Abstract: A compliant S-shaped lead for resiliently supporting an integrated circuit chip package in spaced relation generally parallel to a printed circuit board. The S-lead bends and twists to absorb forces which would otherwise be exerted on solder joints due to temperature cycling and vibration. The symmetrical S-lead self-centers on both the package and PC board to provide minimum stress. The leads are held by a support strip for connection to the chip carrier. Thereafter, the support strip is removed and the carrier positions the leads for connection to the circuit board.
Type:
Grant
Filed:
March 28, 1988
Date of Patent:
May 9, 1989
Assignee:
Control Data Corporation
Inventors:
Deepak K. Pai, Michael J. Julik, Robert W. Fluhrer