Patents Represented by Attorney, Agent or Law Firm Leudeka, Neely & Graham PC
  • Patent number: 7781622
    Abstract: The present invention provides a process for direct hydroxylation of aromatic hydrocarbons like benzene to phenol, toluene to cresols and anisole to methoxy phenols by using hydrogen peroxide as environmentally benign oxidant in polar solvent like acetonitrile using vanadium phthalocyanine or its derivative as a catalyst, at a temperature in the range of 25-100° C.
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: August 24, 2010
    Assignee: Council of Scientific & Industrial Research
    Inventors: Suman Lata Jain, Jomy K. Joseph, Sweety Singhal, Bir Sain, Ragunathan Sivakumaran, Basant Kumar
  • Patent number: 7368396
    Abstract: A process for etching semiconductor substrates using a deep reactive ion etching process to produce through holes or slots (referred to collectively as “slots”) in the substrates. The process includes applying a first layer to a first surface of substrate to provide an etch mask material layer on the first surface of the substrate. A second layer is applied to a second surface of the substrate to provide an etch stop material layer on the second surface of the substrate. The first layer and the second layer have similar solubilities in one or more organic solvents. The substrate is etched from the first surface of the wafers to provide a slot in the substrate. After etching the substrate, the etch mask material layer and the etch stop material layer are removed by contacting the first surface and the second surface of the substrate with a single organic solvent.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: May 6, 2008
    Assignee: Lexmark International, Inc.
    Inventors: James M. Mrvos, Girish S. Patil, Karthik Vaideeswaran
  • Patent number: 7364268
    Abstract: An improved photoimaged nozzle plate for a micro-fluid ejection head, a micro-fluid ejection head containing the nozzle plate, and methods for making a micro-fluid ejection head. The improved nozzle plate is provided by a photoresist nozzle plate layer applied to a thick film layer on a semiconductor substrate containing fluid ejector actuators. The photoresist nozzle plate layer has a plurality of nozzle holes therein. Each of the nozzle holes are formed in the nozzle plate layer from an exit surface of the nozzle plate layer to an entrance surface of the nozzle plate layer. Each of the nozzle holes has a reentrant hole profile with a wall angle greater than about 4° up to about 30° measured from an axis orthogonal to a plane defined by the exit surface of the nozzle plate layer.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: April 29, 2008
    Assignee: Lexmark International, Inc.
    Inventors: Brian C. Hart, Gary A. Holt, Jr., Melissa M. Waldeck, Sean T. Weaver, Gary R. Williams
  • Patent number: 6421829
    Abstract: A method of making a face mask including the steps of providing a plurality of lengths of Grade 2, commercially pure titanium wire, having a diameter of from about 0.21 to about 0.24 inches; forming each length at room temperature to a desired bend angle by bending the member at room temperature using rotary bending apparatus to a first bend angle that is from about 1.25 to about 1.35 times greater than the desired bend angle; and welding each of the thus formed lengths to at least one other of the lengths in an ambient, oxygen containing environment.
    Type: Grant
    Filed: July 23, 2001
    Date of Patent: July 23, 2002
    Assignee: Mad Partners
    Inventors: P. David Halstead, Garry W. McNabb, David E. Wright
  • Patent number: D624985
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: October 5, 2010
    Assignee: EOD Technology, Inc.
    Inventors: Kerry L. Kreiman, Mark C. Englert, William R. Brown, Jr., Donald Ray Buttrey, Matthew G. Hughs
  • Patent number: D411688
    Type: Grant
    Filed: February 12, 1998
    Date of Patent: June 29, 1999
    Inventor: John C. Horton