Abstract: An image without use of a flash is taken, along with an image using a flash. A difference image is generated by subtracting the flash-less image from the flash image. A threshold is applied to the difference image such that only large differences in intensity remain in the difference image. This artifact image is then subtracted from the flash image, thereby removing flash artifacts such as specular reflections and red-eye. The threshold used may be automatically calculated or may be set by the user. For some applications it may be desirable to set separate thresholds for each dimension of the color space (such as red, green, and blue) used. Once again these separate thresholds may be automatically calculated or may be set by the user.

Abstract: An electrical connector is constructed with at least one pin configured to provide different resistance values as the pin is engaged with a socket. When the connector is fully engaged with the socket the resistance of the connector is at a zero or minimal value. When the pin first contacts the socket, the pin includes a high series resistance minimizing the sudden inrush of current to an electrical device, and minimizing any arcing between the pin and the socket. As the pin engages the socket this series resistance decreases allowing the electronic device to utilize its full designed current with only minimal contact resistance between the pin and the socket.

Abstract: A power connector is configured to float on a computer backplane allowing bulk power supplies to be physically located adjacent to the backplane. This allows use of an EMI gasket between the bulk power supply and the backplane preventing high frequency noise from radiating out of the computer case. Standard electrical plugs may be used on one or both sides of the power connector allowing standard bulk power supplies and line cords to be used on one or both sides of the power connector.

Abstract: A variable gap thermal interface is coupled with a cold or hot plate, forming a low thermal resistance connection between an electronic device module containing at least one heat generating electronic device and a rack or other structure. The variable gap thermal interface and the cold or hot plate are provided in a configuration to allow quick-disconnect of the electronic device module from the rack, allowing for a wide dimensional tolerance between the module and the rack while maintaining a reliable thermal connection. An embodiment including a plurality of server modules within a server rack in conformance with the present invention, allows the replacement of server modules while powered without any disconnection or reconnection of hoses to cold plates used in cooling the server modules, thus greatly reducing the probability of leaks and resulting damage to the system.

Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.

Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector. Also optionally, heat-generating devices may be mechanically and electrically coupled with the second printed circuit board through interposers configured (upon assembly) to raise the heat-generating devices through the openings in the first printed circuit board to contact a heat sink.

Abstract: An image capture device, such as a scanner, is built including hardware necessary to capture both reflective and transmissive image data from a transparency. The device may associate the two types of data internally or rely on other hardware, such as a controlling computer, to do the association of the two quantities of data. In one possible embodiment, the device would include the ability to perform optical character recognition (OCR) of the reflective data (or the transmissive data, if desired), converting to a type of text format any printing on the transparency.

Abstract: In a computer graphics system, displaying any given graphics data on a monitor, the type of compression of screen data is chosen during processing. Further, the compression technique is allowed to vary on a per row basis within a block of pixels. The type of compression is encoded with the screen data and stored in screen memory. As the compressed graphics is read from screen memory just prior to display, the screen data is decompressed.

Abstract: An apparatus and method of selectively over-sampling image data, anti-aliasing of polygons that produces quality images comparing favorably to full over-sampling techniques while requiring less computation than full over-sampling techniques. Using a hierarchical tiler to perform edge calculations for any given polygon, and then selectively over-sampling pixels along the edge, image quality may be greatly improved through anti-aliasing the polygon edges, with a small increase in computation time or hardware.

Abstract: A method for the fabrication of electrical contacts using metal forming, masking etching, and soldering techniques is presented. The method produces a plurality of specialized electrical contacts, capable of use in an interposer, or other device, including non-permanent or permanent electrical connections providing contact wipe, soft spring rates, durability, and significant amounts of travel.

Abstract: A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be co-planar with each other due to tolerance stack-up or parallel with the heat sink body. A pedestal is attached to the substrate to support the heat sink body. A plug or floating pedestal is placed on top of each heat-generating device and held within the pedestal allowing sufficient movement for the bottom surface of the plug to fully contact the top surface of the heat-generating device. A quantity of a low melting temperature, thermally conductive material, such as solder, or a thermally conductive liquid, is placed over each plug and a heat sink body is placed over the assembly. When heated, the thermal material melts, forming a low impedance thermal junction between the plug and the heat sink body regardless of planarity differences between the two devices.

Abstract: An electrical connector is constructed including heat-spreading devices in order to reduce hotspots within the connector and to efficiently dissipate heat to the surrounding atmosphere, thus increasing the current carrying capability of the connector.

Abstract: An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing liquid accumulates at the base of the fins and is collected by a pump for redistribution. The pump is coupled to a fan blade, which in turn is operated by a motor. A seal is formed between the multi-chip module and the integrated housing. The assembly is designed such that this seal need not be broken to service the motor, thus minimizing the amount of vapors from the working fluid lost into the atmosphere. Case fins and fan blades are arranged for improved efficiency.

Abstract: A method for the fabrication of electrical contacts using metal forming, masking, etching, and soldering techniques is presented. The method produces a plurality of specialized electrical contacts, capable of use in an interposer, or other device, including non-permanent or permanent electrical connections providing contact wipe, soft spring rates, durability, and significant amounts of travel.

Abstract: An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing liquid accumulates at the base of the fins and is collected by a pump for redistribution. The pump is coupled to a fan blade, which in turn is operated by a motor. A seal is formed between the multi-chip module and the integrated housing. The assembly is designed such that this seal need not be broken to service the motor, thus minimizing the amount of vapors from the working fluid lost into the atmosphere. Case fins and fan blades are arranged for improved efficiency.

Abstract: A probe tip adapter with easily interchangeable termination. It includes an empty circuit substrate with which the user may construct a probe adapter circuit designed specifically for almost any measurement situation. Also, several standard termination circuits may be easily interchanged by the user to allow the same probe tip adapter to work with transmission lines of different impedance.

Abstract: A connector for electrically and mechanically connecting two circuit boards at a substantially 90-degree angle. The 90-degree connector may include surface mount devices, connections for mechanically attaching to circuit boards, surface mount pads or pins for electrically connecting to the circuit boards. A printed circuit board connector constructed from materials with characteristics closely matching backplane and daughter card, minimizes reflections at interface and provides optimal signal performance. Connectors are manufactured using a process substantially similar to current printed circuit board processes allowing easy manufacturing. The connector may be manufactured from laminated printed circuit boards in a planar or cylindrical configuration.

Abstract: The addition of an array of transistors through areas of the circuit where active devices normally don't exist, such as under routing channels. By connecting this array of transistors such that the gates are tied to one power supply and the sources and drains to another, the transistors act as bypass capacitors between the power supplies and act to reduce noise on the supplies. Also, the transistors may later be reconnected through changes in the design to form diodes, inverters, buffers, or other logic gates to allow changes to the circuit late in the design cycle.