Patents Represented by Attorney, Agent or Law Firm Peter V. Corless
  • Sequential build circuit board plating process
    Patent number: 6582581
    Abstract: A method for manufacture of a circuit method board which comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.
    Type: Grant
    Filed: May 12, 2000
    Date of Patent: June 24, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Robert L. Goldberg, Charles R. Shipley