Abstract: This invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula ##STR1## wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH.sub.2, NHR.sup.1, (NHC(.dbd.NH)).sub.m NH.sub.2, R.sup.2 COOH, NR.sup.1.sub.2, C(O)NHR.sup.1, R.sup.2 NR.sup.1.sub.2, R.sup.2 OH, R.sup.2 SH, R.sup.2 NH.sub.2 and R.sup.2 NHR.sup.1, wherein R.sup.1 is a hydrocarbon group, R.sup.2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R.sup.1, OR.sup.1 or SO.sub.2 C.sub.6 H.sub.4 --NH.sub.2 ; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates.

Abstract: The present invention relates to an adhesion promoting layer which exhibits high temperature stability and high peel strengths when used in a multi-layer structure for a printed circuit board. More specifically, the present invention relates to a multi-layer structure, containing a prepreg layer wherein the prepreg layer is made from an epoxy resin and a non-amine curing agent; and an adhesion promoting layer comprising a nitrogen containing silane compound. The present invention also relates to a multi-layer structure containing a metal foil layer; an epoxy prepreg layer wherein the epoxy prepreg layer is made from an epoxy resin and a non-amine curing agent comprising at least one of an acid, an anhydride, an alkoxide, a phenoxide, a polymeric thiol and a phenol; and an adhesion promoting layer comprising a nitrogen containing silane compound, wherein the adhesion promoting layer is between the metal foil layer and the epoxy prepreg layer.

Abstract: A method of forming a multi-layer laminate from a plurality of individual laminates comprised of copper clad on a polyimide.

Abstract: A method of securing a metal lead of a polymer battery to a flexible circuit, comprising the steps of positioning a metal lead of a polymer electrolyte battery onto a connection pad of a circuit; clamping the metal lead and the connection pad between two weld fixtures of an ultrasonic welder; compressing the metal lead and connection pad between the two weld fixtures to establish a pressure of about 44.9 psi to about 30.8 psi; and vibrating the weld fixtures at a frequency of about 20 kHz for about 0.1 seconds to about 2.0 seconds.

Abstract: A method of treating a copper current collector (copper mesh and/or copper foil) for use in Li-ion and/or Li-ion polymer batteries, comprising the steps of: positioning a copper current collector within an electrolytic solution adjacent an anode plate, the electrolytic solution comprised of about 2 to about 25 grams/liter of Cu.sup.+2, and about 30 to about 100 grams/liter of H.sub.2 SO.sub.4 ; energizing the system to have a predetermined current density; maintaining the current density of the system for about 0.5 to about 3.0 minutes; and removing the copper current collector from the electrolyte solution and rinsing the same.

Abstract: A metallic foil with improved peel strength is disclosed which has on a surface thereof two superimposed electrodeposited layers, the first layer adjacent to said surface comprising a dusty dendritic deposit comprising a major amount of a first metal and the second layer comprising a metal flash uniformly deposited over said first layer comprising a major amount of a second metal other than said first metal. A method for making such foil is disclosed which comprises (A) electrodepositing a first metal on one surface of said foil to produce a dusty dendritic metal deposit and (B) electrodepositing on the dendritic deposit of (A) a uniform metal flash. The improved foil is useful for a wide range of applications that benefit from the improved bonding to substrates, including electronic applications such as laminated electronic devices, such as printed circuit boards, and solid state switches.

Abstract: This invention relates to a low density high surface area copper powder having an apparent density in the range of about 0.20 to about 0.60 gram per cubic centimeter, and a surface area of at least about 0.5 square meter per gram. This invention also relates to an electrodeposition process for making the foregoing copper powder by electrodepositing the copper powder from an electrolyte solution using a critical combination of process parameters. These critical parameters include: a copper ion concentration for the electrolyte solution in the range of about 2 to about 7 grams per liter; a free chloride ion concentration for the electrolyte solution in the range of about 8 to about 20 ppm; an impurity level for the electrolyte solution of no more than about 1.0 gram per liter; and an electrolyte solution that is free of organic additives.

Abstract: A method for determining the resistance of a shunt for use with a current limiting device that exhibits PTC characteristics to protect an electrical circuit. The method comprises steps for determining maximum and minimum resistance values based on operating criteria and component characteristics and selecting resistance values that fall within selected ranges.

Abstract: A vehicle and method for storing ozone is disclosed. A vehicle made of a water miscible, organic compound of a glycol-containing chemical compound, a tertiary alcohol or a mixture thereof that is capable of receiving and containing ozone is disclosed. The method involves producing ozone gas, introducing the ozone-containing gas into a mixing vessel that contains the aforementioned organic compound, agitating the organic compound in the presence of the ozone-containing gas, wherein the ozone-containing gas is at atmospheric pressure or at a pressure of up to about 150 psig., and releasing the pressure if pressures in excess of atmospheric are used.

Abstract: A method of forming lithium manganese oxide spinel, comprising the steps of combining predetermined amounts of lithium carbonate powder and manganese dioxide powder, the powders having predetermined surface areas; mixing the lithium carbonate and manganese dioxide for about 0.5 hours to about 2.0 hours in a manner so as to thoroughly mix the powders, but not to significantly increase the surface area of the powders; increasing the temperature of the mixture from approximately room temperature to a calcining temperature between about 700.degree. C. to about 900.degree. C.; maintaining the calcining temperature of the mixture between about 700.degree. C. to about 900.degree. C. for about 7 hours to about 13 hours; reducing the temperature of the mixture from the calcining temperature to about 500.degree. C. at a cooling rate between about 10.degree. C./hour to about 120.degree. C./hour; and cooling the mixture from 500.degree. C. to room temperature.

Abstract: This invention relates to a process for applying a stabilization layer to at least one side of copper foil comprising contacting said side of said copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor. This invention also relates to copper foils treated by the foregoing process, and to laminates comprising a dielectric substrate and copper foil treated by the foregoing process adhered to said dielectric substrate.

Abstract: In one embodiment, the present invention relates to a method of treating metal foil, involving sequentially contacting a metal foil with an acidic solution; placing the metal foil in a nickel treatment bath and applying a current through the nickel treatment bath, wherein the nickel treatment bath contains at least about two plating zones, about 1 to about 50 g/l of an ammonium salt, and about 10 to about 100 g/l of a nickel compound; and applying a nickel flash layer to the metal foil. In another embodiment, the present invention relates to a metal foil treated according to the method described above.

Abstract: In one embodiment, the present invention relates to a method of treating metal foil including sequentially contacting the metal foil with a first solution containing a metal foil oxidizer and less than about 5 g/l of a hydroxide compound, contacting the metal foil with a chromium containing electrolytic bath and electrolyzing the bath, wherein the bath contains about 0.1 to about 5 g/l of a chromium compound, and contacting the metal foil with a second solution containing from about 0.1 to about 10% v/v of a silane compound, with the proviso that the metal foil is not contacted with a reducing agent after contact with the first solution.

Abstract: The invention relates to a process for electrolytic treatment of copper foil, comprising the steps of: (A) applying a voltage across an anode and cathode, wherein the anode and cathode are in contact with an electroplating composition containing a gelatin component; (B) removing organic particulate matter by contacting the electroplating solution containing the organic particulate matter with an adsorbent polymer; and (C) electrolytically treating the copper foil. The electroplating composition can additionally contain an active sulfur-containing component, such as thiourea.

Abstract: In one embodiment, the present invention provides a lithium-ion battery and a method of preparing a lithium-ion battery containing a slurry anode including a carbonaceous material, a first electrolyte salt and a first organic solvent; and a slurry cathode including a conductor, a second electrolyte salt, a second organic solvent and a lithium transition metal oxide, with the proviso that neither the slurry anode nor the slurry cathode contain a binder.

Abstract: This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size.

Abstract: This invention relates to a process for making a shaped copper article directly from a copper-bearing material, comprising: (A) contacting said copper-bearing material with an effective amount of at least one aqueous leaching solution to dissolve copper ions into said leaching solution and form a copper-rich aqueous leaching solution; (B) contacting said copper-rich aqueous leaching solution with an effective amount of at least one water-insoluble extractant to transfer copper ions from said copper-rich aqueous leaching solution to said extractant to form a copper-rich extractant and a copper-depleted aqueous leaching solution; (C) separating said copper-rich extractant from said copper-depleted aqueous leaching solution; (D) contacting said copper-rich extractant with an effective amount of at least one aqueous stripping solution to transfer copper ions from said extractant to said stripping solution to form a copper-rich stripping solution and a copper-depleted extractant; (E) separating said copper-rich st

Abstract: A low reflection termination device comprised of a tubular glass housing having an interior cavity, an optical fiber having an end with a portion of the end being formed by the application of heat into a glass bead and extends into the glass housing with the glass bead positioned within the interior cavity, a clear cured epoxy disposed within the cavity of the housing surrounding the glass bead, and a light absorbing material which coats the tubular glass housing.

Abstract: The present invention provides a limited rechargeable lithium battery containing an anode; a cathode slurry containing about 55 to about 75% by weight of a transition metal oxide, about 3 to about 8% by weight of a conductor, and about 20 to about 40% by weight of an organic electrolyte containing an electrolyte salt and an organic solvent; a separator between the anode and the cathode slurry; and at least two current collectors. The present invention also provides a method of making a cathode slurry.

Abstract: The present invention provides a non-cyanide brass plating bath composition containing copper, zinc, metal polyphosphate, and orthophosphate, with the proviso that the composition does not contain cyanide. The present invention also provides a method of making metallic foil having a brass layer including the steps of providing a metallic foil; contacting the metallic foil with a non-cyanide brass plating bath containing copper, zinc, metal polyphosphate, and orthophosphate, with the proviso that the brass plating bath does not contain cyanide; applying a current to the brass plating bath; and recovering the metallic foil having a brass layer.