Patents Represented by Law Firm Lerner, David, Littenberg, Krumhutz & Mentlik
  • Method for soldering electronic components
    Patent number: 5526978
    Abstract: A method for soldering an electronic component capable of accomplishing satisfactory soldering of an electronic component using paste solder even in an oven constructed into a non-closed structure which causes flowing of an ambient atmosphere. Dehumidified air is introduced through a dehumidified air inlet section into the oven to keep a dehumidified atmosphere in the oven, to thereby prevented activity of flux contained in the paste flux from being deteriorated.
    Type: Grant
    Filed: April 6, 1994
    Date of Patent: June 18, 1996
    Assignee: TDK Corporation
    Inventors: Toshiyuki Nagatsuka, Yumiko Iijima, Hiroyuki Ohira