Patents Represented by Attorney S. Matthew Cairns
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Patent number: 8343580Abstract: Methods of vapor depositing metal-containing films using certain organometallic compounds containing a carbonyl-containing ligand are disclosed.Type: GrantFiled: September 14, 2010Date of Patent: January 1, 2013Assignee: Rohm and Haas Electronic Materials LLCInventors: Qing Min Wang, Deodatta Vinayak Shenai-Khatkhate, Huazhi Li
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Patent number: 8277886Abstract: Delivery devices for delivering solid precursor compounds in the vapor phase to reactors are provided. Such devices include a precursor composition of a solid precursor compound with a layer of packing material disposed thereon. Also provided are methods for transporting a carrier gas saturated with the precursor compound for delivery into such CVD reactors.Type: GrantFiled: May 22, 2007Date of Patent: October 2, 2012Assignee: Rohm and Haas Electronic Materials LLCInventor: Deodatta Vinayak Shenai-Khatkhate
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Patent number: 8277887Abstract: Delivery devices for delivering solid precursor compounds in the vapor phase to reactors are provided. Such devices include a precursor composition of a solid precursor compound with a layer of packing material disposed thereon. Also provided are methods for transporting a carrier gas saturated with the precursor compound for delivery into such CVD reactors.Type: GrantFiled: June 28, 2011Date of Patent: October 2, 2012Assignee: Rohm and Haas Electronic Materials LLCInventor: Deodatta Vinayak Shenai-Khatkhate
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Patent number: 8268158Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.Type: GrantFiled: August 11, 2011Date of Patent: September 18, 2012Assignee: Rohm and Haas Electronic Materials LLCInventors: Zukhra I. Niazimbetova, Elie H. Najjar, Maria Anna Rzeznik, Erik Reddington
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Patent number: 8268157Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.Type: GrantFiled: March 15, 2010Date of Patent: September 18, 2012Assignee: Rohm and Haas Electronic Materials LLCInventor: Zukhra I. Niazimbetova
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Patent number: 8262895Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain benzimidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.Type: GrantFiled: March 15, 2010Date of Patent: September 11, 2012Assignee: Rohm and Haas Electronic Materials LLCInventors: Zukhra I. Niazimbetova, Maria Anna Rzeznik
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Patent number: 8262891Abstract: Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit.Type: GrantFiled: October 2, 2006Date of Patent: September 11, 2012Assignee: Rohm and Haas Electronic Materials LLCInventors: Deyan Wang, Robert D. Mikkola, George G. Barclay
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Patent number: 8143324Abstract: The use of hindered phenol containing anti-oxidants enable arylcyclobutene-based formulations to be cured in oxygen containing environments such as air without unacceptable degradation in key properties of dielectric constant, water uptake, or transmittance.Type: GrantFiled: October 12, 2005Date of Patent: March 27, 2012Assignee: Dow Global Technologies LLCInventors: Ying Hung So, Edmund J. Stark, Jack E. Hetzner, Shellene K. Thurston
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Patent number: 8143360Abstract: The invention is a composition comprising a curable arylcyclobutene based oligomer or polymer and a dissolution inhibitor which comprises a compound comprising at least two diazonaphthoquinone (DNQ) moieties each of which is pendant from different phenyl groups.Type: GrantFiled: October 12, 2005Date of Patent: March 27, 2012Assignee: Dow Global Technologies LLCInventors: Ying Hung So, Edmund J. Stark, Shellene K. Thurston, Kayla J. Gallant (nee Baranck), Yongfu Li
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Patent number: 8142847Abstract: Compositions including an amido-group-containing vapor deposition precursor and a stabilizing additive are provided. Such compositions have improved thermal stability and increased volatility as compared to the amido-group-containing vapor deposition precursor itself. These compositions are useful in the deposition of thin films, such as by atomic layer deposition.Type: GrantFiled: March 3, 2008Date of Patent: March 27, 2012Assignee: Rohm and Haas Electronic Materials LLCInventors: Deodatta Vinayak Shenai-Khatkhate, Stephen J. Manzik, Qin-Min Wang
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Patent number: 8012883Abstract: Methods are provided for manufacturing optical display devices which remove an etch resist and residual post-etch metal in a single step. These methods are particularly useful in the manufacture of LCDs.Type: GrantFiled: August 29, 2007Date of Patent: September 6, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: Luis A. Gomez, Jason A. Reese
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Patent number: 8012536Abstract: Methods of forming metal-containing layers are provided where heteroleptic organometallic compounds containing at least one formamidinate ligand are conveyed in a gaseous form to a reactor; and films comprising a metal are deposited on a substrate. These heteroleptic organometallic compounds have improved properties over conventional vapor deposition precursors. Such compounds are suitable for use as vapor deposition precursors including direct liquid injection. Also provided are methods of depositing thin films, such as by ALD and CVD, using such compounds or their solutions in organic solvents.Type: GrantFiled: June 5, 2008Date of Patent: September 6, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: Deodatta Vinayak Shenai-Khatkhate, Huazhi Li, Qing Min Wang
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Patent number: 7989323Abstract: Methods of doping a III-V compound semiconductor film are disclosed.Type: GrantFiled: June 21, 2010Date of Patent: August 2, 2011Assignee: Rohm and Haas Electronic Materials LLCInventor: Deodatta Vinayak Shenai-Khatkhate
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Patent number: 7767840Abstract: Organometallic compounds suitable for use as vapor phase deposition precursors for Group IV metal-containing films are provided. Methods of depositing Group IV metal-containing films using certain organometallic precursors are also provided. Such Group IV metal-containing films are particularly useful in the manufacture of electronic devices.Type: GrantFiled: August 12, 2008Date of Patent: August 3, 2010Assignee: Rohm and Haas Electronic Materials LLCInventors: Deodatta Vinayak Shenai-Khatkhate, Michael Brendan Power
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Patent number: 7722720Abstract: Delivery devices for delivering solid precursor compounds in the vapor phase to reactors are provided. Such devices include a precursor composition of a solid precursor compound with a layer of packing material disposed thereon. Also provided are methods for transporting a carrier gas saturated with the precursor compound for delivery into such CVD reactors.Type: GrantFiled: December 6, 2005Date of Patent: May 25, 2010Assignee: Rohm and Haas Electronic Materials LLCInventors: Deodatta Vinayak Shenai-Khatkhate, Michael L. Timmons, Charles J. Marsman, Egbert Woelk, Ronald L. DiCarlo, Jr.
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Patent number: 7547631Abstract: Organometallic compounds containing a phosphoamidinate ligand are provided. Such compounds are particularly suitable for use as vapor deposition precursors. Also provided are methods of depositing thin films, such as by ALD and CVD, using such compounds.Type: GrantFiled: October 4, 2006Date of Patent: June 16, 2009Assignee: Rohm and Haas Electronic Materials LLCInventors: Deodatta Vinayak Shenai-Khatkhate, Qing Min Wang
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Patent number: 7531458Abstract: Organometallic compounds containing an electron donating group-substituted alkenyl ligand are provided. Such compounds are particularly suitable for use as vapor deposition precursors. Also provided are methods of depositing thin films, such as by ALD and CVD, using such compounds.Type: GrantFiled: September 29, 2006Date of Patent: May 12, 2009Assignee: Rohm and Haas Electronics Materials LLPInventors: Deodatta Vinayak Shenai-Khatkhate, Qing Min Wang
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Patent number: 7413942Abstract: Methods of forming T-gate structures on a substrate are provided that use only UV-sensitive photoresists. Such methods provide T-gate structures using two lithographic steps using a single wavelength of radiation.Type: GrantFiled: January 28, 2005Date of Patent: August 19, 2008Assignee: Rohm and Haas Electronic Materials LLCInventors: Rudy Pellens, Frank Linskens
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Patent number: 7413776Abstract: A method of depositing a Group IV metal-containing film on a substrate by conveying one or more of certain Group IV organometallic compounds in a gaseous phase to a deposition reactor containing a substrate and decomposing the one or more Group IV organometallic compounds to form a film of a Group IV metal on the substrate is provided. Such Group IV metal-containing films are particularly useful in the manufacture of electronic devices.Type: GrantFiled: April 2, 2004Date of Patent: August 19, 2008Assignee: Rohm and Haas Electronic Materials LLCInventors: Deodatta Vinayak Shenai-Khatkhate, Michael Brendan Power
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Patent number: 7390360Abstract: Compositions useful in the manufacture of compound semiconductors are provided. Methods of manufacturing compound semiconductors using these compositions are also provided.Type: GrantFiled: September 28, 2005Date of Patent: June 24, 2008Assignee: Rohm and Haas Electronic Materials LLCInventors: Deodatta Vinayak Shenai-Khatkhate, Egbert Woelk