Patents Represented by Attorney Larry Cutter

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  • Local condensation control for liquid impingement two-phase cooling
    Patent number: 5412536
    Abstract: Cooling module geometry provides a method for controlling local condensation for liquid impingement two-phase cooling of electrical and/or electronic circuit chips. The method and apparatus described herein uses vapor condensation in the exhaust flow from each chip site within a multi-chip module which utilizes direct liquid impingement with phase change.
    Type: Grant
    Filed: March 28, 1994
    Date of Patent: May 2, 1995
    Assignee: International Business Machines Corporation
    Inventors: Timothy M. Anderson, Gregory M. Chrysler, Richard C. Chu, Robert E. Simons