Patents Represented by Attorney Michele A. Jenkens & Gilchrist, P.C. Mobley, Esq.

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  • Thermally enhanced flip chip package and method of forming
    Patent number: 5726079
    Abstract: A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip-chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.
    Type: Grant
    Filed: September 17, 1996
    Date of Patent: March 10, 1998
    Assignee: International Business Machines Corporation
    Inventor: Eric Arthur Johnson