Abstract: A system for launching a space for humans into orbit comprises a launch vehicles. There are multiple separate crew modules mounted in relationship to the launch vehicle. The multiple crew modules are nested around the circumference of the launch vehicle. Alternatively or additionally, there are multiple separate crew modules located in a pod relatively directed along the length of the launch vehicle. A single rocket is for launching the multiple space crew modules. The separate crew module return from orbit to Earth separately.
Abstract: Methods for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of inserted support pillars to prevent sagging of the substrate during filling. In particular, through the use of: (1) a via fill stand off adapted for use with a substrate comprising at least two via holes to be filled, each of the via holes having a diameter of X mils, the standoff comprising at least one recess formed by control-depth drilling of holes having a diameter at least 12X mils; and (2) a via fill standoff adapted for use with a substrate comprising at least one via hole to be filled, the standoff comprising: at least one recess; and at least one support pillar positioned within the recess wherein the support pillar is not an integral part of the standoff.
Type:
Grant
Filed:
July 22, 2002
Date of Patent:
October 5, 2004
Assignee:
TTM Advanced Circuits, Inc.
Inventors:
Charles W. Lewis, Jesse Pedigo, Joseph Schug
Abstract: A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a heating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure fill head includes the steps of causing fill material to enter the fill head, modifying the viscosity of the fill material while it is within the fill head, and causing the modified viscosity fill material to exit the fill head and enter at least one hole.