Patents Represented by Attorney, Agent or Law Firm Liniak, Berenato, Longacre & White, L
  • Patent number: 6354634
    Abstract: A coupling device for joining pipe ends has at least one pressing sleeve which can be slipped on a pipe end and pressed together with the pipe end. The pressing sleeve is elastically designed in the area of its inner surface pressed on the pipe end so that an expansion of the pipe end caused by temperature variations can be absorbed by elastic shear deformation of the elastic area, without causing the pipe end to slide in the pressing sleeve.
    Type: Grant
    Filed: December 8, 1999
    Date of Patent: March 12, 2002
    Assignee: Novopress GmbH Pressen und Presswerkzeuge & Co. KG
    Inventor: Helmut Dischler
  • Patent number: 6342564
    Abstract: A hetrophasic polypropylene copolymer having a tensile modulus of 420 Mpa or less comprising: i) a semi-crystalline propylene:ethylene: and optionally other &agr;-olefin polymer matrix; ii) an elastomeric propylene:ethylene and optionally other &agr;-olefin copolymer.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: January 29, 2002
    Assignee: Borealis Technology Oy
    Inventors: Paivi Pitkanen, Bo Malm, Kauno Alastalo
  • Patent number: 6335082
    Abstract: To produce a reformed medium density fiber (MDF) product, a reforming process is performed on a pre-finished MDF board having at least one pre-finished surface which, in turn, carries at least one coating. The process comprises the steps of: placing the pre-finished medium density fiber board in a heated press mold; closing the heated press mold while the pre-finished medium density fiber board is located therein; applying pressure and heat to the pre-finished medium density fiber board using the heated press mold so that the pre-finished surface(s) is (are) reformed without cracking, bubbling, or removal of the coating(s); opening the heated press mold; and removing the pre-finished medium density fiber board from the heated press mold. The application of pressure and heat preferably is such that the board becomes reformed, preferably no greater than 0.045 inch into the board.
    Type: Grant
    Filed: February 3, 1999
    Date of Patent: January 1, 2002
    Assignee: MDF, Inc.
    Inventor: Ralph A. Martino