Abstract: A power semiconductor component having a pn junction, a body with a first basic conductivity, a well-like region with a second conductivity which is arranged horizontally centrally in the body, has a first two-level doping profile and has a first penetration depth from the first main surface into the body. In addition, this power semiconductor component has an edge structure which is arranged between the well-like region and the edge of the power semiconductor component and which comprises a plurality of field rings with a single-level doping profile, a second conductivity and a second penetration depth, wherein the first penetration depth is no more than about 50% of the second penetration depth.

Abstract: A combination of a main carrier and a printed circuit board. Light and heavy electrical and/or electronic components are fixed on the printed circuit board, wherein at least one heavy component is mechanically fixedly connected to the main carrier and electrically conductively connected to conductor tracks of a first section of the printed circuit board. The first section of the printed circuit board is electrically conductively connected to a second section of the printed circuit board and decoupled from the second section of the printed circuit board with regard to mechanical vibrations by means of a decoupling device. The decoupling device may be, for example, a flexible section or a recess formed in said printed circuit board.

Abstract: A power semiconductor module, for placement on a cooling component. The module includes a substrate, at least two power semiconductor components arranged on the substrate, a housing and outwardly routed load and control connections. The substrate has an insulator body with a first main area that faces the interior of the power semiconductor module, and has interconnects at load potential arranged thereon. Each load connection is formed as a shaped metal body with outer contacts, a strip-like section and with inner contacts extending from the strip-like section to the substrate and making circuit-compliant contact therewith. In addition, the load connections are substantially completely encased by insulation except in the vicinity of the outer and inner contacts and accordingly are electrically insulated from one another.

Abstract: A power semiconductor module comprising a substrate, a circuit formed thereon and having a plurality of conductor tracks that are electrically insulated from one another and power semiconductor components arranged on the conductor tracks. The latter are connected in a circuit-conforming manner by a connection device, which has an alternating layer sequence of at least two electrically conductive layers with at least one electrically insulating layer between them. In this case, the substrate has a first sealing area, which uninterruptedly encloses the circuit. Furthermore, this sealing area is connected to an assigned second sealing area on a layer of the connection device by a connection layer. According to the invention, this power semiconductor module is produced by applying pressure to the substrate, to the power semiconductor components and to the connection device.

Abstract: A method for making a power semiconductor module and a module produced by that method, wherein the module includes a substrate, a connection device and load terminal elements, wherein power semiconductor components are arranged on a conductor track of the substrate and connected to one of the load terminal element by the connection device. The power semiconductor module has auxiliary contact pads which can be connected to an external printed circuit board. The primary production step in this case is cohesively connecting respective first contact areas of the first conductor tracks to at least one second contact area of a power semiconductor component and at least one third contact area of a load terminal element; afterwards, the assemblage composed of at least one power semiconductor component of a connection device and load terminal elements is arranged to form a housing of the power semiconductor module.

Abstract: A power semiconductor module having at least one fuse. The power semiconductor module comprises a housing, load terminal elements that lead outside of the housing, and a substrate disposed inside the housing with a plurality of metal connecting tracks of different polarity electrically insulated from one another. On at least one of these connecting tracks, at least one power semiconductor component is disposed and is connected correctly in terms of circuitry to first connecting elements that have a first line cross section. The fuse comprises a second connecting element that has a second line cross section, less than the first, and is disposed between two connecting tracks and/or between a connecting track and a load terminal element. The second connecting element is sheathed in one portion by an explosion protection means.

Abstract: A power semiconductor module comprises at least one power semiconductor component and a connection device which makes contact with the power semiconductor component. The connection device is composed of a layer assembly having at least one first electrically conductive layer facing the power semiconductor component and forming at least one first conductor track, and an insulating layer following in the layer assembly, and a second layer following further in the layer assembly and forming at least one second conductor track, the second layer being remote from the power semiconductor component. The power semiconductor module has at least one internal connection element, wherein the internal connection element is embodied as a contact spring having a first and a second contact section and a resilient section. The first contact section has a common contact area with a first or a second conductor track of the connection device.

Abstract: An arrangement comprising at least one power semiconductor module and a transport packaging, wherein the power semiconductor module has a base element, a housing and connection elements and the transport packaging has a generally planar cover layer, a cover film and at least one trough-like plastic shaped body for each power semiconductor module. The at least one plastic shaped body only partly encloses the respective power semiconductor module and a part of the plastic shaped body does not directly contact the power semiconductor module. Furthermore, a first side of the at least one power semiconductor module becomes situated directly or indirectly on the first main surface of the cover layer, while the cover film covers the further sides of the power semiconductor module directly and/or indirectly, and bears at least partly against the plastic shaped body.

Abstract: A power semiconductor module having a substrate, a housing and a pressure device. The substrate further includes a body formed of an insulating material and structured conductor tracks which are arranged thereon and have load and auxiliary potentials. The substrate also includes recesses in the region of the structured conductor tracks in at least two areas that are not covered by a power semiconductor component. Furthermore, the pressure device has latching lugs, which are disposed in the recesses and are arranged therein in a form-fitting and/or frictional manner, at least two points on the side of the pressure device which faces the substrate.

Abstract: A power semiconductor module having a housing, a pressure member, a substrate including at least one contact surface, and at least one connection element leading towards the exterior of the housing. The connection element has a first contact device, a resilient section and a second contact device. The pressure member has two stop elements. The first contact device is electrically conductively connected to the contact surfaces of the substrate. The second contact device is arcuate in shape and has at least one deformation at the beginning and at the end of the arc, wherein, as a result of the deformations of the second contact device co-operating with the two stop elements of the pressure member, the connection element is prestressed.

Abstract: Method for operating a converter circuit with voltage boosting with N half-bridges, which in each case can be connected by their center connection to a phase of an N-phase generator and at an end side are connected in parallel with a series circuit formed by two capacitances, wherein each half-bridge contains a Top switch and a Bot switch, in which, in a PWM method with a fixed period duration at the beginning of the period duration, all the TOP switches are simultaneously switched on for the duration of a TOP switched-on interval. After half the period duration all the BOT switches are simultaneously switched on for the duration of a BOT switched-on interval wherein the TOP switched-on interval, and the BOT switched-on interval amount at most to half the duration of the period.

Abstract: An isolating device for a power semiconductor comprising n power terminals for a power grid comprises n module terminals, n grid terminals, n connecting lines which connect the module terminals and grid terminals and have overcurrent fuses, and a tripping controller. The tripping controller includes a detector for detecting the rupture of an overcurrent fuse and a tripping unit for tripping an overcurrent fuse. A power module contains a power semiconductor and an isolating device. A system installation contains at least two power modules connected in parallel. In a method for operating an isolating device, at least one of the overcurrent fuses is tripped upon a predetermined tripping criterion being met.

Abstract: A power semiconductor component having a basic body and at least one contact area. At least one first thin metallic layer of a first material is arranged on the contact area. A second metallic layer—thicker than the first—of a second material is arranged on the first material by a pressure sintering connection of said material. The associated method has the following steps: producing a plurality of power semiconductor components in a wafer; applying at least one first thin metallic layer on at least one contact area of a respective power semiconductor component; arranging a pasty layer, composed of the second material and a solvent, on at least one of the first metallic layers for each power semiconductor component; pressurizing the pasty layer; and singulating the semiconductor components.

Abstract: A power semiconductor module comprising a housing of a first plastic, at least one substrate carrier with a circuit constructed thereon and electric terminating elements extending therefrom. The housing includes attachment means for its permanent connection with the substrate carrier. The housing has a permanently elastic sealing device of a second plastic which is formed integrally with the housing and encircles and is directed towards a first inner main surface of the substrate carrier. A method for constructing such a module includes the steps of constructing a housing of a first mechanically stable plastic and a sealing device of a second permanently elastic plastic; disposing the at least one substrate carrier on the housing; and permanently connecting the housing to the substrate carrier.

Abstract: A frequency converter circuit for a double-fed asynchronous generator with a variable power output, which can be connected to a voltage network contains a rotor rectifier, which can be connected to the rotor of the asynchronous generator, a network frequency converter, which can be connected to the voltage network, and an intermediate circuit. The intermediate circuit contains a semiconductor switch arranged on the rotor rectifier, an intermediate circuit capacitor arranged on the network frequency converter, and a diode arranged between the semiconductor switch and the intermediate circuit capacitor. According to a method for operating such a frequency converter circuit, the semiconductor switch is kept closed during the sub-synchronous operation of the asynchronous generator, and during at least some periods of synchronous or super-synchronous operation of the asynchronous generator the semiconductor switch is opened.

Abstract: A display device has two interlocked contrasting elements. A display element includes indicia and a first locking member. The background element includes a second locking member complementarily shaped to conform to the shape of the first locking member. The first locking member has two portions. The first portion is a waffle plate which tapers from top to bottom. The second portion includes a plurality of frusto-conical pads disposed beneath nodes of the waffle plate of the second portion.

Abstract: A needle protective assembly includes a ratchet and pawl arrangement for permitting the unidirectional movement of a protective sleeve along a body of a dispenser, such as a hypodermic syringe. The sleeve is adapted to cover a standard Y-site diaphragm, and includes a lock to secure the sleeve to the Y-site while in use. The assembly may also include indicia on the exterior thereof to measure the amount of needle exposed beyond the end of the sleeve, if the sleeve is not in its fully extended position. The assembly may further include a luer lock, for attaching the assembly to pre-existing standardized fittings.

Abstract: A fluid dispenser includes a resilient housing having opposing walls. A conduit leads from the interior of the housing to its exterior, and may be used to conduct the fluid from the interior of the housing to its desired end location. A serrated member is affixed to the interior of one of the opposing walls, and a pin is affixed to the other wall. When pressure is exerted on the opposing walls, the pin slides along the serrations of the serrated member, causing an interruption of the continuous pressure exerted on the walls, thereby causing the fluid to be delivered in a pulsed stream.

Abstract: Briefly stated, the invention is directed to a method for the diagnosis of a malady in a subject by the observing of a degree of reaction between the leukocytes in the subject's blood with a foreign entity having a predetermined relationship with the malady being diagnosed.

Abstract: A swimming pool cover support system for maintaining the cleanliness of a pool during periods the pool is not in use includes at least one central support member, and a plurality of support arms. The top of the support member is positioned at a height greater than the distance from the bottom of the pool, at the location of the support member, to a height over the highest point on the side of the pool. Each of the plurality of support arms is attached at one end thereof to the top of the central support member, and at the other end thereof contacts a side of the pool. The other end of each support arm is secured to the side of the pool by means of a side brace affixed to the side of the pool. A cover is disposed over the central support member and support arms, and suspended thereby over the surface of the pool.