Patents Represented by Attorney M. I. Fihston
  • Patent number: 5049982
    Abstract: Disclosed is an article comprising a stacked array of electronic subassemblies, each subassembly including one or more integrated circuits and a thermally conductive base member that is perforated with holes. Motivating means are provided for causing a coolant fluid to pass through the holes in a direction substantially parallel to the stacking axis.
    Type: Grant
    Filed: May 10, 1990
    Date of Patent: September 17, 1991
    Assignee: AT&T Bell Laboratories
    Inventors: Yung-Cheng Lee, John M. Segelken