Abstract: A thermosetting composition comprising (a) 97.9 to 40 percent by weight of at least one bis(dihydrobenzoxazine) prepared by the reaction of an unsubstituted or substituted bisphenol with at least one unsubstituted position ortho to each hydroxyl group, formaldehyde and a primary amine; (b) 2 to 50 percent by weight of at least one organic polyamine; and (c) 0.1 to 10 percent by weight of at least one curing catalyst, selected from the group of carboxylic acids, sulfonic acids and phosphonic acids having at least two acid groups and no other reactive groups; wherein the percent by weight refer to the total amount of components (a), (b) and (c) in the composition, with the proviso that (a), (b) and (c) add up to 100 percent by weight; and (d) and optionally other components. Cured products of these compositions show valuable chemical, physical and mechanical properties.
Abstract: A method of a seamless model free of bond lines. The method includes the sequential steps of providing a substructure having an exposed outer surface, applying a modelling paste to a structure support in the form of a continuous layer, curing the applied modelling paste, and machining the cured layer of modelling paste to the desired contour. The modelling paste a low density curable composition prepared from thixotropic epoxy or polyurethane containing microballoons.
Abstract: A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, and b) as curing agent a composition comprising b1) 40-100 wt % of a reaction product from the reaction of b1a) at least one diglycidyl- and/or at least one monoglycidylether with b1b) a composition comprising a volatile monoamine and a polyamine, said composition b1b) is used in an amount to provide an excess amino groups relative to epoxy groups from b1a), and whereby the excess of monoamine is removed off from the reaction product, b2) 0-60 wt % of a polyamine, and b3) 0-25 wt % of a polyphenol novolac, and whereby the sum of components b1), b2) and b3) is 100 wt %, providing long pot life combined with fast cure times at low temperatures, thus making said compositions especially useful for marine and offshore coatings, industrial maintenance, construction, tank and pipe linings, adhesive, automobile and electrical potting applications.
Type:
Grant
Filed:
January 23, 2007
Date of Patent:
August 31, 2010
Assignee:
Huntsman International LLC
Inventor:
Isabelle Marie Marguerite Muller-Frischinger
Abstract: Epoxy acrylates of the formulae (A), (B) and epoxy acrylate mixtures comprising at least one of the compounds (A) or (B) are novel and find use in coating materials or adhesives featuring high UV stability
Type:
Grant
Filed:
December 18, 2003
Date of Patent:
August 8, 2006
Assignee:
Huntsman Advanced Materials Americas Inc.
Abstract: Compounds of formula (I) or (II), wherein R1 is C1–C18alkyl; C5–C12cycloalkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups; C5–C22aryl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups; or C7–C30aralkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups, and the radicals R2 to R13 are each independently of the others hydrogen; —NO2; dialkylamino; alkylthio; alkylsulfonyl; halogen; C1–C18alkyl; C1–C18alkoxy; C1–C18alkoxyalkyl; C5–C12cycloalkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups; C5–C22aryl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups; or C7–C30aralkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups, are suitable as flame-proofing agents for thermoplastic or thermosetting polymers
Type:
Grant
Filed:
November 20, 2001
Date of Patent:
May 30, 2006
Assignee:
Huntsman Advanced Materials Americas Inc.