Abstract: A chuck (82) for lamp-heated thermal and plasma semiconductor wafer (38) processing comprises an absorbing surface (171) for absorbing optical energy from an illuminator module (84) that transforms the electrical energy into radiant optical energy. Chuck (82) includes an absorbing surface (171) that absorbs optical energy and distributes the resultant thermal energy. From the absorbing surface, a contact surface (168) conducts the heat energy to semiconductor wafer (38) and uniformly heats the semiconductor wafer (38) with the distributed thermal energy. Chuck (82) not only provides significantly improved process temperature uniformity, but also allows for the generation of RF plasma for plasma-enhanced fabrication processes as well as for in-situ chamber cleaning and etching. Additionally, chuck (82) provides at least two methods of determining semiconductor wafer temperature; a direct reading thermocouple (112) and association with the pyrometry sensor of illuminator module (84).