Abstract: A material for forming contacts for use in connectors, switches and the like for electronic appliances. The material comprises a first metal layer having a conductivity, a second metal layer having a springiness and a plastic layer interposed between these metal layers. With this arrangement, the contacts according to the invention can be miniaturized to a far greater extent and far more inexpensively in comparison with prior art contacts made of copper alloys while maintaining the same current capacity and contact pressure. Moreover, the contacts according to the invention can eliminate disadvantages of prior art contacts made of two directly contacted metals, such as separation between them and elongation due to difference in coefficient of thermal expansion, deterioration of the contacts due to diffusion therebetween, and disintegration of the contacts due to electrochemical corrosion resulting from difference in electric potential between two metals.