Abstract: An electrostatic chuck is provided having a plurality of small electrostatic structures for holding an electrically conductive workpiece forming a plate of a capacitor. Each electrostatic structure includes a first thermally conductive single-crystal dielectric sheet, and a first electrode in sheet form sandwiched between the first dielectric sheet and a second dielectric surface. The workpiece, typically a conductive or semiconductive wafer, is juxtaposed to the first dielectric sheet of each electrostatic structure and forms a second electrode. The second dielectric sheet, if thick, is used as a thermally conducting base plate which can be attached to a low pressure reactor. If the second dielectric is a thin sheet, then it is mounted to a thermally conductive metal base plate through which heat can be controllably conducted. The resultant electrostatic structure may be brazed to the metal base plate if the thermal expansion characteristics of the two elements are sufficiently matched.

Abstract: The present invention relates to chemical delivery systems and methods for delivery of liquid chemicals. In one embodiment, the present invention relates to systems having multi-reservoir load cell assemblies for delivering chemicals used in the semiconductor industry. In one embodiment, the present invention provides a multi-reservoir load cell assembly, including a controller, a buffer reservoir, a main reservoir, one or more load cells, coupled to the assembly and to the controller, operable to weigh the liquid in the reservoir(s), a plurality of supply lines, each supply line having a valve and connecting one of the supply containers to the main reservoir, and a gas and vacuum sources for withdrawing the liquid from the assembly when demanded by the controller and for refilling the assembly from the supply containers.

Abstract: The invention provides a hot plate oven suitable to bake materials on substrates such as flat panel displays and large semiconductor wafers such as 300 mm in diameter and above. The hot plate oven in one embodiment includes an insulated chamber, a heater in the chamber, a door for entry of a substrate, a frame, preferably water cooled, for suspending the substrate above the heater, a substrate lowering mechanism to hold the frame and lower the substrate to a certain height above the heater at least one fluid cooled pin to counteract sag when the substrate is heated, and a set of manifolds and valves to feed and exhaust gases, vapors, and apply a vacuum to the chamber. In another feature, the oven assembly includes a stack of low profile ovens, each having a door on the side for entry of a substrate.

Abstract: An apparatus for adjusting the tension on a heating filament in a reactor used in carbon deposition on a substrate via chemical-vapor deposition is disclosed, as is a method for preventing breakage of the filaments during operation. The apparatus comprises a force regulator attached to an array of heating filaments. Preferably, the force regulator is adjustable and is adjusted prior to reactor operation and/or periodically or continuously as the filaments lengthen due to carburization in the carbon-vapor environment of the reactor. The adjustable force regulator attached to an array of filaments enables effective regulation of the force on a filament during reactor operation and provides an easily-maintained reactor with quick turn-around time between cycles of use.

Abstract: Silicon-germanium-based compositions comprising silicon, germanium, and carbon (i.e., Si--Ge--C), methods for growing Si--Ge--C epitaxial layer(s) on a substrate, etchants especially suitable for Si--Ge--C etch-stops, and novel methods of use for Si--Ge--C compositions are provided. In particular, the invention relates to Si--Ge--C compositions, especially for use as etch-stops and related processes and etchants useful for microelectronic and nanotechnology fabrication.