed at least for one of the spraying nozzles (1a, 1b, 1c, 1d) and/or the liquid flow is directed to one of the spraying nozzles that permits a smaller liquid flow per unit of time than another of the spraying nozzles.

Abstract: Provided is a resistor for controlling a fan motor rotating speed for use in an air conditioner. The resistor comprises a base body, a radiator attached to a top portion of the base body, a printed resistor circuit board covered with insulating sheets and received within the radiator, a fixture plate placed on a front surface of the radiator to isolate the printed resistor circuit board from the outside, and a temperature fuse spot-welded to upper connecting tip ends of the printed resistor circuit board at a top portion of the radiator. A fastener portion of an arc shape is formed on a top portion of the fixture plate to wrap around and fixedly support the temperature fuse. This reduces the manufacturing cost of the resistor, while improving the manufacturability and reliability thereof.

Abstract: An integrated circuit structure for MOS-type devices including a silicon substrate of a first conductivity type; a first gate insulating regions selectively placed over the silicon substrate of the first conductivity tape; a first polycrystalline silicon layer selectively placed over the silicon substrate of the first conductivity type; a second gate insulating regions selectively placed over the first gate insulating regions and the first polycrystalline silicon layer; a second polycrystalline silicon layer selectively placed over the second gate insulating regions; first buried silicon regions of a second conductivity type, buried within the silicon substrate of the first conductivity type, placed under the first polycrystalline silicon layer and in contact therewith; and second buried silicon regions of the second conductivity type, buried within the silicon substrate of the first conductivity type, placed under the second gate insulating regions, under the second polycrystalline silicon layer and insulate

Abstract: A method of preparing a surface of a substrate for bonding by removing oxide and altering the atomic surface of the substrate is described. The method comprises, providing a substrate comprised of a plurality of elements. The substrate is held at an elevated temperature and an over-pressure of gas is allowed to flow over the surface of the substrate. The gas over-pressure is comprised of an element found in the plurality of elements. Holding the substrate at an elevated temperature helps removes essentially all the oxide on the surface of the substrate. However, the elevated temperatures also evaporate certain atoms on the substrate surface and cause other atoms on the substrate surface to migrate. Flowing a gas over the surface of the substrate, helps to replace the atoms which have evaporated thereby preventing movement of other atoms. After removing the oxide, the substrate is allowed to cool.