Patents Represented by Attorney, Agent or Law Firm Morrison & Foersster LLP
  • Patent number: 6395152
    Abstract: An electropolishing apparatus for polishing a metal layer formed on a wafer (31) includes an electrolyte (34), a polishing receptacle (100), a wafer chuck (29), a fluid inlet (5, 7, 9), and at least one cathode (1, 2, 3). The wafer chuck (29) holds and positions the wafer (31) within the polishing receptacle (100). The electrolyte (34) is delivered through the fluid inlet (5, 7, 9) into the polishing receptacle (100). The cathode (1, 2, 3) then applies an electropolishing current to the electrolyte to electropolish the wafer (31). In accordance with one aspect of the present invention, discrete portions of the wafer (31) can be electropolished to enhance the uniformity of the electropolished wafer.
    Type: Grant
    Filed: July 2, 1999
    Date of Patent: May 28, 2002
    Assignee: ACM Research, Inc.
    Inventor: Hui Wang