Patents Represented by Law Firm Parmelee, Bollinger & Brambeltt
  • Producing integrated circuit chips with reduced stress effects
    Patent number: 5026667
    Abstract: Wire-bonded IC chips are coated with siloxane polyimide and cured to a hardened state. The coating is applied over portions of the circuitry which are stress-sensitive. The coating is spaced away from the wire-bond regions of the chip. Thereafter, the coated chip is plastic encapsulated in conventional fashion.
    Type: Grant
    Filed: October 18, 1989
    Date of Patent: June 25, 1991
    Assignee: Analog Devices, Incorporated
    Inventor: Carl M. Roberts, Jr.