Abstract: A foldable vehicle wheel traction apparatus is disclosed that includes four traction devices having a regular lattice structure. Each traction device is hingeably connected one to the other to permit the traction devices to be folded one on another with easy storage. The hingeable apparatus connected the traction devices permit minimal lateral movement, which allows the traction devices to be more easily maneuvered when being put in use. The ability of the traction apparatus to support the weight of the wheel is enhanced by the regular lattice structure of each traction device formed by the traction devices elongated lateral members and elongated cross members. In one embodiment, the cross members are composed of, or coated with materials that heat up when the vehicle wheel contacts and spins on the cross member, thereby promoting melting of snow or ice.

Abstract: A system for holding a portion of the flexible exhaust hose from a dryer within a wall, thereby allowing the dryer to be placed in close proximity to the wall is provided. The system provides a dryer rough-in box including a contoured surface for smoothly guiding the flexible exhaust hose to minimize bending and kinking. An integral segment of duct is provided to allow for convenient and aesthetic installation, where the connection of the system to the duct in the was is hidden within the wall. Additionally, the rough-in box includes an opening structured and arranged to snugly fit a gas line is provided, thereby aiding in.

Abstract: A high frequency receiver is provided with improved insertion loss and noise factor. The receiver uses a low loss input stage and interstage noise matching block. The input stage and interstage noise matching block utilize a suspended substrate matching circuit wherein the substrate is free space. The interstage noise matching block further uses a broadside suspended substrate coupler where the broadside coupler is suspended in a free space substrate. Singly and in combination, when used in a high frequency receiver arrangement, the suspended substrate input matching circuit and the suspended substrate interstage matching circuit with suspended substrate coupler minimize insertion loss and improve the high frequency receiver overall noise factor.

Abstract: A method of improving planarity of semiconductor wafer surfaces containing damascene and dual-damascene circuitry using chemical-mechanical polishing techniques. The method includes using a first polishing step to substantially remove excess surface metal up to a detected end point. After rinsing, a second step of chemical-mechanical polishing is applied, using a second slurry that has a higher selectivity for dielectric than metal, preferably from 1.8 to 4 or more times greater. The second step of polishing, in accordance with the invention, has been found to substantially eliminate dishing and improve planarity.