Patents Represented by Attorney, Agent or Law Firm Robert C. Winkle
  • Method of dissipating static electric charge from a chip assembly during a manufacturing operation
    Patent number: 6764877
    Abstract: An apparatus and method for dissipating static electrical charge following a manufacturing operation is disclosed. A semiconductor package is provided with ground pads that are located to assure electrical contact with ejection pins used to translate the package from one position to another. Static electricity builds up on the semiconductor package. The ejection pins provide the pathway for dissipating static electrical charge out of the semiconductor package.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: July 20, 2004
    Assignee: Intel Corporation
    Inventors: Arthur K. Lin, Robert A. Anderson, Kuljeet Singh