Abstract: A method is provided for connecting two conductive layers in an electronic circuit package including the steps of placing one or more blind vias in a first substrate positioned on top of a first conductor; placing one or more blind vias in a second substrate positioned under a second conductor; attaching one or more signal lines to one or more of the one or more blind vias; and assembling ball grid array components such that the first conductor is electrically connected to the second conductor. Also claimed is an electronic circuit package incorporating the blind vias for electrical connection between layers in accordance with the present invention.

Abstract: An electronic computer including microprocessor means, memory means and Input/Output (I/O) means wherein the I/O means comprises a retractable optical fiber connector assembly. The retractable optical fiber connector assembly includes a rotatable spool and a pair of optical fibers for being wound thereabout, these fibers in turn optically connected to optoelectronic means within the computer (as part of the I/O means). On the opposing ends of these optical fibers are desired connectors (e.g., those of the push-pull variety) for being connected to associated optical-type connectors which in turn may form part of various peripheral equipment (e.g., MODEMS, printers, etc.) or other computers to which this computer may be connected.