Patents Represented by Attorney, Agent or Law Firm Mattingly, Stanger & Malur
-
Patent number: 7518111Abstract: Below 50-nm-diameter extremely narrow electrically-conductive fiber is used instead of the electron beam biprism used in the conventional interference electron microscope method. A phenomenon is utilized where a focus-shifted shadow of this fiber is shifted from a straight line by a distance which is proportional to a differentiation of phase change amount of an electron beam due to a sample with respect to a direction perpendicular to the fiber. The phase change amount is quantified by calibrating this shift amount through its comparison with a shift amount caused by another sample in terms of which the corresponding phase change amount has been quantitatively evaluated in advance. The differentiation amount of the quantified phase change in the electron beam due to the sample is visualized, or eventually, is integrated thereby being transformed into absolute phase change amount to be visualized.Type: GrantFiled: October 6, 2006Date of Patent: April 14, 2009Assignee: Hitachi, Ltd.Inventors: Takao Matsumoto, Masanari Koguchi
-
Patent number: 7519770Abstract: A disk array controller which includes a channel interface unit for connecting a host computer through a first type channel, a channel interface unit for connecting a host computer through a second type channel, a plurality of disk interface units provided with an interface with a magnetic disk unit respectively, a cache memory unit, and a shared memory unit. The number of access paths connected to said cache memory unit is less than the number of access paths connected to the shared memory unit.Type: GrantFiled: August 21, 2007Date of Patent: April 14, 2009Assignee: Hitachi, Ltd.Inventors: Kazuhisa Fujimoto, Atsushi Tanaka, Akira Fujibayashi
-
Patent number: 7516133Abstract: File requests sent to a file server that supports a proprietary file system are selectively performed on a second file system, in addition to being performed on the first file system. The second file system is not proprietary, but rather is designed around a publicly known format. Access to the second file system does not require obtaining permission from the vendor of the first file system; e.g., licensing, payment of royalties, and so on.Type: GrantFiled: October 17, 2003Date of Patent: April 7, 2009Assignee: Hitachi, Ltd.Inventor: Shoji Kodama
-
Patent number: 7515124Abstract: An amplifier circuit for generating a predetermined constant voltage required for resetting organic EL elements or capacitors is provided and an operating current switching circuit switches the operating current of the amplifier circuit to an idling current in a display period and to a steady operation current required to performing a reset operation in a reset period, so that a shifting time of the amplifier circuit from the idling state to the steady operation state can be shortened and a constant control voltage for resetting the organic EL elements or the capacitors can be generated in an initial portion of the reset period.Type: GrantFiled: May 23, 2005Date of Patent: April 7, 2009Assignee: Rohm Co., Ltd.Inventors: Hiroshi Yaguma, Masato Kobayashi
-
Patent number: 7515809Abstract: A heat-resisting plastic optical fiber which excels in heat resistance and mass production and a manufacturing method thereof. The heat-resisting plastic optical fiber has a core which consists of transparent resin, and clad coated on the outer periphery of the core, which consists of the resin whose refractive index is lower than that of core. Precursor of material for the core material consists of the mixture of a group of monomers which contain polyfunctional monomer and transparent thermoplastic polymer.Type: GrantFiled: October 18, 2007Date of Patent: April 7, 2009Assignee: Hitachi Cable Ltd.Inventors: Seikichi Tanno, Tomiya Abe, Masanori Matsumoto
-
Patent number: 7515157Abstract: A data transfer method is executed to transit a three-state transmitting circuit from a high-impedance state into a data output state, transmit a preamble (dummy data) onto a bus, and sequentially transmit the essential data. The shortening of a waveform caused in the first data piece after the transition from the high-impedance state into the data output state is executed against the preamble and no shortening of a waveform is not brought about in the essential data subsequent to the preamble. This makes it possible to exclude the limitation on speeding up the data transfer imposed by the shortening of the waveform.Type: GrantFiled: December 14, 2000Date of Patent: April 7, 2009Assignee: Elpida Memory, Inc.Inventors: Toyohiko Komatsu, Hideki Osaka, Masashi Horiguchi, Susumu Hatano, Kazuya Ito
-
Patent number: 7516353Abstract: When a primary server executing a task fails in a computer system where a plurality of servers are connected to an external disk device via a network and the servers boot an operation system from the external disk device, task processing is taken over from the primary server to a server that is not executing a task in accordance with the following method. The method for taking over a task includes the steps of detecting that the primary server fails; searching the computer system for a server that has the same hardware configuration as that of the primary server and that is not running a task; enabling the server, searched for as a result of the search, to access the external disk device; and booting the server from the external disk device.Type: GrantFiled: May 16, 2008Date of Patent: April 7, 2009Assignee: Hitachi, Ltd.Inventors: Keisuke Hatasaki, Takao Nakajima
-
Patent number: 7514293Abstract: According to the method of manufacturing a semiconductor device, a lead frame is provided wherein the thickness of a tab-side end portion of a silver plating for wire connection formed on each suspending lead 1e is smaller than that of a silver plating formed on each lead. Thereafter, a semiconductor chip is mounted onto a tab. In this case, since the entire surface of the silver plating on the suspending lead 1e is in a crushed state, it is possible to prevent contact of the semiconductor chip with the silver plating when mounting the chip onto the tab. Consequently, in a die bonding process, the semiconductor chip can slide on the tab without contacting the silver plating and thereby making it possible to diminish damage to the semiconductor chip when mounted onto the tab and hence to possibly prevent cracking or chipping of the chip when assembling the semiconductor device.Type: GrantFiled: August 14, 2008Date of Patent: April 7, 2009Assignee: Renesas Technology Corp.Inventors: Kenji Amano, Hajime Hasebe
-
Patent number: 7516021Abstract: Apparatus and method for hemoglobin measurement including irradiating light to a living body, detecting light that has propagated through the living body, and acquiring measured data that represents a change in the concentration of oxidized hemoglobin in the living body and a change in the concentration of deoxidized hemoglobin; irradiating light to the living body, detecting light that has propagated through the living body, and acquiring measured data that represents a change in the concentration of oxidized hemoglobin in the living body and a change in the concentration of deoxidized hemoglobin; classifying the data measured at the first step and the data measured at the second step according to each of an increase or a decrease in the concentration of oxidized hemoglobin and an increase or a decrease in the concentration of deoxidized hemoglobin; and displaying the classifications determined at the third step.Type: GrantFiled: June 8, 2005Date of Patent: April 7, 2009Assignee: Hitachi Medical Corp.Inventors: Hiroki Sato, Atsushi Maki, Tsuyoshi Yamamoto, Masashi Kiguchi
-
Patent number: 7516080Abstract: A collection request inputted at a consignor destination system is recorded on an electronic tag attached to freight and sent to a collection management system so as to be received. During collection of freight, information concerning collection is recorded on the electronic tag by means of a terminal unit and the collection information is sent to the collection management system. An in-base station freight information management system informs a freight information overall management system of the collection information and information concerning freight passing through the base station. The freight information overall management system acquires a transport history of the freight on the basis of the information sent from the in-base station freight information management system, calculates a delivery schedule of the freight and informs it to each in-base station freight information management system.Type: GrantFiled: December 28, 2004Date of Patent: April 7, 2009Assignee: Hitachi, Ltd.Inventors: Shuji Soga, Kazuhiko Taniguchi, Toshiyuki Ono, Norihiro Kimijima, Izumi Ota, Isao Tsushima
-
Patent number: 7513070Abstract: An excavation support database 40 includes a display table 47 and a display specifics table 48, which serve as storage means dedicated for display. The state of a working region per mesh is stored in the display table 47, and a discriminative display method (display color) is stored in the display specifics table 48 corresponding to the state per mesh. Reference is made to the display specifics table 48 on the basis of the state (height) per mesh, which is stored in the display table 47, to read the corresponding display color from the display specifics table 48, thereby displaying the state of the working region in a color-coded manner. Operation support and management realized with this system can easily be employed in different types of working machines in common and can inexpensively be performed with ease.Type: GrantFiled: June 17, 2004Date of Patent: April 7, 2009Assignee: Hitachi Construction Machinery Co., Ltd.Inventors: Hiroshi Ogura, Hideto Ishibashi, Keiji Hatori, Hiroshi Watanabe
-
Patent number: 7514294Abstract: The semiconductor device having the structure which laminated the chip in many stages is made thin. A reforming area is formed by irradiating a laser beam, where a condensing point is put together with the inside of the semiconductor substrate of a semiconductor wafer. Then, after applying the binding material of liquid state to the back surface of a semiconductor wafer by a spin coating method, this is dried and a solid-like adhesive layer is formed. Then, a semiconductor wafer is divided into each semiconductor chip by making the above-mentioned reforming area into a division origin. By pasting up this semiconductor chip on the main surface of an other semiconductor chip by the adhesive layer of the back surface, the semiconductor device having the structure for which the semiconductor chip was laminated by many stages is manufactured.Type: GrantFiled: August 9, 2006Date of Patent: April 7, 2009Assignee: Renesas Technology Corp.Inventors: Tomoko Higashino, Chuichi Miyazaki, Yoshiyuki Abe
-
Patent number: 7513155Abstract: Four sensor units (SUA1 to SUA4) are disposed symmetrically about a point, on both top and bottom and left and right centering around one point of a support (15e). Furthermore, four sensor units (SUA1 to SUA4) are designed so that all the components are fully in tuning-fork structure. Drive frames (5, 5) of the sensor units (SUA1, SUA2) disposed adjacent to each other in a first direction (Y) are vibrated in mutually inverted phases, and drive frames of the other sensor units (SUA3, SUA4) disposed adjacent to each other in a second direction (X) are vibrated in mutually inverted phases as well. Moreover, the drive frames of the sensor units (SUA1, SUA2) and the drive frames of the other sensor units (SUA3, SUA4) are operated in synchronization in the state in which phases are shifted by 90 degrees. Whereby, it is possible to reduce or prevent vibration coupling in the driving direction and in the detection direction, and the leakage (loss) of excitation energy and Coriolis force.Type: GrantFiled: December 4, 2006Date of Patent: April 7, 2009Assignee: Hitachi, Ltd.Inventors: Heewon Jeong, Hiroshi Fukuda
-
Patent number: 7511315Abstract: A semiconductor device has an external wiring for GND formed over an underside surface of a wiring substrate. A plurality of via holes connecting to the external wiring for GND are formed to penetrate the wiring substrate. A first semiconductor chip of high power consumption, including HBTs, is mounted over a principal surface of the wiring substrate. The emitter bump electrode of the first semiconductor chip is connected in common with emitter electrodes of a plurality of HBTs formed in the first semiconductor chip. The emitter bump electrode is extended in a direction in which the HBTs line up. The first semiconductor chip is mounted over the wiring substrate so that a plurality of the via holes are connected with the emitter bump electrode. A second semiconductor chip lower in heat dissipation value than the first semiconductor chip is mounted over the first semiconductor chip.Type: GrantFiled: April 19, 2005Date of Patent: March 31, 2009Assignee: Renesas Technology Corp.Inventors: Satoru Konishi, Tsuneo Endo, Hirokazu Nakajima, Yasunari Umemoto, Satoshi Sasaki, Chushiro Kusano, Yoshinori Imamura, Atsushi Kurokawa
-
Patent number: 7511277Abstract: A nuclear medicine diagnostic apparatus is provided that can improve time resolution and energy resolution and diagnosing accuracy by enhancing radiation detectors in terms of moisture-proofing and dust-proofing effects while efficiently cooling the radiation detectors. The apparatus has a first region A in which radiation detectors are to be accommodated, and a second region B in which signal processors are to be accommodated. These regions are provided inside a housing member 5 via an adiabatic member 7. The housing member 5 also has a ventilation port 8 formed to communicate with the first region A and equipped with an anti-dust filter. Ventilation holes 34 are formed to communicate with the first region B and serving as entrances for cooling air. Unit fans 33 serve as exits for the cooling air.Type: GrantFiled: September 22, 2006Date of Patent: March 31, 2009Assignee: Hitachi, Ltd.Inventors: Yuuichirou Ueno, Takafumi Ishitsu, Keiji Kobashi, Kensuke Amemiya, Katsutoshi Tsuchiya
-
Patent number: 7509747Abstract: A laser level includes: a covering; a stand on which the covering is mounted; a laser unit provided in a space surrounded by the covering and the stand; and a radiation window, provided in the covering, through which a laser beam emitted from the laser unit is radiated to an exterior of the covering. The laser level includes removal means which removes moisture in the space.Type: GrantFiled: December 8, 2006Date of Patent: March 31, 2009Assignee: Hitachi Koki Co., Ltd.Inventors: Junichi Sudou, Takashi Nishimura, Takashi Odashima
-
Patent number: 7512680Abstract: A second computer for monitoring a database management system and a storage subsystem introduced into a first computer, is provided with a step of acquiring profile information of an application, a step of determining a tuning item in accordance with the acquired profile information, and a step of transferring the determined tuning item to the first computer and the storage subsystem.Type: GrantFiled: June 21, 2004Date of Patent: March 31, 2009Assignee: Hitachi, Ltd.Inventors: Norifumi Nishikawa, Kazuhiko Mogi
-
Patent number: 7512100Abstract: In order to accomplish efficient communication of data between a base station and a plurality of mobile terminals, particular orthogonal codes are transmitted from the mobile stations to the base station as alert signals indicating the presence of data to be transmitted. The base station checks whether particular orthogonal codes are contained in the alert signals, and when the particular orthogonal codes are detected in the alert signals, information representing the detected orthogonal codes and the schedules for transmitting the data from the mobile terminals to the base station are transmitted from the base station to the mobile terminals as an alert response to the alert signals.Type: GrantFiled: December 12, 2006Date of Patent: March 31, 2009Assignee: FIPA Frohwitter Intellectual Property AGInventors: Riaz Esmailzadeh, Takashi Yano, Nobukazu Doi
-
Patent number: 7511327Abstract: The present invention relates to a structure of a capacitor, in particular using niobium pentoxide, of a semiconductor capacitor memory device. Since niobium pentoxide has a low crystallization temperature of 600° C. or less, niobium pentoxide can suppress the oxidation of a bottom electrode and a barrier metal by heat treatment. However, according to heat treatment at low temperature, carbon incorporated from CVD sources into the film is not easily oxidized or removed. Therefore, a problem that leakage current increases arises. As an insulator film of a capacitor, a layered film composed of niobium pentoxide film and a tantalum pentoxide film, or a layered film composed of niobium pentoxide films is used. By the use of the niobium pentoxide film, the dielectric constant of the capacitor can be made high and the crystallization temperature can be made low. By multiple-stage formation of the dielectric film, leakage current can be decreased.Type: GrantFiled: July 25, 2007Date of Patent: March 31, 2009Assignee: Renesas Technology Corp.Inventors: Yuichi Matsui, Masahiko Hiratani
-
Patent number: 7512757Abstract: A computer system including a first storage system connected to a first host computer, a second storage system connected to a second host computer and a third storage system connected to the first and second storage systems. The second storage system sets transfer setting before an occurrence of a failure, the transfer setting being provided with a dedicated storage area to be used for transferring data to the third storage system by asynchronous copy in response to a failure at the first host computer. Before the start of data transfer between the second storage system and third storage system to be executed after an occurrence of the failure, the second storage system checks the dedicated storage area, data transfer line and transfer setting information, and if an abnormal state is detected, this abnormal state is reported to the host computer as information attached to the transfer setting.Type: GrantFiled: July 14, 2006Date of Patent: March 31, 2009Assignee: Hitachi, Ltd.Inventors: Yuri Hiraiwa, Nobuhiro Maki, Takeyuki Imazu