Abstract: A “Gatling gun” via to interconnect circuitry from a first side of a substrate or printed circuit board, to a second side of the substrate or board. The present via structure comprises a center conductor via surrounded by a plurality of ground vias. The plurality of ground vias shield the center conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. In one embodiment, the conductor via is electrically connected to a conductive pattern on the substrate by a wire bond.

Abstract: The present invention is generally directed to a digital oscilloscope and associated method that provides a peak detect mode of operation that not only accurately displays peak information, but also reflects the significance of peak information, without distorting a statistical view of the signal. In this regard, and in accordance with one aspect of the invention, the oscilloscope includes an analog to digital (A/D) converter configured to periodically sample an input signal and convert the periodic samples into a train of digital data. A circuit is disposed at the output of the A/D converter and is configured to evaluate the train of digital data over a first predetermined period of time and detect a minimum value and a maximum value during the first period of time. A mechanism is configured to evaluate the minimum and maximum values and determine a significance measure of the minimum value and the maximum values.

Abstract: A method and apparatus for automatically acquiring and storing a waveform measurement using a measuring instrument having a video display, such as an oscilloscope or spectrum analyzer, is disclosed. According to the invention, an operator first instructs the measuring instrument to automatically measure a probed waveform one or more times and to automatically store at least one selected sample set representing each probed waveform measurement. Thereafter, the operator is not required to interact with the measuring instrument during a measurement or series of measurements. Once measurement acquisition and storage is automatically completed, the measuring instrument alerts the operator by providing at least one indication for each selected sample set stored.

Abstract: An integrated low cost thick film RF module and method for making same. An improved thick film dielectric is employed to build three-dimensional, high frequency structures. This new dielectric can be utilized to create novel RF and microwave modules that inexpensively integrate the I/O and electrical isolation functions of traditional microcircuits without using the usual set of expensive components. In particular, the module comprises a substrate; a conductive ground plane disposed above the substrate; a first dielectric layer printed on top of the ground plane; a microstrip disposed on top of the first dielectric; a second dielectric layer printed on top of the microstrip; a top ground plane disposed on top of the second dielectric; and a shield, electrically coupled to the top ground plane.

Abstract: A method that distinguishes different battery chemistries in portable electronic devices using a simple electrical test. The present method facilitates accurate fuel gauging as well as providing a safe in-device recharging scenario, eliminating the possibility that an end-user might attempt recharging a non-rechargeable battery. A simple circuit is provided in the electronic device that, in conjunction with a microcontroller, measures several distinct voltages across a newly inserted battery. A lookup table is then utilized to determine the probable battery chemistry.

Abstract: A method for creating large area, thick film resistors with improved predictability and uniformity. “Tent poles” are employed during the printing of the large area resistors to prop up the screen mesh to ensure the resultant resistor does not have a scooped out center portion. The tent poles can be made from gold pads, resistor spots or emulsion spots.

Abstract: An improved probe for probing high speed, low impedance bus structures. The probe comprises an AC termination portion and an RCR filter. In a first embodiment, the AC termination portion comprises a resistor and capacitor in series. The time constant formed by the AC termination portion is sufficiently larger than the time it takes a signal to travel through the cable of the probe. The RCR filter comprises two resistors in series disposed between the AC termination resistor and ground. A capacitor is connected in parallel to the first resistor in order to achieve a flat pulse response from DC through to high frequencies.

Abstract: A method for retrieving selected, predetermined data values using a logic analyzer and data visibility macros. The predetermined data values result from data operations that occur internally to the target processor. The data visibility macros send the data values via the external bus so that the logic analyzer may retrieve them for display. The data visibility macro is essentially a code marker, the difference being that a data visibility macro is used by the logic analyzer to retrieve data value information. The present method comprises the steps of inserting a data visibility macro into software code that is resident in the processor, compiling the code, writing the selected data values to an external bus, and using the logic analyzer to retrieve and display the data values.

Abstract: A handheld measurement device combines a logic probe, a timing analyzer, a voltmeter and a continuity detector. The measurement device provides a visual logic level indicator with an audible logic level indicator. Three channels are provided, each with simultaneous combinational triggering, to facilitate the analysis of signal timing. The device provides simultaneous measurements from a single probe.

Abstract: A method and apparatus is presented for designing an RF modular hybrid circuit assembly. The apparatus comprises a rule-based control mechanism, a graphical user interface and a library of RF hybrid elements including model front- and back-sides, and input/output instances. The method comprises the steps of initializing standardized front- and back-plane models, adding input/output instances along the perimeter of the back-plane, designing the hybrid circuit on the front-plane and combining the two planes to arrive at an RF modular hybrid layout design. A data library of RF hybrid elements is provided to facilitate rapid prototyping. The final design is then sent concurrently to a photo-plotter and a laser subsystem for printing the thick-film and cutting the PTHs respectively.

Abstract: A system and method for injecting and canceling a bias voltage in an attenuated circuit is presented. The attenuated circuit is disposed within a tri-state logic-level measurement apparatus. The bias voltage is provided to ensure that when the measurement apparatus is floating, it floats at the tri-state voltage. In one embodiment, a summing network is connected to an attenuator, a first voltage generator which provides a bias voltage and a second voltage generator which provides a cancellation voltage. In another embodiment, a FET amplifier is provided in place of the summing network.

Abstract: A novel zero delay regenerative circuit is presented. The circuit, when connected to a data bus, suppresses noise, reduces time delay and provides sharper edge rates. A first input of a NOR gate is connected to an input node. A second input of the NOR gate is connected to the precharge clock of the bus. The output of the NOR gate is connected to the gate terminate of a field-effect transistor (FET). With the drain terminal connected to ground, the source terminal of the FET is connected to an output node. The input and output nodes are shorted together.

Abstract: A method for determining whether a circuit under test is open is presented. A digital-to-analog converter is dithered to generate a known signal. This known signal is summed with an external attenuation signal which is brought into the system from a probe on the circuit under test. This summation is then measured by an analog-to-digital converter (ADC). If the known signal is not attenuated by the probe (i.e., the ADC measures essentially the known signal), we can conclude that the circuit is open.

Abstract: A system for detecting open circuits is presented. The system comprises first and second digital-to-analog converters (DACs). The DACs, in combination with a microprocessor, generate a tri-state voltage which is fed through the system. This tri-state voltage is then attenuated via an amplifier. A probe carries an external attenuation signal via a measurement line through the system to be summed with the attenuated tri-state voltage to create V.sub.wts. An analog-to-digital converter then compares V.sub.wts with a known signal to determine whether the circuit under test is open.

Abstract: An apparatus providing the capability to scan media at different resolutions is presented. The apparatus comprises an image area which is disposed between scanner lid and a scanner base, the lid is pivotally attached to the base to provide easy access to the image area. A light source resides within the scanner lid. Two separate light paths are provided, the first light path is reflected off opaque targets, through the lid before entering the base and onto an array of photosensitive devices. The second light path is passed through transparent media, into the base and onto the array. First and second focusing lenses are provided, each for a light path. The focusing lenses provide two separate magnifications which yield two separate resolutions.

Abstract: A probe assembly provides the capability to test integrated circuit (IC) packages mounted onto ball grid arrays. The probe assembly comprises a ball grid probe having connectors mounted onto opposite sides of a circuit board. A first BGA header is mounted to one side of the probe while a first BGA socket is mounted to the other side of the probe. The socket is adapted to receive an integrated circuit which is mounted onto a second BGA header. A second BGA socket is mounted to a printed circuit board and is adapted to receive the ball grid probe via the first BGA header. An interconnection device is provided to electrically couple the ball grid probe to a number of test instruments.

Abstract: A method for testing leads of an integrated circuit package. The method includes a testing substrate with a plurality of conductive portions for use in connection with a test probe. The method further includes at least one compressible conductive bridge member for providing electrical contact between the leads of the integrated circuit package and the conductive portions of the testing substrate. The conductive bridge member has multiple electrically conductive wires embedded therein or secured thereto, each of the wires being parallel to one another and spaced apart from one another. The method uses a frame for retaining the conductive bridge members therein and maintaining the conductive bridge members in electrical contact with the leads of the integrated circuit package and the conductive portions of the testing substrate.

Abstract: A system and method for automatically archiving data from a computer system to a backup system. The system provides a scheduler, connected to an automated backup mechanism, for scheduling when full backups are performed and when incremental backups are performed. A simple user interface is provided to ensure that once the end user has enabled the system, daily automatic backups will be performed without further input from the end user.

Abstract: An apparatus and method facilitates the conversion of filenames using the conventional 8.3 filename construct and long filenames. A converter is coupled to a software library which permits the running of backup applications from an 8.3 filename system. The library contains internal and external APIs which allow the 8.3 filename system to create files and directories using the long filename convention.

Abstract: A variable-width lead interconnection structure disposed between a printed circuit board and a multichip module is presented. An edge clip with leads having a widened middle section is provided to optimize manufacturability and electrical performance. Each lead has a characteristic width and spacing of conventional leads where the leads are soldered to a multichip module or PCB. However, in between each end, each lead has a middle section that is widened to provide a characteristic impedance closer to the ideal 50 ohms, thus producing structures with better return loss at high frequencies.