Abstract: A leadframe with a chip pad for two-sided stacking including a chip pad and a plurality of leads is disclosed. A dielectric adhesive layer is formed on the lower surface of the chip pad and is adhered onto a first trace layer, which has a connecting pad. At least a through hole passes through the chip pad, the dielectric adhesive layer and the first trace layer. An electrically-conductive material is formed inside the through hole for electrically connecting the connecting pad of the first trace layer to the chip pad. When an electronic component is mounted on the lower surface of the chip pad, a plurality of bonding wires having one ends on the upper surface of the chip pads can electrically connect the electronic component to the leads for achieving two-sided stacking of the chip pad.

Abstract: A water removing mechanism for the evaporator in a refrigeration system in which an electrode element is disposed beneath the evaporator and a pulse voltage source is provided to connect the evaporator and the electrode element to generate an electric field with high voltage and low current between the evaporator and the electrode element, causing water condensed on the surface of the fins of evaporator to bear negative charge and the electrode element to bear positive charge and thereby allowing the water on the evaporator to be driven by the electric field to leave the evaporator at an accelerated speed.

Abstract: Targetable diagnostic and/or therapeutically active agents, e.g. ultrasound contrast agents, having reporters comprising gas-filled microbubbles stabilised by monolayers of film-forming surfactants, the reporter being coupled or linked to at least one vector.

Abstract: Disclosed are yogurt products having a plurality of layers, portions or regions, each having a discrete color and containing comprising a stirred style yogurt. The layers are in direct physical contact and do not have an intermediate barrier. The yogurt layers are relatively high in viscosity (15,000 to 30,000 cps) and the difference in viscosity between portions is less than about 3,000 cps. Those yogurt layers having a color essentially contain selected non-bleeding colorants and, optionally, naturally colored ingredients such as fruit puree. Bleeding/migration of colorants between layers and mixing upon handling is minimized by selecting viscosity and colorants.

Abstract: A pharmaceutical formulation comprising (i) one or more particulate medicaments, and (ii) 1,1,1,2-tetrafluoroethane as propellant, which formulation contains less than 0.0001% w/w surfactant based upon the weight of medicament, particulate medicament being present in an amount from 0.005 to 5% w/w relative to the total weight of the formulation and having a particle size of less than 100 microns, with the proviso that said medicament is other than salmeterol, salbutamol, fluticasone propionate, beclomethasone dipropionate or a physiologically acceptable salt or solvate thereof and with the proviso that when said formulation consists of betamethasone, ergotamine tartrate or sodium cromoglycate and 1,1,1,2-tetrafluoroethane the weight to weight ratio of medicament to propellant is other than 69:7900 or 0.866% w/w.

Abstract: A substrate structure mainly comprises a plurality of substrate units and a plurality of dispensing holes thereon. A main hole is provided on the surface of the substrate unit, the two ends of which are adjacent to the dispensing hole for dispensing liquified encapsulant material to form a semiconductor package. The semiconductor package mainly comprises a chip, a substrate and an encapsulant. The chip is adhesively attached to the substrate, and the encapsulant covers around the are along one side of the chip. Then the encapsulant flows from the upper surface of the substrate to the lower surface to cover wire areas by means of the liquified encapsulant material flowing through the dispensing hole from the upper surface of the substrate to the lower surface.

Abstract: A method for forming a self-aligned contact for a trench DMOS transistor comprises: providing a semiconductor substrate; etching a trench into the semiconductor substrate at a selected location on the surface of the semiconductor substrate; forming a first dielectric layer that covers the semiconductor substrate and walls of the trench; forming a plug in the trench, which comprises a step of depositing a semiconductor layer that covers the semiconductor substrate and fills in the trench, and a step of etching the semiconductor layer until the plug is below the trench for about 0.2 to 0.3 micron; forming a second dielectric layer on the plug; and forming a conductive layer over the second dielectric layer and the surface of the semiconductor substrate for ohmic contact regions.