Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.