Abstract: A device for uniform and discretely controlled deposition of small quantities of viscous material at each of a succession of locations on a surface according to a digital X-Y-Z program. A particular application is for deposition of a viscous solder flux or slurry of very small solder particles in such a flux material, through a small (needle) orifice. A pumping valve is driven, typically by pneumatic pressure, during the brief dwell time of the needle at each programmed X, Y location, on an electronic circuit board or the like. A mechanical contact member is provided for automatically optimizing the needle orifice height (Z dimension) over each programmed location irrespective of irregularities or curvature of the plane of the circuit board. In an optional embodiment spaced needle orifices provide contemporaneous deposition of the viscous material.