Abstract: A method for determining the effect of load impedance on the magnitude and phase of loop gain of a power converter apparatus to aid in predicting stability of the converter apparatus under various operating conditions. The converter apparatus has an open-loop output impedance and provides an output signal to an output locus.

Abstract: An apparatus for controlling start up of supply voltages received from a power supply responding to control by a feedback signal includes: (a) first error amplifiers receiving a supply voltage at a first terminal, receiving a reference voltage at a second terminal and providing a first error signal to a switch indicating difference between the signals at the terminals; and (b) second error amplifiers having a first node coupled with the switch and for receiving the supply voltage and a second node receiving a reference voltage; the first node receives a sum of the first error signal and the supply voltage when the switch is in a first orientation, and receives the supply voltage when the switch is in a second orientation; each second error amplifier provides a second error signal indicating a difference between signals received at the nodes that is the feedback signal for controlling the power supply.

Abstract: An apparatus for coupling a signal supply with an antenna including first and second elements. The signal supply delivers a signal to the antenna at a connection locus. The first element has a first edge and the second element has a second edge; the connection locus includes part of the first and second edges. The apparatus includes a first and second feed structure. The first feed structure extends a feed distance from the signal supply to the second edge and divides the first element into two lands in spaced relation with the first feed structure to establish a separation distance intermediate the first feed structure and the two lands. The second feed structure couples the signal supply with the first proximal edge. The separation distance establishes a signal transmission structure between the two lands and the first feed structure.

Abstract: A system for locating of objects in a three-dimensional space comprises: (a) an impulse radio network including at least three reference impulse radio units and at least one mobile position indicating apparatus; position information relating the impulse radio units is recorded by at least one indicating impulse radio unit; the impulse radio units are in communication; and (b) an affixing structure for affixing a respective mobile position indicating apparatus with a respective object. A respective mobile position indicating apparatus transmits an impulse radio identifying signal that is received by a receiving impulse radio unit. An indicating impulse radio unit cooperates with the receiving impulse radio unit in using the identifying signal for developing coordinate information for locating the respective mobile position indicating apparatus.

Abstract: An antenna for transferring electromagnetic energy includes: (a) a ground element in a ground plane; (b) a transceiver element in a transceiver plane that intersects the ground element at a first end in a joint having a first terminus and a second terminus; and (c) a feed structure that conveys the electromagnetic energy intermediate the transceiver and the host device. A first transceiver edge departs from the joint in a first path in a first direction. A second transceiver edge departs from the joint in a second path in the first direction. Each edge includes at least a first edge sector having a first radius and a second edge sector having a second radius. The radii define a separation between the edge sectors. The first and second edge terminate in a terminal structure at a second end that is spaced from the ground element to establish a gap.

Abstract: An apparatus is disclosed for facilitating heat dissipation in an electrical device hat includes a core structure traversing a substrate when the core structure is in an installed orientation. The apparatus comprises: (a) at least one aperture through the substrate for accommodating traversing by the core structure; each respective aperture has periphery defined by a respective circumjacent face extending a height substantially equal with the substrate thickness; (b) a layer of thermally conductive material situated discontinuously on the circumjacent face of at least one respective aperture. The respective aperture is configured to establish a thermally conductive engagement with at least one facing portion of the core structure traversing the respective aperture in the installed orientation.

Abstract: An apparatus for generating a supply signal at a predetermined frequency comprises a digital synthesizer connected with an oscillator and a processor; and a temperature sensor connected with the processor. The oscillator provides a periodic excitation signal to the synthesizer, which responds by recurrently accumulating bits in quantum bit step amounts to a maximum bit capacity and returning to a starting bit count in a bit accumulating period. The synthesizer generates the supply signal based upon the bit accumulating period. The processor provides a control signal to the synthesizer to control the quantum bit step amount. The temperature sensor and the processor cooperatively employ a predetermined temperature parameter-correction factor relationship to adjust the control signal to set the quantum bit step amount to establish the bit accumulating period appropriately for the predetermined frequency.

Abstract: An improved package for a semiconductor device. The semiconductor device includes an apparatus having at least two access leads to facilitate electrical connection of the apparatus within an electrical circuit. The package has generally a closed polyhedral shape presenting a plurality of faces and substantially insulatingly surrounding the apparatus in a manner leaving the access leads exposed for effecting electrical connection. The access leads extend a distance from exit loci from the package. The exit loci are situated on an exit face of the package, adjacent pairs of exit loci being generally in a common plane. An intraplanar distance within the common plane is established intermediate each adjacent pair of the exit loci. The improvement comprises configuring the exit face to establish an on-surface path greater than the intraplanar distance intermediate selected adjacent pairs of the exit loci.

Abstract: A package for an electrical apparatus is disclosed. The electrical apparatus includes a plurality of electrical components; the package comprises: (a) a first circuit board having a top side and a bottom side, and having a first array of the plurality of components arranged on at least one side of the top side and the bottom side; (b) a second circuit board in electrical and mechanical connection with the first circuit board; the second circuit board has a first side and a second side. The first side faces the top side of the first circuit board. The second circuit board has a second array of the plurality of components arranged on the first side. The second circuit board preferably has at least one heat dissipating structure substantially integrally affixed on the second side. Preferably, the second side is a metal substrate and the first side is electrically insulated from the second side.

Abstract: An improved circuit board apparatus configured for mounting electronic components in a circuit arrangement. The apparatus comprises a metal substrate having a first side and a second side, a first-side laminar structure and a second-side laminar structure. The first-side laminar structure includes at least one first-side conductive stratum alternated with at least one first-side dielectric stratum affixed at the first side The second-side laminar structure includes at least one second-side conductive stratum alternated with at least one second-side dielectric stratum affixed at the second side of the metal substrate. The apparatus further comprises a plurality of electrically conductive interside courses intermediate selected first-side strata of the at least one first-side conductive stratum and selected second-side strata of the at least one second-side conductive stratum.