Abstract: An integrated antenna structure wherein a metallic RF antenna provides part of the package structure for an RF transmit/receive chip. The requirement for a separate package to house the driver chip as well as for the wire or cable between the driver chip and the antenna are eliminated. The antenna itself provides a convenient heat sink. This arrangement is particularly attractive at UHF frequencies.

Abstract: An MOS integrated circuit device with improved electrostatic protection capability includes high and low voltage rails for bringing externally-supplied power to points within the chip. Input bonding pads communicate input signals to the chip from external sources. Clamping circuitry connected to the input bonding pads clamps the input bonding pads to the low voltage rail during an electrostatic discharge event appearing on the input bonding pads. A receiver circuit is coupled to each input bonding pad. Each receiver circuit has a receiver input node, a receiver output node, and overvoltage-sensitive MOS circuitry between the input and output nodes. A conductor connects each input bonding pad to its receiver circuit. The conductor has a length greater than the distance between the input bonding pad and its receiver circuit. The conductor has an inductance sufficient to prevent high frequency components of ESD events received at an input bonding pad from reaching its receiver circuit.

Abstract: Methods of forming, in an integrated circuit, aluminum-silicon contacts with a barrier layer is disclosed. The barrier layer is enhanced by the provision of titanium oxynitride layers adjacent the silicide film formed at the exposed silicon at the bottom of the contact. The titanium oxynitride may be formed by depositing a low density titanium nitride film over a titanium metal layer that is in contact with the silicon in the contact; subsequent exposure to air allows a relatively large amount of oxygen and nitrogen to enter the titanium nitride. A rapid thermal anneal (RTA) both causes silicidation at the contact location and also results in the oxygen and nitrogen being gettered to what was previously the titanium/titanium nitride interface, where the oxygen and nitrogen react with the titanium metal and nitrogen in the atmosphere to form titanium oxynitride. The low density titanium nitride also densifies during the RTA.

Abstract: A method of operating a magnetically operated display unit that includes a frame of a color, a plate pivotably mounted on the frame which includes a first surface of a color different from that of the frame and a second surface of a color identical to that of the frame, a magnet embedded in the plate, a U-shaped ferromagnetic element mounted on the frame so that two tips of the magnet are located between two tips of the U-shaped ferromagnetic element, a solenoid mounted on the U-shaped ferromagnetic element and a light emitting diode mounted on the frame. The plate contains a cutout designed for receiving the light emitting diode and one of the tips of the U-shaped ferromagnetic element. The tip of the light emitting diode is located on a level between the plate and the tips of the U-shaped ferromagnetic element. The light emitting diode is visible sufficiently above the surface of the plate so that its light can shine on that surface.

Abstract: A memory device with a test mode control circuit for entering a test mode responsive to a high on the Vss pin or a low on the Vcc pin that supply power to the output pins during normal operation of the memory device. In test mode the wordlines and bitlines of the memory remain active from the time they are activated, typically when the clock switched from a first to a second logic state, until the clock switches back to the first logic state.

Abstract: A vertical conduction NPN bipolar transistor with a tunneling barrier of silicon carbide in the emitter providing a high emitter injection efficiency and high, stable current gain. The emitter structure comprises a heavily doped polysilicon layer atop a silicon carbide layer that contacts a shallow, heavily doped emitter region at the surface of an epitaxial silicon layer, which is disposed on a monocrystallinie silicon substrate. The silicon carbide layer is about 100 to 200 angstroms thick and has a composition selected to provide an energy band gap in the 1.8 to 3.5 eV range. The thickness and composition of the silicon carbide can be varied within the preferred ranges to tune the transistor's electrical characteristics and simplify the fabrication process.

Abstract: A variable capacitor in a semiconductor device is described in which the capacitance is varied by the movement of a dielectric material in the space between the plates of the capacitor in response to an external stimulus. A method of making such a variable capacitor is also described in which the capacitor is built in a layered structure with the top layer including a portion of dielectric material extending into the space between the capacitor plates. After formation of the top layer, an intermediate layer is etched away to render the top layer flexible to facilitate movement of the dielectric material in the space between the capacitor plates.

Abstract: Composite layers of titanium silicide and polysilicon define a fuse resistor within a programmable fuse element that increases its resistance from about 50 ohms in the unprogrammed state to about 250 K-ohms in the programmed state by creating a discontinuity in the silicide layer immediately over a PN junction in the polysilicon layer. The resistance of the fuse resistor in the programmed state is determined by the reverse-biased diode characteristic of the PN junction. Portions of a metallic layer overlie portions of the fuse resistor except at the site of the PN junction in the polysilicon layer so that the silicide is preferentially heated immediately above the PN junction to cause the discontinuity to occur at that site. The metallic layer portions serve both as a heat sink for the underlying portions of the silicide layer and as electrical connections to the fuse resistor.

Abstract: Method and system for monitoring a plasma etch process performed in a plasma processing chamber, the method and system being capable of accurately monitoring and controlling the plasma etch process without being affected by the change in a plasma light emission transmission characteristically caused by process polymer depositions on a detecting surface or sampling window.

Abstract: A low-voltage high-current discrete insulated-gate field-effect transistor which is made by a very economical process with two silicon etches. A buried poly gate gates conduction along a trench sidewall. The channel is provided by the residuum of an epi layer, and the source diffusion is provided by an unmasked implant which is screened only by various grown oxides.

Abstract: An MOS integrated circuit device with improved electrostatic protection capability includes high and low voltage rails for bringing externally-supplied power to points within the chip. Input bonding pads communicate input signals to the chip from external sources. Clamping circuitry connected to the input bonding pads clamps the input bonding pads to the low voltage rail during an electrostatic discharge event appearing on the input bonding pads. A receiver circuit is coupled to each input bonding pad. Each receiver circuit has a receiver input node, a receiver output node, and overvoltage-sensitive MOS circuitry between the input and output nodes. A conductor connects each input bonding pad to its receiver circuit. The conductor has a length greater than the distance between the input bonding pad and its receiver circuit. The conductor has an inductance sufficient to prevent high frequency components of ESD events received at an input bonding pad from reaching its receiver circuit.

Abstract: A method of stress testing a DRAM such that higher voltages of up to the supply voltage VDD may be applied to the oxide of memory cell capacitors. The DRAM is driven into a stress test mode when the sense amplifiers have been isolated, the precharge voltage and the half bitlines have been grounded, and the word line boost circuitry has been disabled or set to operate at a lower voltage level. These conditions allow the memory cell capacitors, isolated from the sense amplifiers and the word line boost circuitry, to be stress tested independently at a lower power supply and word line voltage levels than are used to stress test conventional DRAMs. The memory cell oxide stresses are applied at room temperature, in wafer form, in seconds instead of hours, and before the configuration of redundancy elements. The inventive method permits the critical burn-in VDD value to be chosen so as to optimize burn-in of the memory cell capacitors and peripheral CMOS circuitry.

Abstract: This invention is a method for boosting the voltage level of a wordline in a DRAM having bitlines, sense amplifiers, isolation devices, bitline loads, an X decoder device and a Y select device. In the preferred method, when the wordline level reaches VDD, the decoder is disabled causing the wordline to stay at the VDD level. The sensing amplifier is also caused to be isolated so as to allow the wordline voltage to track the bitline voltage through capacitive coupling across the access MOSFET of the memory cell being read or written to. As a result, the wordline voltage is increased to a supervoltage as the bitline voltage increases. After the supervoltage is reached on the wordline, the sensing amplifier is connected causing feedback from the amplifier to drive the wordline voltage toward the VDD level and the disabled bit toward GND during this time. At the end of the wordline clock signal, the voltage is at GND and each of the bitlines are returned to their neutral mid-voltage level.

Abstract: A magnetically operated display unit includes a frame of a color, a plate pivotably mounted on the frame which includes a first surface of a color different from that of the frame and a second surface of a color identical to that of the frame, a magnet embedded in the plate, a U-shaped ferromagnetic element mounted on the frame so that two tips of the magnet are located between two tips of the U-shaped ferromagnetic element, a solenoid mounted on the U-shaped ferromagnetic element and a light emitting diode mounted on the frame. The plate contains a cutout designed for receiving the light emitting diode and one of the tips of the U-shaped ferromagnetic element. The tip of the light emitting diode is located on a level between the plate and the tips of the U-shaped ferromagnetic element. The light emitting diode is visible sufficiently above the surface of the plate so that its light can shine on that surface. Two opposite currents are selectively directed through the solenoid.

Abstract: A dynamic access memory (DRAM) device includes a plurality of memory cells for storing data signals. The DRAM device has a row decoding mechanism that allows selected memory cells to be accessed upon receipt of a row address signal during a read operation and a write operation. A latching mechanism is provided and receives and holds onto the data signals from the selected memory cells when activated during the read operation and also isolates itself from the selected memory cells when deactivated during the write operation. An included refresh address generating mechanism generates a plurality of internal row address signals that allows selection of a plurality of memory cells for refreshing the stored data signals. The DRAM device also has a multiplexer mechanism that transmits a plurality of external row address signals to the row decoding mechanism in the write operation.

Abstract: A photodiode structure augmented with active area photosensitive regions is used for detecting impinging radiation. The photodiode includes a semiconductor base layer doped with impurities of a first carrier type, a field oxide layer disposed upon the base layer with an opening formed therethrough, a plurality of auxiliary oxide layers wherein each is separately disposed upon the base layer, and a semiconductor diffusion layer doped with impurities of a second carrier type arranged upon the base layer and in contact with the oxide layers. When the photodiode is electrically energized, a plurality of integral photosensitive regions is created within the depletion region to facilitate the detection of impinging radiation at an increased quantum efficiency.

Abstract: A variable capacitor in a semiconductor device is described in which the capacitance is varied by the movement of a dielectric material in the space between the plates of the capacitor in response to an external stimulus. A method of making such a variable capacitor is also described in which the capacitor is built in a layered structure with the top layer including a portion of dielectric material extending into the space between the capacitor plates. After formation of the top layer, an intermediate layer is etched away to render the top layer flexible to facilitate movement of the dielectric material in the space between the capacitor plates.

Abstract: A method of forming a thick interlevel dielectric layer containing sealed voids, formed in a controlled manner, over a substantially planar surface in semiconductor device structure, and the semiconductor structure formed according to such a method. The sealed voids are used to reduce interlevel capacitance. A plurality of metal signal lines are formed over a globally planarized insulator. A thick layer of first conformal interlevel dielectric is deposited over the metal signal lines and over the intermetal spacings formed between the metal signal lines. Because of the thickness, flow properties, and manner of deposition of the interlevel dielectric and the aspect ratio the intermetal spacings, voids are formed in the first conformal interlevel dielectric, in the intermetal spacings. This interlevel dielectric is then etched or polished back to the desired thickness, which exposes the voids in the wider intermetal spacings, but does not expose voids in the narrower intermetal spacings.

Abstract: A special rail is provided along each edge of an integrated circuit chip with bias circuits connected to the ends of each special rail. The bias circuits charge the special rail to the V.sub.DD voltage level during normal operation, and clamp the special rail to the V.sub.SS rail upon the occurrence of an overvoltage event. Input bonding pads are provided along each edge of the chip and are connected through diodes to the special rail so that 5 volt signals applied to the input bonding pads do not cause damage to the device when operated from a 3.3 volt supply. A signal line of extended length is provided between each input bonding pad and its receiver circuit and includes folded portions for adding to the length of the signal line to form a high frequency inductor to protect the receiver circuit at the onset of an overvoltage event before clamping becomes effective.

Abstract: An integrated circuit device such as an SRAM operating in a battery backup mode, or operating in a quiescent mode when deselected in the operation of a portable electronic device, includes a power dissipation control circuit that reduces the voltage on an internal power supply node so that the memory array is powered at a minimum level sufficient to retain the data stored therein intact.