Abstract: Compositions curable to pressure sensitive adhesives are disclosed which comprise from 30 to 50 parts of a vinyl endblocked polydiorganosiloxane fluid having a viscosity from 500 to 10,000 centipoise at 25.degree. C., from 50 to 70 parts of a benzene soluble resin copolymer havingR.sub.3 SiO.sub.1/2 units and SiO.sub.4/2 units,an organopolysiloxane having silicon bonded hydrogen atoms for the purpose of curing the composition and developing the PSA properties, and a platinum catalyst for the curing process.