Abstract: A glide head includes two rails that run from the leading end to the trailing end of the glide head and a transverse contact rail that is orientated orthogonally to the two rails and is located at the trailing end of the glide head. The two rails may contact the transverse contact rail or one or both may not extend to the transverse contact rail. In addition, the channel region defined between the two rails and the wing, if used, may be tapered so that they merge with the bottom surface of the transverse contact rail. The transverse contact rail may extend beyond the two rails. The glide head flies with a positive pitch which causes the transverse contact rail to be the closest area on the glide head to the surface of a rotating disk being tested. Thus, the mechanical energy is greatest when the transverse contact rail contacts a defect on a disk, and thus the transverse contact rail is the active rail.

Abstract: A system for processing a disk includes an end-effector having a plurality of fingers. The end-effector is mounted to a rotary actuator. The rotary actuator is mounted to a linear stage. The linear stage is positioned adjacent to an air track and a tank. The rotary actuator and the linear stage place the fingers into the inner diameter of a disk on the air track. The fingers grip the inner diameter of the disk. The rotary actuator and the liner stage then place the fingers holding the disk into the tank. The tank is filled with a processing liquid such as a lubrication solution to lubricate the disk.

Abstract: A differential interferometer is used to measure the step height between a reference region and at least one point in a measurement region using the relative phase difference as well as the measured reflectance from at least the point in the measurement region. The measured reflectance can be derived from the information provided by the differential interferometer. The measured reflectance from the reference region can also be used to provide a step height measured, where, e.g., the reference region has a changing thickness. Where the measurement region includes a composite material, e.g., copper and silicon dioxide, the step height between the reference region and the measurement region may be determined by including the area fraction or the height difference of the materials in the composite material in the final determination of the step height.

Abstract: A RAM device, such as the type embedded in a programmable logic device, is configurable to alter the depth of the addressable elements and the width of the number of data bits received or produced by the RAM device. The RAM device includes a number of address ports for receiving the read and/or write address signals, but the RAM device may be configured such that the depth requires fewer address signals then there are address ports. Likewise, the RAM device includes a number of input and output data ports for receiving and producing the data bits, but the width of the RAM device may be configured such that the number of data bits actually received or produced are less than the number of data ports. The depth and the width of the RAM device are configured together so that the depth is increased when the width is decreased and vice versa.

Abstract: A method of measuring film thickness is based on the film's attenuation of optical characteristics, such as absorption band or absorption bands, of underlying material. The thickness of the film is determined based on a correlation between the thickness of the film and the strength of the absorption band (such as a peak or valley area) of the underlying material. The correlation is generated using an identified absorption band of the underlying material, which may be determined empirically or using a library of information, and the reflectance spectra produced by calibration samples, each having a different thickness of film.

Abstract: A metrology process, in accordance with the present invention, measures the dishing of a first feature made of a first material by determining the relative height of the first feature with respect to a second feature, where the first and second features have different dishing rates. The relative height of the first feature with respect to the second feature may be determined by measuring a first relative height of the first feature with respect to a reference location, measuring a second relative height of the second feature with respect to a reference location, and calculating the difference between the first and second relative heights. Alternatively, other methods may be used. The relative height is then correlated with calibration data to determine the amount of dishing of the first feature. The calibration data is generated by first providing a sample substrate with features approximately the same as the substrate to be measured, e.g.

Abstract: A washer includes driving and scrubbing rollers that press against the opposing surfaces of a substrate, which may be, e.g., a small form factor disk. The driving rollers and scrubbing rollers are approximately aligned along two different radii of the substrate that are separated by 180 degrees. The driving rollers rotate in opposite directions as do the scrubbing rollers. During the scrub cycle, the driving rollers cause the substrate to rotate, while the scrubbing rollers scrub the opposing surfaces of the substrate. Outside diameter rollers that are orthogonally positioned relative to the driving rollers and the scrubbing rollers, and which may be free spinning, contact the outside diameter of the substrate and hold the substrate in position during the scrub cycle. The substrate is loaded into the washer by lifting the substrate, via a lifting arm, to the driving and scrubbing rollers.

Abstract: The calibration of a metrology tool with a rotatable polarizer separates the angular dependence of the irradiance from the temporal dependence. The angular dependence of the metrology tool is then modeled, e.g. using a Fourier expansion. The Fourier coefficients are parameterized as a function of wavelength. The actual irradiance, e.g., the reference irradiance and/or back reflection irradiance, is then measured for the metrology tool for one angle of the rotatable polarizer. From the measured irradiance and the modeled angular dependence, the total irradiance of the metrology tool can be determined, which is independent of the angle of the rotatable polarizer. The irradiance, e.g., reference and/or back reflection, can then be determined for any desired angle of the rotatable polarizer using the total irradiance and the angular dependence of the metrology tool.

Abstract: A substrate lift mechanism includes a plurality of fingers mounted on a hoop controlled by an actuator to transfer a substrate, such as a wafer or a flat panel display, from an edge grip arm to a chuck on a processing tool, such as integrated metrology tools. The substrate lift mechanism includes a base that is configured to be mounted to existing processing tools thereby allowing the processing tools to be adapted to be operable with new edge grip arms. The plurality of fingers are positioned to permit an edge grip arm to pass between two of the fingers and are configured to gravitationally support the substrate. Advantageously, the base of the substrate lift mechanism has a small footprint to minimize the space requirements of the processing tool to which it is mounted.

Abstract: A sputter pallet loading and unloading device includes in one embodiment a spindle that rotates the pallet while an arm is engaged with the spring in the pallet to open and close the spring. In another embodiment, the spindle is located adjacent an air track that moves the disk substrate over a cushion of air to the loading area of the pallet. The air pressure under the disk substrate is increased to raise the disk substrate into the loading area. Once raised into the loading area, the spring is closed, e.g., by rotating the pallet in the opposite direction. The pallet and air-track are at a small angle to allow the substrate to slide into the correct position. The simplicity of operation leads to a reduced cost and a higher throughput for this device compared to a robotic loader.

Abstract: A silicon nitride self-lubricating layer forms the upper surface of a data storage disk. The silicon nitride self-lubricating layer can replace the carbon protective overcoat and liquid lubricant used in conventional data storage devices in which an aerodynamic slider is supported by an air bearing by providing both physical protection for the underlying recording layer and lubrication between the slider and the disk.

Abstract: An instrument and methods are used to determine film layer thicknesses, optical constant spectra, and elemental concentrations of a sample substrate overlaid with a single or multiple films. The instrument measures the sample substrate's absolute reflectance and ellipsometric parameters over a first set of wavelengths to determine film layer thicknesses and optical constants of the film layers over the first set of wavelengths. The instrument also measures the sample substrate's absolute reflectance or transmittance over a second set of wavelengths. Based on these measurements and analysis, the instrument determines at least one element's concentration in at least one film layer of the sample substrate.

Abstract: A bandgap voltage reference circuit with no error amplifier circuit includes a chain of complementary emitter follower circuits that are connected to a supply voltage and to common ground via respective current mirrors. Each emitter follower circuit within the chain of emitter follower circuits generates a base to emitter voltage. Because of the successive configuration of the chain of emitter follower circuits, the base to emitter voltage differences from all the emitter follower circuits are summed together. Using a chosen number of emitter follower circuits along with an appropriately chosen area for the emitters of the transistors within the emitter follower circuits, the desired proportional to absolute temperature voltage is generated. Further, because of the additive nature of the base to emitter voltage differences, as opposed to a multiplicative nature as found in conventional circuits, the bandgap voltage reference circuit has a decreased level of noise and process sensitivity.

Abstract: A shallow abrupt junction is formed in a single crystal substrate, for example, to form a pn junction in a diode or a source drain extension in a transistor. An amorphous layer is formed at the surface of the substrate by implanting an electrically inactive ion, such as germanium or silicon, into the substrate. The amorphous/crystalline interface between the amorphous layer and the base crystal substrate is located at the depth of the desired junction. A dopant species, such as boron, phosphorus or arsenic is implanted into the substrate so that peak concentration of the dopant is at least partially within the amorphous layer. The amorphous layer can be formed either before or after the implanting of the dopant species. A low temperature anneal is used to recrystallize the amorphous layer through solid phase epitaxy, which also activates the dopant within the amorphous layer. The dopant located beneath the original amorphous/crystalline interface remains inactive.

Abstract: A high voltage transistor exhibiting high gated diode breakdown voltage, low leakage and low body effect is formed while avoiding an excessive number of costly masking steps. Embodiments include providing a high gated diode breakdown voltage by masking the high voltage junctions from the conventional field implant and masking the source/drain regions from the conventional threshold adjust implant. Angled openings are formed in the field implant blocking mask so that the field implant at varying distances away from the junctions, thus achieving low leakage and a high gated diode breakdown voltage. The field implant blocking mask is extended over the channel area, thereby producing a transistor with low body effect.

Abstract: A substrate lift mechanism includes a plurality of fingers mounted on a hoop controlled by an actuator to transfer a substrate, such as a wafer or a flat panel display, from an edge grip arm to a chuck on a processing tool, such as integrated metrology tools. The substrate lift mechanism includes a base that is configured to be mounted to existing processing tools thereby allowing the processing tools to be adapted to be operable with new edge grip arms. The plurality of fingers are positioned to permit an edge grip arm to pass between two of the fingers and are configured to gravitationally support the substrate. Advantageously, the base of the substrate lift mechanism has a small footprint to minimize the space requirements of the processing tool to which it is mounted.

Abstract: A laser scatterometer used, e.g., to detect defects on memory media, includes a beam block that can be finely adjusted so as to block specular light while maximizing the small angle scattered light that is received by the light detector. The beam block may be adjusted independently of the light detector or may be a masked beam block that is adjusted with the entire light detector. The light source produces a light beam that is focused so as to maximize the spot size on the object being tested while minimizing the spot size at the beam block, which advantageously maximizes the small angle scattered light while decreasing testing time. The large spot size at the object being tested permits detection of large defects. Thus, disks may be quickly tested, e.g., during the burnishing process, to determine if there are any large defects.

Abstract: A glide head includes a transducer mounted on a side surface, e.g., the leading side, as opposed to the top surface of the glide head slider. Thus, a suspension arm may be mounted to the top surface of a small glide head slider, e.g., thirty percent, without interference from the transducer. The glide head slider may include a notch or groove on the side surface into which the transducer is at least partially inserted to assist in securely mounting the transducer to the glide head slider. The height of the glide head slider is increased to accommodate the thickness of the notch, and thus, the glide head slider may have a height to length ratio of forty percent or greater. For example, a thirty percent glide head slider may have a height to length ratio of approximately seventy percent. The transducer is laterally mounted to the side surface of the glide head slider such that an axis between the collectors of the transducer is horizontally oriented.

Abstract: A command trajectory drives a stage to produce a smooth motion while minimizing any vibrations or oscillations of the structure. The command trajectory provides an acceleration and a deceleration that have derivatives, known as the jerk, equal to zero at the beginning and end of the acceleration and deceleration periods. Because the jerk is equal to zero at the beginning and end of acceleration and deceleration, the influence of the reactive forces on the positioning system's structure is reduced, thereby minimizing oscillation of the structure. Moreover, the jerk is continuous throughout the acceleration and deceleration periods, resulting in a smooth continuous motion of the stage. The jerk on the stage during acceleration and deceleration has an adjustable duration to reduce the structural disturbances and decrease settling time.

Abstract: A method for controlling a polar coordinate stage moves an object relative to an imaging system. While moving the object, the image of the object is rotated to compensate for rotation of the object. Accordingly, the orientations of features in the image are preserved, and removal of apparent rotation in the image reduces confusion an operator experiences while directing movement of the object. The angular velocity of the motion of the object is controlled so that image shift speed is independent of the radial position of the point being viewed. Use of a polar stage, reduces the required foot print for a stage and facilitates prealignment. In particular, an edge detector measures the position of the edge of the object while the polar coordinate stage rotates the object. A prealignment process determines the position and orientation of the object from the measured edge positions.