Abstract: The invention is a process for device fabrication that utilizes shallow trench isolation. The process involves the steps of forming an oxidation barrier region, e.g., silicon nitride, above a silicon substrate, providing an opening in the oxidation barrier region and in any underlying regions deposited on the silicon, providing a trench in the silicon substrate at the opening, depositing a dielectric material such as silicon dioxide in the trench, typically planarizing the trench silicon dioxide, and subsequently performing an oxidation step. The oxidation step rounds the otherwise sharp corners of the silicon at the area where the trench silicon dioxide meets the pad oxide. The invention thereby reduces or eliminates sharp corners that contribute to leakage current.

Abstract: The present invention is a collection assembly comprising a container, a cap assembly removably and sealably secured to the container whereby access to the interior of the container can be made with a piercing element without removing the cap assembly from the container. The cap assembly includes a cap body and a membrane like septum supported by the cap body. The septum provides for a pierceable element to have access to the interior of the container. The membrane is a thermoplastic elastomer and is self-sealing upon removal of the piercing element.

Abstract: The invention involves fabricating a ceramic tube, e.g., a silica overcladding tube, with very little bow, e.g., about 0.3 mm per meter or less. In particular, the invention involves securing the tube by a handle that both allows the tube to hang plumb during treatment, and also is capable of deforming during such heat treatment to maintain the plumb arrangement.

Abstract: The present invention is a passively shieldable blood collection set. The blood collection set includes a needle cannula, a hub mounted to the needle cannula and a tip guard slidably movable along the needle cannula. The tip guard can be slid into a distal position where the tip of the needle cannula is safely shielded. A collapsible guard drive is mounted to the hub and includes a pair of collapsible leaves extending from the hub to the tip guard. The leaves have a length that enable the tip guard to move into shielding engagement around the tip of the needle cannula, while preventing complete removal of the tip guard from the needle cannula. The leaves are resiliently deformable and can be collapsed onto themselves and onto the hub. The leaves can be retained in their collapsed condition by a packaging cover and subsequently by the grip of a medical practitioner.

Abstract: The needle assembly of the present invention includes a transparent or translucent housing having a fluid inlet end defined by a cylindrical exterior wall. The wall delineates an annular flashback chamber within the housing for retention of a fluid sample therein. The wall further includes a transparent or translucent construction or assimilation of a sealed window or port therein to allow immediate visualization of a fluid in the chamber.

Abstract: The present invention is an additive preparation which contains an additive, an organic acid, a metal carbonate compound, and a surfactant agent which is capable of rendering the surface of a collection device to have properties that cause the surface to repel the adsorption of components of a body fluid sample. The preparation effervesces when in contact with a body fluid sample, thereby efficiently dispersing the additive and surfactant in a body fluid sample.

Abstract: A device and method is provided for separating components of a fluid sample. The device includes a plurality of constituents comprising a container, a liner in the container, a closure for the container and a composite element. The composite element is a seal plug with a density between the densities of the components of the fluid sample is releasably engaged with the container closure and with the liner. A needle cannula is used to deposit a fluid sample in the liner and the entire device is placed in a centrifuge. The centrifugal load causes the seal plug to separate from the closure and causes the liner to expand outwardly against the container. The seal plug migrates into the fluid sample and stabilizes between the densities of the components of the fluid sample. The liner will resiliently return to its initial configuration upon termination of centrifugal load such that the liner sealingly engages the seal plug and separates the components of the fluid sample.

Abstract: An additive formulation comprising heparinase and trehalose, a method for using the formulation and a device containing the formulation. The additive formulation is useful in substantially neutralizing residual heparin from a blood sample when used in a blood collection tube without interfering with the clinical analysis of the blood sample.

Abstract: A device and method is provided for separating heavier and lighter fractions of a fluid sample. The device includes a plurality of constituents. The constituents include a container, a liner in the container and a composite element in the liner for separating the fractions of a fluid sample. The separator comprises a specific density at a target density range as defined by separable fluid components densities. A fluid sample is delivered to the liner and then the device is subjected to centrifugation whereby the centrifugal load causes the liner to deform and the composite element migrates into the fluid sample and stabilizes between the heavier and lighter fractions of the fluid sample. The liner will resiliently return to its initial configuration upon termination of the centrifugal load such that the liner sealingly engages the composite element and separates the heavier and lighter fractions of the fluid sample.

Abstract: Transmission characteristics of an optical device 200, fabricated from multiple layers 16, 27, 28 of silica-based glass on a silicon substrate 26, are modified by localized thermal treatment. The beam 501 of a carbon-dioxide (CO2) laser 510 is used to selectively soften the core and/or cladding material of a waveguide structure during or after the fabrication process. In one application, softening relieves the strain developed between the waveguide structure and the silicon substrate and substantially reduces or eliminates birefringence. In a second application, the CO2 laser is operated at another power level in order to modify the index of refraction. Changes in the index of refraction change the speed of light through a waveguide thereby changing the phase shift associated with the waveguide. In a third application, the CO2 laser is operated at yet another power level to increase the transmission loss of the waveguide.

Abstract: The invention reflects a recognition that prior art templates for colloidal crystal formation do not provide the expected level of three-dimensional periodicity, and further provides a process using an improved template, by which extremely high-quality colloidal crystals are able to be formed. Specifically, the colloidal template of the invention is designed such that the colloidal particles are induced to settle into the desired locations, unlike in prior art templates, thereby settling in an ordered manner.

Abstract: A structure, e.g., a photonic band gap material, exhibiting substantial periodicity on a micron scale is provided. Fabrication involves the steps of providing a template comprising a colloidal crystal, placing the template in an electrolytic solution, electrochemically forming a lattice material, e.g., a high refractive index material, on the colloidal crystal, and then removing the colloidal crystal particles to form the desired structure. The electrodeposition provides a dense, uniform lattice, because formation of the lattice material begins near a conductive substrate, for example, and growth occurs substantially along a plane moving in a single direction, e.g., normal to the conductive substrate. Moreover, because the electrochemically grown lattice is a three-dimensionally interconnected solid, there is very little shrinkage upon subsequent treatment.

Abstract: A process for device fabrication, comprising the steps of forming a dielectric material region on a silicon substrate, forming a first amorphous silicon or polysilicon region on the dielectric material region, implanting one or more dopants in the first amorphous silicon or polysilicon region, and, subsequent to implanting the one or more dopants in the first amorphous silicon or polysilicon region, forming a second amorphous silicon or polysilicon region on the first amorphous silicon or polysilicon region. Typically, a refractory metal silicide layer is formed over the silicon, and such silicide is optionally formed by a salicide process. The second silicon region makes it more difficult for the implanted dopants to reach the silicide layer, and thereby reduces undesirable lateral diffusion of dopants in the silicide and accompanying cross-doping. The buried nature of the dopants in the silicon further reduces the amount of lateral diffusion within the silicon, regardless of the gate material.

Abstract: An improved process for forming devices utilizing patterned organic semiconductor films is provided. The process involves treating a surface to selectively provide regions of greater affinity and lesser affinity for an organic semiconductor or an organic semiconductor solution. When the organic semiconductor, or solution comprising the semiconductor, is deposited on the treated surface, either the organic semiconductor or the organic semiconductor solution dewets from the lesser affinity regions or the resultant film adheres only weakly to the lesser affinity regions such that selective removal is readily performed. And even where such removal is not performed, the portions of the organic semiconductor film overlying the greater affinity regions exhibit higher mobility and better film continuity relative to the other portions of the film.

Abstract: The invention relates to use of a solder composition exhibiting a desired combination of high creep resistance at typical operating temperatures and low stress in formed solder joints. The invention uses a solder containing 82 to 85 wt. % Au, 12 to 14 wt. % Sn, and 3 to 4 wt. % Ga (optionally with up to 2 wt. % additional elements). The small amount of added Ga induces a significant depression in the liquidus temperatures of both Au and Sn, and thus a depressed melting point (about 27° C. less than eutectic Au—Sn solder), and also provides an enhanced temperature-sensitivity of the solder's creep resistance.

Abstract: An improved lithographic process for fabricating articles comprising photonic band gap materials with micron-scale periodicities is provided, the process readily capable of being performed by current lithographic processes and equipment. The process involves providing a three-dimensional structure made up of a plurality of stacked layers, where each layer contains a substantially planar lattice of shapes of a first material, typically silicon, with interstices between the shapes. Each shape contacts at least one shape of an adjacent layer, the interstices throughout the plurality of layers are interconnected, and the interstices comprise a second material, e.g., silicon dioxide. Typically, the second material is etched from the interconnected interstices to provide a structure of the first material and air, this structure designed to provide a particular photonic band gap.

Abstract: The invention provides a device comprising an improved n-channel semiconducting film, the film formed from a fused-ring tetracarboxylic diimide compound which exhibits a field effect electron mobility greater than 0.001 cm2/Vs, advantageously greater than 0.03 cm2/Vs, in film form. Contemplated compounds include naphthalene 1,4,5,8, tetracarboxylic acid diimides, naphthalene 2,3,6,7 tetracarboxylic acid diimides, anthracene 2,3,6,7-tetracarboxylic acid diimides, and heterocyclic variants thereof. The n-channel compounds are capable of being significantly soluble in common organic solvents, allowing for solution deposition of active semiconductor films, and are also capable of possessing significant volatility, such that vapor phase deposition, where desired, is relatively facile. It is also possible for the compounds to display the desirably high n-channel mobilities and on/off ratios even when operated in air.

Abstract: The invention provides an improved point-of-use PFC/HFC abatement process involving an electrochemical route to abatement. PFCs/HFCs are treated with a relatively strong chemical reducing agent, typically an alkali such as lithium, potassium, or sodium, in a system that promotes ionization of the alkali, e.g., by inclusion of ammonia or other compound that promotes dissolution of the alkali to ions. The electrochemical potential arising from the ionization process provides sufficient energy to extract the fluorine atoms from the PFCs/HFCs. The system also contains a weak acid proton donor to provide a hydrogenation source. The weak acid is believed to displace the reaction equilibrium by protonation, to allow the reaction to proceed at a sufficient rate.

Abstract: A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.

Abstract: Ion beam deposition, using a carbon- and fluorine-containing source or sources, is used to form a fluorinated diamond-like carbon layer in a device, the FDLC layer exhibiting a dielectric constant of 3.0 or less along with a thermal stability of at least 400° C. During the ion beam deposition, due to the unique nature of carbon chemistry, the carbon atoms combine at the substrate surface to form all possible combinations of sp1, sp2 and sp3 bonds. However, ion beam etching occurs along with deposition, such that atoms of the weaker carbon structures—carbyne and graphite—are removed preferentially. This leads to a buildup of a diamond-like, sp3-bonded structure with fluorine atoms, it is believed, substituted for some carbon atoms within the structure, this structure providing the desirable properties of the layer.