Patents Represented by Attorney Paul J. Winters
  • Patent number: 6461879
    Abstract: In the testing of one or more die as part of a semiconductor wafer, electrical testing of an unstressed die of a wafer is undertaken. The die of the wafer is then physically stressed to a first stressed state, and electrical testing is undertaken thereon. The die of the wafer is then physically stressed to a second stressed state, and electrical testing is again undertaken on the die as it is in its second stressed state. The results of the tests are compared and extrapolated to indicate electrical performance of the die in other physically stressed states. A relatively simple tool is provided for use in performing in this method in an effective and rapid manner.
    Type: Grant
    Filed: January 9, 2001
    Date of Patent: October 8, 2002
    Assignee: Advanced Micro Devices Inc.
    Inventors: Richard C. Blish, II, Sidharth
  • Patent number: 6373126
    Abstract: Barrier structures are included within the packaging material of a packaged semiconductor device, such barrier structures including barrier bodies which overlie the die-die pad assembly of the device on either side thereof. The barrier bodies act as baffles which limit diffusion of moisture through the packaging material into the area of the die-die pad assembly of the device, the barrier bodies including apertures therethrough which control such diffusion in a manner that avoids delamination problems in the area of the die-die pad assembly, meanwhile also avoiding undesirable trapping of gas within the packaging material.
    Type: Grant
    Filed: April 26, 2000
    Date of Patent: April 16, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Pramod Patel, Richard C. Blish
  • Patent number: 6362524
    Abstract: A metal edge seal ring is formed in a trench made up of a large number of short, connected legs in perpendicular relation. Metal is deposited in the trench, and because the metal is comprised of many short segments rather than several long, straight sections, the subsequent chemical-mechanical polishing step does not cause significant cupping of the metal in the trench.
    Type: Grant
    Filed: July 26, 2000
    Date of Patent: March 26, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Richard C. Blish, Kurt O. Taylor, David C. Greenlaw
  • Patent number: 6355511
    Abstract: A method for making frontside contact to a substrate through an SOI structure thereon is provided. An etching step is undertaken to form a trench in the SOI structure so as to expose and define a rough surface of the substrate. Then, a thin insulating layer, for example SiO2, is formed over the exposed surface of the substrate, this insulating layer being irregular because of its formation over the relatively rough etched surface. Contact material is provided in the trench, and electrical potential is applied across the contact and substrate sufficient to increase the conductivity of the insulating layer, i.e., to break down the insulating layer. Nitrogen may be implanted into the exposed surface of the substrate to slow subsequent growth of the insulating layer, resulting in an even thinner insulating layer, i.e., one even less resistant to breakdown upon application of electrical potential thereacross.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: March 12, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Todd P. Lukanc, Kurt O. Taylor
  • Patent number: 6306707
    Abstract: In the manufacture of an EPROM or EEPROM semiconductor device that includes a core region and a peripheral region, a nitride layer is formed over the core region and peripheral region, and an oxide layer is formed over the nitride layer. A layer of photoresist is provided over the oxide layer and is patterned to expose a portion of the oxide layer overlying the core region. A wet etch step is undertaken to remove the exposed portion of the oxide layer, using the patterned photoresist as a mask, and leaving exposed a portion of the nitride layer overlying the core region. After removal of the photoresist, the exposed portion of the nitride layer is etched by a wet etch step with hot phosphoric acid, using the pattered oxide layer as a mask.
    Type: Grant
    Filed: November 20, 2000
    Date of Patent: October 23, 2001
    Assignee: Adanced Micro Devices, Inc.
    Inventors: John Foster, Yue-Song He, Jiahua Huang
  • Patent number: 6291082
    Abstract: A dielectric layer has an opening which communicates with a metal line therebeneath. A layer of silver is deposited over the structure and into the opening, and copper is deposited by electroplating in the opening. An additional silver layer is the deposited, and an anneal step is undertaken so that the copper is surrounded or encapsulated by alloy containing copper and silver. After removal of appropriate portions of the silver layers, the copper remains encapsulated or encased by copper-silver alloy.
    Type: Grant
    Filed: June 13, 2000
    Date of Patent: September 18, 2001
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Sergey Lopatin
  • Patent number: 6283113
    Abstract: A tool is provided herein for separating stacked strips of semiconductor structures held by a magazine, which strips have become attached together. The tool is made up of first and second elongated members in side-by-side relation, each member defining a plurality of teeth along an edge thereof. The first and second members are mounted together so as to allow relative reciprocal movement therebetween, so that relative reciprocal movement between the pluralities of teeth is provided. The tool is held with the teeth against the edges of strips carried by the magazine, and the operator squeezes and releases member handles to provide relative reciprocal movement of the teeth. This back-and-forth reciprocal movement causes the teeth to rub against and force apart the strips, to in turn separate them.
    Type: Grant
    Filed: September 14, 2000
    Date of Patent: September 4, 2001
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Adisorn Kanjanavikat
  • Patent number: 5442670
    Abstract: A digital clock divider is capable of dividing a clock frequency n by N.5, where N is an integer, and includes a closed loop of flip-flops numbering twice N.5, and an additional flip-flop to which the clock signal is applied through an inverter, the output signal of the additional flip-flop is 180.degree. out of phase with a signal from a flip-flop of the closed loop. The 180.degree. out-of-phase signals are applied to an OR2 gate, the output signal of which has a frequency of n (clock signal) divided by N.5.
    Type: Grant
    Filed: February 16, 1994
    Date of Patent: August 15, 1995
    Assignee: National Semiconductor Corporation
    Inventor: Wen Shu
  • Patent number: 5176806
    Abstract: A soft magnetic alloy film has a composition formula expressed by Fex Mz Cw. M is at least one metallic element selected from a group consisting of Ti, Zr, Hf, Nb, Ta, Mo or W, or a mixture of these metallic elements. The composition ratio of x, z and w satisfies the relation expressed by 50 atomic % .ltoreq.x.ltoreq.96 atomic %, 2 atomic % .ltoreq.z.ltoreq.30 atomic %, 0.5 atomic % .ltoreq.w.ltoreq.25 atomic %, and x+z+w=100. The metallic structure of the soft magnetic alloy film basically consists of crystal grains having an average grain size of 0.08 .mu.m or below. The metallic structure contains the crystal phase of carbide of the element M.
    Type: Grant
    Filed: September 27, 1990
    Date of Patent: January 5, 1993
    Assignee: Alps Electric Co., Ltd.
    Inventor: Naoya Hasegawa
  • Patent number: 5170088
    Abstract: The present invention relates to a driving mechanism for an electronic part such as a switch, a variable resistor, etc., which can be remote-controlled, wherein an ultrasonic motor is used as a driving source for the electronic part. Therefore the object thereof is to provide a driving mechanism for an electronic part, which produces no electromagnetic noise and for which the construction can be simplified by omitting a converting mechanism and a controlling mechanism.
    Type: Grant
    Filed: June 11, 1991
    Date of Patent: December 8, 1992
    Assignee: Alps Electric Co., Ltd.
    Inventors: Koichi Naito, Kazumasa Ohnishi, Toru Nakazawa
  • Patent number: 5104464
    Abstract: A soft magnetic alloy film has a composition formula expressed by Fex Mz Cw. M is at least one metallic element selected from a group consisting of Ti, Zr, Hf, Nb, Ta, Mo or W, or a mixture of these metallic elements. The composition ratio of x, z and w satisfies the relation expressed by 50 atomic %.ltoreq.x.ltoreq.96 atomic %, 2 atomic %.ltoreq.z.ltoreq.30 atomic %, 0.5 atomic %.ltoreq.w.ltoreq.25 atomic %, and x+z+w=100. The metallic structure of the soft magnetic alloy film basically consists of crystal grains having an average grain size of 0.08 .mu.m or below. The metallic structure contains the crystal phase of carbide of the element M.
    Type: Grant
    Filed: February 1, 1990
    Date of Patent: April 14, 1992
    Assignee: Alps Electric Co., Ltd.
    Inventor: Naoya Hasegawa
  • Patent number: 5099109
    Abstract: An optical reader which has a light emitting element, a photodetector, a light emitting side lens for converging a light emitted from the light emitting element to a surface to be detected, and a photodetecting side lens for converging a light reflected on the surface to be detected to the photodetector, wherein the light emitting side focus point focused at the light emitting element by the light emitting side lens is set at a position separated from the lens farther than the photodetecting side focus point focused at the photodetector by the photodetecting side lens. Thus, the adverse influence of a regular reflection light can be prevented in a small-sized structure and a detecting accuracy can be enhanced without decreasing the light detecting efficiency of the optical reader.
    Type: Grant
    Filed: April 2, 1991
    Date of Patent: March 24, 1992
    Assignee: Alps Electric Co., Ltd.
    Inventors: Hiroshi Ishikawa, Ichiro Morishita
  • Patent number: 5097498
    Abstract: A method of monitoring the sound within a car is disclosed. The occurrence of abnormality indicative of possible auto theft is reported to the driver who is remote from the car by means of the anti-theft system which transmits the occurrence of abnormality to a remote control unit and which turns on the power of the mobile telephone system, so as to make it ready for receiving external calls. The anti-theft system transmits to the driver the sound within the car collected by the microphone of the mobile telephone system, thereby making it possible for the driver at a remote place to ascertain the state of the car.
    Type: Grant
    Filed: November 13, 1987
    Date of Patent: March 17, 1992
    Assignee: Alpine Electronics Inc.
    Inventor: Makoto Namekawa
  • Patent number: 5078019
    Abstract: A trackball device comprising a housing having a circular opening formed in a top wall thereof, a ball received in the housing and partially projecting through the circular opening, a pair of rotatable members arranged orthogonally to each other and rotatable in accordance with rotation of the ball, detectors capable of detecting the amounts of rotation of the respective rotatable members, and elastic members arranged in the vicinity of the edge of the circular opening and capable of suppressing vibration of the ball.
    Type: Grant
    Filed: April 25, 1990
    Date of Patent: January 7, 1992
    Assignee: Alps Electric Co., Ltd.
    Inventor: Tsuyoshi Aoki
  • Patent number: 5059440
    Abstract: A method and apparatus for stretching dough is provided, by which bread dough or confectionery dough is continuously and smoothly stretched by linearly reciprocating a roller over the surface of dough which is continuously conveyed by a series of conveyors, while the roller is rotated by a drive means, and by which method and apparatus the dough can be smoothly stretched without the accumulation of the dough in front of the entrance of the apparatus, thereby obtaining the desired thickness of dough in one operation from the continuously supplied dough material.
    Type: Grant
    Filed: March 1, 1990
    Date of Patent: October 22, 1991
    Assignee: Rheon Automatic Machinery Co., Ltd.
    Inventor: Torahiko Hayashi
  • Patent number: 5044917
    Abstract: An apparatus for stretching dough is provided, by which bread dough or confectionery dough is continuously and smoothly stretched by linearly reciprocating a roller over the surface of dough which is continuously coveyed by a series of conveyors, while the roller is rotated by a drive means, and by which method and apparatus the dough can be smoothly stretched without the accumulation of the dough in front of the entrance of the apparatus, thereby obtaining the desired thickness of dough in one operation from the continuously supplied dough material.
    Type: Grant
    Filed: July 5, 1990
    Date of Patent: September 3, 1991
    Assignee: Rheon Automatic Machinery Co., Ltd.
    Inventor: Torahiko Hayashi
  • Patent number: 5043660
    Abstract: An encoder has a positive feedback means for feeding back a polarity-inverted output signal to a comparator or an MR sensor circuit thereby to stabilize output waveform duty ratio against deviation between the sensor circuit and comparator in source voltage.
    Type: Grant
    Filed: September 12, 1989
    Date of Patent: August 27, 1991
    Assignee: Alps Electric Co., Ltd.
    Inventor: Kazuo Hasegawa
  • Patent number: 5039542
    Abstract: A method for stretching dough comprising two pairs of rollers and means for imparting vibrations to the dough positioned between the pairs of rollers is provided. In this method, vibrations are imparted to dough, which causes the thixotropic effect in the dough. Such dough can be readily stretched by being subjected to a tensile stress caused by the difference in the peripheral speed of the pairs of rollers. Therefore, dough can be stretched without subjecting it to high pressure during the stretching process.
    Type: Grant
    Filed: June 25, 1990
    Date of Patent: August 13, 1991
    Assignee: Rheon Automatic Machinery Co., Ltd.
    Inventor: Torahiko Havashi
  • Patent number: D320009
    Type: Grant
    Filed: November 29, 1989
    Date of Patent: September 17, 1991
    Assignee: Alps Electric Co., Ltd.
    Inventors: Yosuki Yamamoto, Michael R. Barry
  • Patent number: D328092
    Type: Grant
    Filed: February 15, 1990
    Date of Patent: July 21, 1992
    Assignee: Alps Electric Co., Ltd.
    Inventors: Ikutaro Inoue, Yuki Oishi